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20 results about "Bond quality" patented technology
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Method For Joining Metal Materials And Controlling Bonding Quality Thereof
ActiveUS20250073807A1Welding/soldering/cutting articlesResistance welding apparatusBond qualityPhysical chemistry
The method comprises applying a spot load to a joint part between a first metal material and a second metal material in a state where sites to form the joint part are superposed on each other. When a total thickness of the first metal material and the second metal material at the joint part before bonding is defined as T0 mm, the total thickness thereof after bonding is defined as T1 mm, and T0 / T1=R is defined as a reduction ratio, the reduction ratio R is 1.4 or more.
Owner:TOYAMA PREFECTURE
Method for joining metal materials and controlling bonding quality thereof
The method comprises applying a spot load to a joint part between a first metal material and a second metal material in a state where sites to form the joint part are superposed on each other. When a total thickness of the first metal material and the second metal material at the joint part before bonding is defined as T0 mm, the total thickness thereof after bonding is defined as T1 mm, and T0 / T1=R is defined as a reduction ratio, the reduction ratio R is 1.4 or more.
Owner:TOYAMA PREFECTURE
Laminating device
PCT designated stage expiredWO2025094708A1Other printing apparatusArticle deliveryBond qualityMechanical engineering
Provided is a means for suppressing a deterioration in bonding quality. A control unit 90 of a laminating device 1 starts driving of a lamination roller 50 when a tip end P of a first member 101 reaches a drive start position Q. If a conveying operation (S115) causes the tip end P of the first member 101 to reach the drive start position Q before the first member 101 reaches the next recording position (S114: No), instead of the conveying operation, the control unit 90 causes a first conveying roller 41 to execute a first divided conveying operation for performing: first conveying (S116) for conveying the first member 101 until the tip end P reaches the drive start position Q, and then stopping the conveying; and second conveying (S117) for conveying the first member 101 from the position at which the tip end P reached the drive start position Q to the next recording position, and then stopping the conveying.
Owner:BROTHER KOGYO KK
Bonding quality real-time detection system and method
The invention relates to the technical field of detection, in particular to a bonding quality real-time detection system and method, and the system comprises a bonding platform which is independently and fixedly arranged; the bonding platform is provided with a fixing clamp for fixing a workpiece and a displacement mechanism for driving the fixing clamp to move; the bonding arm is located above the bonding platform and moves up and down; a bonding chopper is arranged at the tail end of the bonding arm; the line laser scanning unit is fixed above the bonding platform and is used for carrying out three-dimensional contour scanning on the workpiece and the welding spot; the motion control system comprises a servo motor and a grating ruler and is used for driving the bonding arm, the displacement mechanism and the line laser scanning unit; and the processor is electrically connected with the bonding arm, the linear laser scanning unit, the motion control system and the displacement mechanism, and is used for controlling the action of each component, acquiring three-dimensional contour scanning data of the workpiece and the welding spot in real time, and calculating a detection result according to the acquired data. According to the method, the quality of the bonding points can be judged based on the multi-dimensional features in the bonding process.
Owner:JIANGSU SHENCUANG TECH CO LTD
Laminating device
The utility model discloses a laminating device, and belongs to the field of laminated glass. Comprising a rack, a horizontal top plate is fixed to one end of the upper end face of the rack through a vertical side plate, a base is fixed to the middle of the upper end face of the rack, a storage plate is arranged on the upper end face of the base, a movable plate elastically installed in the base is fixed to the bottom of the storage plate, and a plurality of limiting clamping arms are symmetrically installed on the two sides of the base; the bottoms of the limiting clamping arms are horizontally inserted into the top of the base and hinged to connecting rods, and the multiple connecting rods are movably installed on the two sides of the upper end face of the movable plate respectively. A movable seat capable of horizontally sliding is installed on the lower end face of the top plate, an air cylinder is fixed to the lower end face of the movable seat, a crankshaft of the air cylinder is vertically downward and is fixedly provided with a fixing frame, and a pressing roller is installed at the bottom of the fixing frame. According to the laminating device, two pieces of glass can be quickly positioned and laminated and extruded, the overall operation is simple, the laminating efficiency of laminated glass is high, the laminating quality can be ensured, and the use effect is good.
Owner:ANHUI DAXIN GLASS PRODUCTS CO LTD
Znal eutectoid alloy bonding material, bonded body, and method for manufacturing bonded body
An objective of the present invention is to provide: a ZnAl eutectoid alloy bonding material that is capable of solving one or both of the problems of achieving improved physical characteristics as a bonding material and improving bond quality pertaining to a bonded body; a bonded body formed by using the ZnAl eutectoid alloy bonding material; and a method for manufacturing the bonded body. The ZnAl eutectoid alloy bonding material of the present invention contains a ZnAl eutectoid alloy having Zn and Al as basic compositions, the ZnAl eutectoid alloy bonding material being characterized by containing 25-28 mass% of Al, the balance being Zn and inevitable impurities.
