12 results about "Bond quality" patented technology

The invention relates to the technical field of detection, in particular to a bonding quality real-time detection system and method, and the system comprises a bonding platform which is independently and fixedly arranged; the bonding platform is provided with a fixing clamp for fixing a workpiece and a displacement mechanism for driving the fixing clamp to move; the bonding arm is located above the bonding platform and moves up and down; a bonding chopper is arranged at the tail end of the bonding arm; the line laser scanning unit is fixed above the bonding platform and is used for carrying out three-dimensional contour scanning on the workpiece and the welding spot; the motion control system comprises a servo motor and a grating ruler and is used for driving the bonding arm, the displacement mechanism and the line laser scanning unit; and the processor is electrically connected with the bonding arm, the linear laser scanning unit, the motion control system and the displacement mechanism, and is used for controlling the action of each component, acquiring three-dimensional contour scanning data of the workpiece and the welding spot in real time, and calculating a detection result according to the acquired data. According to the method, the quality of the bonding points can be judged based on the multi-dimensional features in the bonding process.

The utility model discloses a laminating device, and belongs to the field of laminated glass. Comprising a rack, a horizontal top plate is fixed to one end of the upper end face of the rack through a vertical side plate, a base is fixed to the middle of the upper end face of the rack, a storage plate is arranged on the upper end face of the base, a movable plate elastically installed in the base is fixed to the bottom of the storage plate, and a plurality of limiting clamping arms are symmetrically installed on the two sides of the base; the bottoms of the limiting clamping arms are horizontally inserted into the top of the base and hinged to connecting rods, and the multiple connecting rods are movably installed on the two sides of the upper end face of the movable plate respectively. A movable seat capable of horizontally sliding is installed on the lower end face of the top plate, an air cylinder is fixed to the lower end face of the movable seat, a crankshaft of the air cylinder is vertically downward and is fixedly provided with a fixing frame, and a pressing roller is installed at the bottom of the fixing frame. According to the laminating device, two pieces of glass can be quickly positioned and laminated and extruded, the overall operation is simple, the laminating efficiency of laminated glass is high, the laminating quality can be ensured, and the use effect is good.

The application discloses a kind of based on big data processing's insulation board bonding quality evaluation method, comprising the following steps: obtaining outer wall thermal insulation construction process data and bonding quality detection data, generate construction event record set;Based on construction event record set, generate construction event vector set;Based on construction event vector set, generate construction evolution state vector set and construct construction evolution state diagram;To outer wall surface executes spatial partition processing, constructs observation context set, generates query node set;Perform quality priori adjustment calculation, construct TabPFN model priori distribution structure;Based on observation context set, query node set and TabPFN model priori distribution structure, generate wall surface bonding quality spatial distribution field;Based on wall surface bonding quality spatial distribution field, generate insulation board bonding quality evaluation result.The application can realize the spatialization accurate evaluation of outer wall bonding quality.

The invention provides a bonding quality detection method and system, and the method comprises the steps: determining a defect detection parameter of each detection point according to a first ultrasonic signal corresponding to each detection point of a to-be-detected bonding piece; and according to the second ultrasonic signal corresponding to the at least part of the detection section of the detected bonding piece, determining a bonding strength predicted value of the at least part of the detection section. According to the embodiment of the invention, comprehensive evaluation of the bonding quality can be realized.

The utility model discloses a holographic anti-counterfeiting film high-precision positioning and laminating mechanism, which relates to the technical field of anti-counterfeiting film laminating, and comprises a base platform and a temperature compensation laminating mechanism, the top of the base platform is fixedly connected with the temperature compensation laminating mechanism, and the temperature compensation laminating mechanism is fixedly connected with the base platform. The temperature compensation attaching mechanism comprises a fixing frame fixedly connected to the top of the base platform, a guide roller is arranged on one side of the fixing frame, multiple sets of heating wires are fixedly connected into the guide roller, a heat-conducting medium is arranged on the outer surface of the guide roller, the base platform is made of high-strength aluminum alloy, the surface of the base platform is subjected to fine machining, and the temperature compensation attaching mechanism is arranged on the base platform. The base platform is used for bearing a to-be-laminated product and installing other functional parts. Compared with an existing common positioning and laminating mechanism, the high-precision positioning and laminating mechanism for the holographic anti-counterfeiting film has the advantages that the problems of inaccurate positioning, poor laminating quality, low production efficiency and the like in the prior art are solved, high-precision and high-quality laminating of the holographic anti-counterfeiting film and a product is realized, and the anti-counterfeiting effect and the production efficiency are improved.

The invention provides a cement sheath second interface cementation quality evaluation method and system, and relates to the field of well cementation, and the control method comprises the steps: determining an evaluation reference value of a reference depth point of a cement sheath based on post-casing imaging logging data of the cement sheath; then determining an evaluation depth section of the cement sheath, and performing cementation evaluation on each evaluation direction of each evaluation depth point of the evaluation depth section in the circumferential direction of the cement sheath by using the evaluation reference value and post-casing imaging logging data to obtain a direction evaluation result; and obtaining a cement sheath second interface orientation cementation imaging graph based on all orientation evaluation results, and evaluating the cement sheath second interface cementation quality by using the cement sheath second interface orientation cementation imaging graph. According to the cement sheath second interface cementation quality evaluation method provided by the invention, cementation quality evaluation can be carried out on the cement sheath second interface at different depths and different directions, and cementation imaging of the second interface is realized.

