Provided are a polyamideimide resin, a polyamideimide resin film, and a method for manufacturing the same, the polyamideimide resin being characterized in that the polyamideimide resin is obtained by polymerizing a first
monomer, a second
monomer, and a third
monomer, the first monomer being tetracarboxylic dianhydride, the second monomer being tetracarboxylic dianhydride, and the third monomer being tetracarboxylic dianhydride. The second monomer is
diamine represented by the following
chemical formula (i), and the third monomer is a
dicarboxylic acid derivative, NH2-R-NH2.
Chemical formula (i) wherein R is
phenylene having more than one substituted or unsubstituted
benzene ring structure, and when R is
phenylene having more than two
benzene ring structures, R is a
phenyl group having more than one substituted or unsubstituted
benzene ring structure, and when R is a
phenyl group having more than one substituted or unsubstituted benzene ring structure, R is a
phenyl group having more than one substituted or unsubstituted benzene ring structure, R is a phenyl group having more than one substituted or unsubstituted benzene ring structure. The more than two benzene ring structures are connected by a
single bond,-O-,-S-,-C (= O)-or-CH (OH)-, and the substitution means that
phenylene is substituted by-CCl3,-CBr3 or-CF3.