Owner:KAGOSHIMA UNIV +1
A method for evaluating the bonding quality of insulation boards based on big data processing
The application discloses a kind of based on big data processing's insulation board bonding quality evaluation method, comprising the following steps: obtaining outer wall thermal insulation construction process data and bonding quality detection data, generate construction event record set;Based on construction event record set, generate construction event vector set;Based on construction event vector set, generate construction evolution state vector set and construct construction evolution state diagram;To outer wall surface executes spatial partition processing, constructs observation context set, generates query node set;Perform quality priori adjustment calculation, construct TabPFN model priori distribution structure;Based on observation context set, query node set and TabPFN model priori distribution structure, generate wall surface bonding quality spatial distribution field;Based on wall surface bonding quality spatial distribution field, generate insulation board bonding quality evaluation result.The application can realize the spatialization accurate evaluation of outer wall bonding quality.
Owner:QINGDAO ORIENTAL SUPERVISION CO LTD
Bonding quality detection method and system
PendingCN121805412AAnalysing solids using sonic/ultrasonic/infrasonic wavesProcessing detected response signalBond qualityMechanical engineering
The invention provides a bonding quality detection method and system, and the method comprises the steps: determining a defect detection parameter of each detection point according to a first ultrasonic signal corresponding to each detection point of a to-be-detected bonding piece; and according to the second ultrasonic signal corresponding to the at least part of the detection section of the detected bonding piece, determining a bonding strength predicted value of the at least part of the detection section. According to the embodiment of the invention, comprehensive evaluation of the bonding quality can be realized.
Owner:CHONGQING JINKANG NEW ENERGY VEHICLE CO LTD
Method and system for evaluating the sealing capability of cement sheath in combined bond quality sections
The present invention provides a method and system for evaluating the isolation capacity of cement sheaths in sections with varying cement quality combinations. This method, based on statistical experimental parameters and an established comprehensive simulation experimental device, conducts simulated logging experiments using different environmental data as test conditions for cement sheaths with all wellbore and wellbore parameters in a cementing parameter database. Based on the experimental data, a relationship between the isolation capacity of cement sheaths for different sealing section lengths and cementing quality conditions is fitted. The actual cementing sections are then segmented according to the cementing acoustic amplitude curve, resulting in accurate cement sheath isolation capacity data for sections with varying cement quality combinations. This approach overcomes the limitations of existing isolation capacity testing techniques, enabling comprehensive cement sheath isolation performance evaluation using a concise calculation strategy, providing technical guidance and optimization support for the formulation of oil and gas well development plans.
Owner:CHINA PETROLEUM & CHEMICAL CORP +1
Process optimization method and system for realizing bonding of silver wires
InactiveCN119626909AImprove assessment accuracySemiconductor/solid-state device detailsSolid-state devicesBond qualityQuality data
The invention relates to the technical field of silver wire bonding, and discloses a process optimization method and system for realizing silver wire bonding, and the method comprises the steps: analyzing the material bonding attribute of a silver wire preparation material in the preparation process; calculating a loss coefficient corresponding to the silver wire bonding equipment, and evaluating the bonding performance corresponding to the silver wire bonding equipment; collecting a silver wire working condition parameter corresponding to the bonding silver wire in each process of the bonding process, and calculating the bonding precision corresponding to the bonding silver wire; carrying out product sampling treatment on the bonding silver wire in each process of the bonding process to obtain a process bonding sample, carrying out quality evaluation on the process bonding sample to obtain multi-dimensional quality data, and evaluating the process bonding quality corresponding to the bonding process; and in combination with material bonding properties, bonding precision, bonding performance and process bonding quality, carrying out process optimization treatment on the bonded silver wire to obtain an optimization result. The invention mainly aims to solve the problem of low optimization efficiency of a bonding silver wire process.
Owner:SHENZHEN SHENGCHENG PRECISION CO LTD
High-precision positioning and laminating mechanism for holographic anti-counterfeiting film
The utility model discloses a holographic anti-counterfeiting film high-precision positioning and laminating mechanism, which relates to the technical field of anti-counterfeiting film laminating, and comprises a base platform and a temperature compensation laminating mechanism, the top of the base platform is fixedly connected with the temperature compensation laminating mechanism, and the temperature compensation laminating mechanism is fixedly connected with the base platform. The temperature compensation attaching mechanism comprises a fixing frame fixedly connected to the top of the base platform, a guide roller is arranged on one side of the fixing frame, multiple sets of heating wires are fixedly connected into the guide roller, a heat-conducting medium is arranged on the outer surface of the guide roller, the base platform is made of high-strength aluminum alloy, the surface of the base platform is subjected to fine machining, and the temperature compensation attaching mechanism is arranged on the base platform. The base platform is used for bearing a to-be-laminated product and installing other functional parts. Compared with an existing common positioning and laminating mechanism, the high-precision positioning and laminating mechanism for the holographic anti-counterfeiting film has the advantages that the problems of inaccurate positioning, poor laminating quality, low production efficiency and the like in the prior art are solved, high-precision and high-quality laminating of the holographic anti-counterfeiting film and a product is realized, and the anti-counterfeiting effect and the production efficiency are improved.