The invention relates to the technical field of microelectronic packaging, in particular to an acoustic emission online evaluation method and system for copper sheet bonding strength, and the method comprises the steps: arranging a three-dimensional acoustic emission sensing array at a copper sheet bonding station, collecting a multi-dimensional acoustic emission signal in a bonding process, and extracting features of each stage for standardization processing; establishing a bonding strength evaluation model by adopting a transfer learning strategy, determining the bonding quality stability by calculating the bonding quality volatility, and adjusting the bonding pressure according to the bonding quality stability; according to the method, by optimizing the bonding pressure parameter, the purpose of minimizing the standard deviation of the overall bonding strength of the bonding area is achieved, and the stability and reliability of the bonding quality are improved; the system is arranged in a non-contact mode, interference-free monitoring of the bonding process is achieved, the influence of a sensor on the bonding process is avoided, meanwhile, comprehensiveness and accuracy of signal collection are improved, and an effective bonding strength evaluation method is provided in the field of microelectronic packaging.

The invention discloses a method and a system for monitoring interlayer combination quality of layered pouring and tamping of concrete. The method comprises the following steps: calculating a time interval of pouring of upper and lower adjacent layers of concrete, and a distribution point position and a distribution area of the next layer of concrete; evaluating the interlayer bonding quality according to the time interval, the material distribution point position and the material distribution area, and if it is judged that the next layer of concrete completely covers the upper layer of concrete according to the material distribution point position and the material distribution area and the time interval is not larger than the initial setting time of the next concrete, no cold seam is generated between the upper and lower adjacent layers of concrete, and the interlayer bonding quality is high. According to the method, the time information (the time interval of the upper and lower adjacent pouring layers) and the space information (the pouring position and the pouring area) of the pouring layers can be objectively and accurately monitored in real time, so that whether a cold seam is generated between the adjacent layers or not is accurately judged, and the interlayer bonding quality is evaluated.

The utility model belongs to the technical field of packaging material bonding equipment, and particularly relates to an ironing board bonding machine which comprises a rack, a feeding mechanism, a material taking mechanism and an ironing board, the number of the feeding mechanisms is two, and each feeding mechanism comprises a feeding plate moving on the rack and a first transverse moving assembly driving the feeding plate to move. The material taking mechanism comprises a material taking assembly movably arranged on the rack, a second transverse moving assembly for driving the material taking assembly to move and a second lifting assembly for driving the material taking assembly to move, and the material taking mechanism is located between the two feeding mechanisms; the ironing plate is located below the material taking mechanism. Two different packaging materials are placed on the feeding mechanisms on the two sides respectively and located respectively, the material taking mechanism takes one packaging material, the packaging material is heated and melted on the ironing plate, then the packaging material is bonded to the other packaging material, the mode that the two packaging materials are located respectively, and the material taking mechanism controls the packaging materials accurately is adopted, and therefore the packaging materials can be taken out conveniently. Precise alignment of the two packaging materials can be guaranteed, and the bonding quality is improved.

The application relates to the technical field of detection, in particular to a bonding quality real-time detection system and method. The system comprises a bonding platform which is independently fixedly arranged; a fixing clamp for fixing a workpiece is arranged on the bonding platform, and a displacement mechanism for driving the fixing clamp to move is arranged on the bonding platform; a bonding arm is arranged above the bonding platform and moves up and down; a bonding wedge is arranged at the tail end of the bonding arm; a line laser scanning unit is fixed above the bonding platform and is used for performing three-dimensional contour scanning on the workpiece and a welding point; a motion control system comprises a servo motor and a grating ruler and is used for driving the bonding arm, the displacement mechanism and the line laser scanning unit; a processor is electrically connected with the bonding arm, the line laser scanning unit, the motion control system and the displacement mechanism, is used for controlling the actions of the components, collecting three-dimensional contour scanning data of the workpiece and the welding point in real time, and calculating a detection result according to the collected data. The application can judge the quality of a bonding point based on multi-dimensional features during the bonding process.

The present invention discloses a method and system for optimizing alloy bonding process parameters, which relates to the field of data processing technology, including presetting a target microstructure state and constructing an evaluation index system; obtaining actual microstructure data of the bonding interface during the alloy bonding process, and marking key evolution features to determine the diffusion layer thickness and grain size distribution; establishing a relationship model between process parameters and microstructure by comparing the actual microstructure data with the target microstructure state, and completing a first prediction; analyzing the dynamic characteristics of the diffusion layer through the results of the first prediction, and completing a second prediction in combination with the thermal-diffusion threshold; and deriving an optimal process parameter combination through the results of the second prediction to achieve the target microstructure state. The present invention effectively solves problems such as target ambiguity and insufficient model accuracy, significantly improves bonding quality and stability, reduces scrap rate and cost, and provides an innovative solution for high-performance material processing.

This invention relates to an intelligent quality control method for waterproof zipper film based on dynamic bonding parameter optimization, aiming to solve key problems such as noise interference from micro-pressure and displacement signals, asynchronous sensor timing, and batch-to-batch material differences leading to bonding quality fluctuations. The method integrates an ultra-thin flexible strain sensor array and a microstructure optical interference unit to acquire and denoise multimodal transient mechanical response data in real time. Combined with characteristic parameters such as initial contact stiffness slope, maximum deformation parameter, unloading rebound rate, and residual creep duration, a unique memory fingerprint identifying the material's deformation characteristics is generated. Furthermore, a neural network is used to establish a nonlinear mapping between the deformation memory fingerprint and the main bonding quality control indicators, enabling real-time quality monitoring and adaptive parameter correction during the bonding process. This technology improves bonding consistency and material adaptability, effectively eliminates the impact of environmental and equipment differences on process stability, and is applicable to the field of intelligent bonding of new materials.