3 results about "Bond quality" patented technology

The application discloses a kind of based on big data processing's insulation board bonding quality evaluation method, comprising the following steps: obtaining outer wall thermal insulation construction process data and bonding quality detection data, generate construction event record set;Based on construction event record set, generate construction event vector set;Based on construction event vector set, generate construction evolution state vector set and construct construction evolution state diagram;To outer wall surface executes spatial partition processing, constructs observation context set, generates query node set;Perform quality priori adjustment calculation, construct TabPFN model priori distribution structure;Based on observation context set, query node set and TabPFN model priori distribution structure, generate wall surface bonding quality spatial distribution field;Based on wall surface bonding quality spatial distribution field, generate insulation board bonding quality evaluation result.The application can realize the spatialization accurate evaluation of outer wall bonding quality.

The application relates to the technical field of detection, in particular to a bonding quality real-time detection system and method. The system comprises a bonding platform which is independently fixedly arranged; a fixing clamp for fixing a workpiece is arranged on the bonding platform, and a displacement mechanism for driving the fixing clamp to move is arranged on the bonding platform; a bonding arm is arranged above the bonding platform and moves up and down; a bonding wedge is arranged at the tail end of the bonding arm; a line laser scanning unit is fixed above the bonding platform and is used for performing three-dimensional contour scanning on the workpiece and a welding point; a motion control system comprises a servo motor and a grating ruler and is used for driving the bonding arm, the displacement mechanism and the line laser scanning unit; a processor is electrically connected with the bonding arm, the line laser scanning unit, the motion control system and the displacement mechanism, is used for controlling the actions of the components, collecting three-dimensional contour scanning data of the workpiece and the welding point in real time, and calculating a detection result according to the collected data. The application can judge the quality of a bonding point based on multi-dimensional features during the bonding process.

This invention relates to an intelligent quality control method for waterproof zipper film based on dynamic bonding parameter optimization, aiming to solve key problems such as noise interference from micro-pressure and displacement signals, asynchronous sensor timing, and batch-to-batch material differences leading to bonding quality fluctuations. The method integrates an ultra-thin flexible strain sensor array and a microstructure optical interference unit to acquire and denoise multimodal transient mechanical response data in real time. Combined with characteristic parameters such as initial contact stiffness slope, maximum deformation parameter, unloading rebound rate, and residual creep duration, a unique memory fingerprint identifying the material's deformation characteristics is generated. Furthermore, a neural network is used to establish a nonlinear mapping between the deformation memory fingerprint and the main bonding quality control indicators, enabling real-time quality monitoring and adaptive parameter correction during the bonding process. This technology improves bonding consistency and material adaptability, effectively eliminates the impact of environmental and equipment differences on process stability, and is applicable to the field of intelligent bonding of new materials.