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1191 results about "Polyamide-imide" patented technology

Polyamide-imides are either thermosetting or thermoplastic, amorphous polymers that have exceptional mechanical, thermal and chemical resistant properties. Polyamide-imides are used extensively as wire coatings in making magnet wire. They are prepared from isocyanates and TMA (trimellic acid-anhydride) in N-methyl-2-pyrrolidone (NMP). A prominent distributor of polyamide-imides is Solvay Specialty Polymers, which uses the trademark Torlon.

Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg

ActiveUS20050008868A1Insufficient heat resistanceElectrical controlPrinted circuit aspectsEpoxyElectrical conductor
Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a liquid state at a temperature of 20° C.; (B) an aromatic epoxy resin having 3 or more epoxy groups in one molecule and an epoxy equivalent of 200 or less; (C) a phenol type curing agent; (D) one or more resins selected from the group consisting of a phenoxy resin, a polyvinyl acetal resin, a polyamide resin, a polyamideimide resin, and mixtures thereof, and having a glass transition temperature of 100° C. or more; and (E) an inorganic filler, wherein: the inorganic filler (E) is present in an amount of 35% by weight or more based on the total weight of the non-volatile components of the resin composition; the epoxy resin (A) and the aromatic epoxy resin (B) are present in a weight ration of from 1:0.3 to 1:2 by weight of epoxy resin (A) to aromatic epoxy resin (B); the epoxy resin (A), the aromatic epoxy resin (B), and the phenol type curing agent (C) are present in relative amounts such that the weight ratio of epoxy groups in the resin composition and phenolic hydroxyl groups in the phenol type curing agent (C) is from 1:0.5 to 1:1.5; and the resin (D) is present in an amount of from 2 to 20% by weight based on the total weight of the non-volatile components of the resin composition. Such resin compositions are useful for interlayer insulation of a multilayer printed wiring board and are capable of forming an insulating layer which has a low thermal expansion coefficient and exhibits excellent peel strength for a conductor layer. Such resin compositions are also useful for preparing adhesive films and prepregs for a multilayer printed wiring boards, as well as multilayer printed wiring boards having an insulating layer formed of a cured product of the resin composition or the prepreg.
Owner:AJINOMOTO CO INC

Method for preparing corona-resistant enameled wire and product

The invention discloses a method for preparing a corona-resistant enameled wire and a product. The method comprises the following steps of: drawing wires; paying off; cleaning; annealing; cooling; painting and baking; lubricating; and winding up. The surface of a bare wire is firstly coated with four layers of corona-resistant polyester paint, then is coated with seven layers of corona-resistant polyester imide paint, and is finally coated with two layers of corona-resistant polyamide imide paint; and the baking and cooling are performed after painting each time, and then the next painting is performed. During baking, the corona-resistant enameled wire is from a lower layer to an upper layer of a baking oven, the temperature of an inlet of the baking oven is between 150 and 160 DEG C, the temperature of the lower layer of the baking oven is between 255 and 265 DEG C, the temperature before primary catalysis is between 365 and 375 DEG C, and the additional heating temperature after the catalysis is between 465 and 475 DEG C. The corona-resistant enameled wire produced by the method is a corona-resistant enameled wire with a composite insulation layer, the center of the corona-resistant enameled wire is a copper core, and the composite insulation layer is formed by combining a corona-resistant polyester (CPE) insulation layer, a corona-resistant polyester imide (CPEI) insulation layer and a polyamide imide (PAI) insulation layer.
Owner:株洲兆源机电科技有限公司