Owner:SHENZHEN XINGFULI ENTERPRISE LTD
Packaging paper aluminum layer bonding quality detection device
ActiveCN222618471UQuick checkImprove detection efficiencyUsing mechanical meansMaterial analysisBond qualityMaterials science
Owner:CHANGDE FURONG INDAL DEV
Method and system for evaluating cementation quality of second interface of cement sheath
The invention provides a cement sheath second interface cementation quality evaluation method and system, and relates to the field of well cementation, and the control method comprises the steps: determining an evaluation reference value of a reference depth point of a cement sheath based on post-casing imaging logging data of the cement sheath; then determining an evaluation depth section of the cement sheath, and performing cementation evaluation on each evaluation direction of each evaluation depth point of the evaluation depth section in the circumferential direction of the cement sheath by using the evaluation reference value and post-casing imaging logging data to obtain a direction evaluation result; and obtaining a cement sheath second interface orientation cementation imaging graph based on all orientation evaluation results, and evaluating the cement sheath second interface cementation quality by using the cement sheath second interface orientation cementation imaging graph. According to the cement sheath second interface cementation quality evaluation method provided by the invention, cementation quality evaluation can be carried out on the cement sheath second interface at different depths and different directions, and cementation imaging of the second interface is realized.
Owner:PETROCHINA CO LTD
Acoustic emission online evaluation method and system for bonding strength of copper sheet
InactiveCN120741645AMaterial analysis using acoustic emission techniquesProcessing detected response signalAcoustic emissionBond quality
The invention relates to the technical field of microelectronic packaging, in particular to an acoustic emission online evaluation method and system for copper sheet bonding strength, and the method comprises the steps: arranging a three-dimensional acoustic emission sensing array at a copper sheet bonding station, collecting a multi-dimensional acoustic emission signal in a bonding process, and extracting features of each stage for standardization processing; establishing a bonding strength evaluation model by adopting a transfer learning strategy, determining the bonding quality stability by calculating the bonding quality volatility, and adjusting the bonding pressure according to the bonding quality stability; according to the method, by optimizing the bonding pressure parameter, the purpose of minimizing the standard deviation of the overall bonding strength of the bonding area is achieved, and the stability and reliability of the bonding quality are improved; the system is arranged in a non-contact mode, interference-free monitoring of the bonding process is achieved, the influence of a sensor on the bonding process is avoided, meanwhile, comprehensiveness and accuracy of signal collection are improved, and an effective bonding strength evaluation method is provided in the field of microelectronic packaging.
Owner:DONGGUAN PINGJINGSEMI TECH CO LTD
Ultrasonic junction evaluation method
To provide an ultrasonic junction evaluation method capable of performing quality determination of a bonding place with high accuracy.SOLUTION: In a step ST11, a supersonic oscillation operation is executed to a plurality of bonding places, and a bonding processing time of each of bonding places is measured. In a step ST12, a processing time of the supersonic oscillation operation against to the plurality of bonding places is recognized as a plurality of bonding processing times. In a step ST13, a bonding quality result in each of the plurality of bonding places is obtained on the basis of a comparison result of a bonding processing time and a reference processing time of the plurality of bonding places. Concretely, in the plurality of bonding places, a bonding place that the bonding processing time is a reference processing time or less is determined as a "good", and the bonding place in the case where the bonding processing time is longer than the reference processing time is determined as a "fail".SELECTED DRAWING: Figure 8
Owner:TMEIC CORP (100 00)
Method and system for monitoring interlayer combination quality of layered pouring and tamping of concrete
PendingCN121032305AColor/spectral properties measurementsMaterial testing goodsBond qualityArchitectural engineering
The invention discloses a method and a system for monitoring interlayer combination quality of layered pouring and tamping of concrete. The method comprises the following steps: calculating a time interval of pouring of upper and lower adjacent layers of concrete, and a distribution point position and a distribution area of the next layer of concrete; evaluating the interlayer bonding quality according to the time interval, the material distribution point position and the material distribution area, and if it is judged that the next layer of concrete completely covers the upper layer of concrete according to the material distribution point position and the material distribution area and the time interval is not larger than the initial setting time of the next concrete, no cold seam is generated between the upper and lower adjacent layers of concrete, and the interlayer bonding quality is high. According to the method, the time information (the time interval of the upper and lower adjacent pouring layers) and the space information (the pouring position and the pouring area) of the pouring layers can be objectively and accurately monitored in real time, so that whether a cold seam is generated between the adjacent layers or not is accurately judged, and the interlayer bonding quality is evaluated.
