6 results about "Bond quality" patented technology

The invention relates to the technical field of detection, in particular to a bonding quality real-time detection system and method, and the system comprises a bonding platform which is independently and fixedly arranged; the bonding platform is provided with a fixing clamp for fixing a workpiece and a displacement mechanism for driving the fixing clamp to move; the bonding arm is located above the bonding platform and moves up and down; a bonding chopper is arranged at the tail end of the bonding arm; the line laser scanning unit is fixed above the bonding platform and is used for carrying out three-dimensional contour scanning on the workpiece and the welding spot; the motion control system comprises a servo motor and a grating ruler and is used for driving the bonding arm, the displacement mechanism and the line laser scanning unit; and the processor is electrically connected with the bonding arm, the linear laser scanning unit, the motion control system and the displacement mechanism, and is used for controlling the action of each component, acquiring three-dimensional contour scanning data of the workpiece and the welding spot in real time, and calculating a detection result according to the acquired data. According to the method, the quality of the bonding points can be judged based on the multi-dimensional features in the bonding process.

The application discloses a kind of based on big data processing's insulation board bonding quality evaluation method, comprising the following steps: obtaining outer wall thermal insulation construction process data and bonding quality detection data, generate construction event record set;Based on construction event record set, generate construction event vector set;Based on construction event vector set, generate construction evolution state vector set and construct construction evolution state diagram;To outer wall surface executes spatial partition processing, constructs observation context set, generates query node set;Perform quality priori adjustment calculation, construct TabPFN model priori distribution structure;Based on observation context set, query node set and TabPFN model priori distribution structure, generate wall surface bonding quality spatial distribution field;Based on wall surface bonding quality spatial distribution field, generate insulation board bonding quality evaluation result.The application can realize the spatialization accurate evaluation of outer wall bonding quality.

The invention provides a bonding quality detection method and system, and the method comprises the steps: determining a defect detection parameter of each detection point according to a first ultrasonic signal corresponding to each detection point of a to-be-detected bonding piece; and according to the second ultrasonic signal corresponding to the at least part of the detection section of the detected bonding piece, determining a bonding strength predicted value of the at least part of the detection section. According to the embodiment of the invention, comprehensive evaluation of the bonding quality can be realized.

The utility model discloses a holographic anti-counterfeiting film high-precision positioning and laminating mechanism, which relates to the technical field of anti-counterfeiting film laminating, and comprises a base platform and a temperature compensation laminating mechanism, the top of the base platform is fixedly connected with the temperature compensation laminating mechanism, and the temperature compensation laminating mechanism is fixedly connected with the base platform. The temperature compensation attaching mechanism comprises a fixing frame fixedly connected to the top of the base platform, a guide roller is arranged on one side of the fixing frame, multiple sets of heating wires are fixedly connected into the guide roller, a heat-conducting medium is arranged on the outer surface of the guide roller, the base platform is made of high-strength aluminum alloy, the surface of the base platform is subjected to fine machining, and the temperature compensation attaching mechanism is arranged on the base platform. The base platform is used for bearing a to-be-laminated product and installing other functional parts. Compared with an existing common positioning and laminating mechanism, the high-precision positioning and laminating mechanism for the holographic anti-counterfeiting film has the advantages that the problems of inaccurate positioning, poor laminating quality, low production efficiency and the like in the prior art are solved, high-precision and high-quality laminating of the holographic anti-counterfeiting film and a product is realized, and the anti-counterfeiting effect and the production efficiency are improved.

The application relates to the technical field of detection, in particular to a bonding quality real-time detection system and method. The system comprises a bonding platform which is independently fixedly arranged; a fixing clamp for fixing a workpiece is arranged on the bonding platform, and a displacement mechanism for driving the fixing clamp to move is arranged on the bonding platform; a bonding arm is arranged above the bonding platform and moves up and down; a bonding wedge is arranged at the tail end of the bonding arm; a line laser scanning unit is fixed above the bonding platform and is used for performing three-dimensional contour scanning on the workpiece and a welding point; a motion control system comprises a servo motor and a grating ruler and is used for driving the bonding arm, the displacement mechanism and the line laser scanning unit; a processor is electrically connected with the bonding arm, the line laser scanning unit, the motion control system and the displacement mechanism, is used for controlling the actions of the components, collecting three-dimensional contour scanning data of the workpiece and the welding point in real time, and calculating a detection result according to the collected data. The application can judge the quality of a bonding point based on multi-dimensional features during the bonding process.

This invention relates to an intelligent quality control method for waterproof zipper film based on dynamic bonding parameter optimization, aiming to solve key problems such as noise interference from micro-pressure and displacement signals, asynchronous sensor timing, and batch-to-batch material differences leading to bonding quality fluctuations. The method integrates an ultra-thin flexible strain sensor array and a microstructure optical interference unit to acquire and denoise multimodal transient mechanical response data in real time. Combined with characteristic parameters such as initial contact stiffness slope, maximum deformation parameter, unloading rebound rate, and residual creep duration, a unique memory fingerprint identifying the material's deformation characteristics is generated. Furthermore, a neural network is used to establish a nonlinear mapping between the deformation memory fingerprint and the main bonding quality control indicators, enabling real-time quality monitoring and adaptive parameter correction during the bonding process. This technology improves bonding consistency and material adaptability, effectively eliminates the impact of environmental and equipment differences on process stability, and is applicable to the field of intelligent bonding of new materials.