Anti-static polytetrafluoroethylene filter bag and preparation method thereof

The invention discloses an anti-static polytetrafluoroethylene filter bag and a preparation method thereof. The anti-static polytetrafluoroethylene filter bag comprises a bag head, a bag body and a bag bottom, wherein the bag head is made from a polytetrafluoroethylene filter material; the polytetrafluoroethylene filter material comprises a base cloth; the base cloth is weaved through warps and wefts by twisting polytetrafluoroethylene filament fibers and stainless steel fibers; the upper surface and lower surface of the base cloth are symmetrically covered with non-woven layers; the non-woven layers are prepared by blending polytetrafluoroethylene fibers or one or more of the polytetrafluoroethylene fibers, polyphenylene sulfide fibers, polyamide fibers, polyamide-imide fibers and glass fibers; and the overlapped edge of the bag body is provided with a stainless steel wire mesh layer. The filter material prepared through the method disclosed by the invention has the advantages of good high temperature resistance, corrosion resistance and electric conductivity and persistent static elimination, reduces the fire hazard or explosion generated due to electrostatic sparks and can be widely applied to the high-temperature fire prevention, explosion prevention and dust removal in the fields of iron and steel smelting, refuse burning, a coal-fired power plant, cement, chemical industry, and the like.
Owner:南京际华三五二一环保科技有限公司

Resin composition and adhesive film for multi-layered printed wiring board

Resin compositions, which contain: (a) a heat-resistant resin which is soluble in organic solvents wherein the heat-resistant resin is one or more heat-resistant resin(s) selected from the group consisting of a polyimide resin, a polyamide-imide resin, a polyamide resin, a polyether imide resin, a polybenzoxazol resin, a polybenzimidazole resin, copolymers thereof, and mixtures thereof; (b) a thermosetting resin; (c) a filler; and (d) resin having a polybutadiene structure and/or a polysiloxane structure, wherein: the heat-resistant resin (a) and the thermosetting resin (b) are present in a weight ratio of heat-resistant resin (a) to thermosetting resin (b) of from 100:1 to 1:1; the heat-resistant resin (a), thermosetting resin (b), and filler (c) are present in relative amounts such that weight ratio of the total amount of heat-resistant resin (a) and thermosetting resin (b) to filler (c) by weight is from 100:1 to 3:2; the resin having a polybutadiene structure and/or a polysiloxane structure (d) is present in an amount of 0.1 to 15 parts by weight based on 100 parts by weight of the heat-resistant resin (a); and the heat-resistant resin (a), thermosetting resin (b), filler (c), and resin having a polybutadiene structure and/or a polysiloxane structure (d) are present in a total amount of not less than 70% by weight, based on the total weight of the resin composition, are useful for preparing adhesive films, which are, in turn, useful for forming interlayer insulation layers for multi-layered printed wiring boards having an excellent mechanical strength and capable of being roughened by an oxidizing agent.
Owner:AJINOMOTO CO INC

Novel diamine compound, and preparation method and application thereof

The invention discloses a novel diamine compound, and a preparation method and an application thereof. The preparation method of the novel functional diamine compound comprises the following steps: a large conjugate structure comprising benzophenone carbonyl group is obtained; the ketone carbonyl group is subjected to a Wittig or Wittig-Horner reaction, such that a large conjugate system with a triphenylethylene/tetraphenylethylene structure and comprising a halogen atom is obtained; the halogen atom is further subjected to a Suzuki reaction or a plurality steps of reactions, such that a monoamine compound comprising a triphenylethylene/tetraphenylethylene large conjugate system is obtained; the monoamine compound is subjected to a reaction with halogenated nitrobenzene, such that a dinitro monomer comprising triphenylamine and the triphenylethylene/tetraphenylethylene large conjugate system is obtained; and the dinitro monomer is reduced into the novel diamine compound, such that the novel functional diamine compound comprising triphenylamine and a triphenylethylene/tetraphenylethylene structure is obtained. The synthesis method provided by the invention is simple. Purification is easy. The method is suitable for industrial productions. The synthesized diamine compound has a significant aggregation-induced emission property, and can be used for synthesizing high-performance and functional polymers such as polyamide, polyimide, polyamideimide, polyesterimide, and the like.
Owner:SUN YAT SEN UNIV
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