Two-layer-process double-sided flexible copper-clad laminate (CCL) and manufacture method thereof

Abstract

The invention relates to a two-layer-process double-sided flexible copper-clad laminate (CCL) and a manufacture method thereof. The two-layer-process double-sided flexible CCL comprises an upper copper foil, a lower copper foil and three polyimide resin layers sequentially clamped between the two copper foils, i.e. a thermoplastic polyimide resin layer with a thermal expansion coefficient larger than 40 ppm / DEG C, a thermoset polyimide resin layer with a low thermal expansion coefficient of 0-20 ppm / DEG C and a thermoset polyimide resin layer with a high thermal expansion coefficient of 20-40 ppm / DEG C. The two-layer-process double-sided flexible provided by the invention has higher thermal stability and high moisture fastness and can still have excellent high thermal stability, favorable size stability and high stripping strength under the harsh environment of high temperature, high moisture, and the like, thereby having favorable industrial prosperities. The double-sided flexible CCL manufactured by the invention has practically improved size stability under the condition of heavy moisture. When being applied to the environment of high temperature, high moisture, and the like, the double-sided flexible CCL and printing circuits made by the same have excellent thermal stability, high temperature reliability and moisture fastness stability.

Description

technical field [0001] The invention relates to the field of flexible copper clad laminates, in particular to a two-layer double-sided flexible copper clad laminate with high heat resistance and high moisture resistance and a manufacturing method thereof. Background technique [0002] Flexible printed circuit boards have been widely used in consumer electronics products such as notebook computers, mobile phones, personal digital assistants and digital cameras. Due to the continuous improvement of technical requirements in the electronics industry, consumer electronics products are rapidly becoming thinner and smaller The corresponding flexible copper clad laminates are required to be lighter and thinner and have high heat resistance and high reliability. The two-layer flexible copper clad laminate has achieved rapid development in recent years due to the use of polyimide resin with excellent mechanical properties, electrical properties and heat resistance. [0003] As we al...

AI Technical Summary

Problems solved by technology

Although the specific manufacturing methods of the above products are different, the overall resin layer structure is TPI / PI / TPI type. The glass transition temperature ( Tg) are all lower than 300°C, and its heat resistance is lower than that of the polyimide layer (PI layer, glass transition temperature higher than 300°C) in the middle position, and its TPI layer is at a high temperature during soldering In the viscoelastic state, the peel strength and dimensional stability of the copper clad laminate are greatly reduced

At the same time, because the hygroscopicity of TPI is greater than that of thermosetting polyimide resin, the dimensional stability of the copper clad laminate with this resin structure is also partially reduced under high humidity conditions.

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