Owner:THE THIRD ENG CO LTD OF CCCC FOURTH HARBOR ENG +2
Ironing plate gluing machine
The utility model belongs to the technical field of packaging material bonding equipment, and particularly relates to an ironing board bonding machine which comprises a rack, a feeding mechanism, a material taking mechanism and an ironing board, the number of the feeding mechanisms is two, and each feeding mechanism comprises a feeding plate moving on the rack and a first transverse moving assembly driving the feeding plate to move. The material taking mechanism comprises a material taking assembly movably arranged on the rack, a second transverse moving assembly for driving the material taking assembly to move and a second lifting assembly for driving the material taking assembly to move, and the material taking mechanism is located between the two feeding mechanisms; the ironing plate is located below the material taking mechanism. Two different packaging materials are placed on the feeding mechanisms on the two sides respectively and located respectively, the material taking mechanism takes one packaging material, the packaging material is heated and melted on the ironing plate, then the packaging material is bonded to the other packaging material, the mode that the two packaging materials are located respectively, and the material taking mechanism controls the packaging materials accurately is adopted, and therefore the packaging materials can be taken out conveniently. Precise alignment of the two packaging materials can be guaranteed, and the bonding quality is improved.
Owner:GUANGDONG QIANBAO XINYUAN INTELLIGENT MASCH CO LTD
A system and method for real-time detection of bond quality
The application relates to the technical field of detection, in particular to a bonding quality real-time detection system and method. The system comprises a bonding platform which is independently fixedly arranged; a fixing clamp for fixing a workpiece is arranged on the bonding platform, and a displacement mechanism for driving the fixing clamp to move is arranged on the bonding platform; a bonding arm is arranged above the bonding platform and moves up and down; a bonding wedge is arranged at the tail end of the bonding arm; a line laser scanning unit is fixed above the bonding platform and is used for performing three-dimensional contour scanning on the workpiece and a welding point; a motion control system comprises a servo motor and a grating ruler and is used for driving the bonding arm, the displacement mechanism and the line laser scanning unit; a processor is electrically connected with the bonding arm, the line laser scanning unit, the motion control system and the displacement mechanism, is used for controlling the actions of the components, collecting three-dimensional contour scanning data of the workpiece and the welding point in real time, and calculating a detection result according to the collected data. The application can judge the quality of a bonding point based on multi-dimensional features during the bonding process.
Owner:JIANGSU SHENCUANG TECH CO LTD
A method and system for optimizing alloy bonding process parameters
ActiveCN120181345BForecastingAcquiring/recognising microscopic objectsBond interfaceRelational model
The present invention discloses a method and system for optimizing alloy bonding process parameters, which relates to the field of data processing technology, including presetting a target microstructure state and constructing an evaluation index system; obtaining actual microstructure data of the bonding interface during the alloy bonding process, and marking key evolution features to determine the diffusion layer thickness and grain size distribution; establishing a relationship model between process parameters and microstructure by comparing the actual microstructure data with the target microstructure state, and completing a first prediction; analyzing the dynamic characteristics of the diffusion layer through the results of the first prediction, and completing a second prediction in combination with the thermal-diffusion threshold; and deriving an optimal process parameter combination through the results of the second prediction to achieve the target microstructure state. The present invention effectively solves problems such as target ambiguity and insufficient model accuracy, significantly improves bonding quality and stability, reduces scrap rate and cost, and provides an innovative solution for high-performance material processing.
Owner:SHENZHEN ZHONGBAO NEW MATERIAL TECH CO LTD
Waterproof zipper film pasting quality intelligent regulation and control method and device based on dynamic fitting parameter optimization
This invention relates to an intelligent quality control method for waterproof zipper film based on dynamic bonding parameter optimization, aiming to solve key problems such as noise interference from micro-pressure and displacement signals, asynchronous sensor timing, and batch-to-batch material differences leading to bonding quality fluctuations. The method integrates an ultra-thin flexible strain sensor array and a microstructure optical interference unit to acquire and denoise multimodal transient mechanical response data in real time. Combined with characteristic parameters such as initial contact stiffness slope, maximum deformation parameter, unloading rebound rate, and residual creep duration, a unique memory fingerprint identifying the material's deformation characteristics is generated. Furthermore, a neural network is used to establish a nonlinear mapping between the deformation memory fingerprint and the main bonding quality control indicators, enabling real-time quality monitoring and adaptive parameter correction during the bonding process. This technology improves bonding consistency and material adaptability, effectively eliminates the impact of environmental and equipment differences on process stability, and is applicable to the field of intelligent bonding of new materials.
Owner:YINGDE QIANDUO TECH CO LTD