Preparation method of dual-layer glue-free type double-face flexible copper-clad plate

A flexible copper-clad laminate and double-sided technology is applied in the field of preparation of two-layer adhesive-free double-sided flexible copper-clad laminates, which can solve the problems of dimensional stability, heat resistance, and solder resistance of double-sided flexible copper-clad laminates. The production process of double-sided flexible copper clad laminates is complicated, and the bonding strength is difficult to improve, so as to achieve the effect of simplifying the overall structure and production process, high flexibility, and high dimensional stability

Active Publication Date: 2015-02-04
HANGZHOU FIRST APPLIED MATERIAL CO LTD
View PDF6 Cites 25 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The thickness of this flexible copper-clad laminate is reduced and the flexibility is improved, but adhesives are used in its production, and the dimensional stability, heat resistance, and solder resistance of the double-sided flexible copper-clad laminate prepared are greatly improved. reduce
[0008] The current production process of double-sided flexible copper clad laminates

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of dual-layer glue-free type double-face flexible copper-clad plate
  • Preparation method of dual-layer glue-free type double-face flexible copper-clad plate
  • Preparation method of dual-layer glue-free type double-face flexible copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0029][Synthesis Example 1]: Under nitrogen atmosphere, add 200.2 g of 4,4'-ODA and 212.2 g of 4,4'-diaminobenzophenone into 4132 g of DMAc solvent, stir until completely dissolved; then 620.4 g of s-ODPA was added in three batches, followed by stirring for about 24 h to prepare a polyimide precursor solution with a solid content of 20 wt% and a viscosity of 1500 mPa·s.

Synthetic example 2

[0030] [Synthesis Example 2]: Under a nitrogen atmosphere, add 300.3 g of 4,4'-ODA and 106.1 g of 4,4'-diaminobenzophenone into 4119 g of DMAc solvent, and stir until completely dissolved; then 542.9 g of s-ODPA and 80.56 g of s-BTDA were added in three batches, followed by stirring for about 24 h to prepare a polyimide precursor solution with a solid content of 20 wt% and a viscosity of 3750 mPa·s.

Synthetic example 3

[0031] [Synthesis Example 3]: Under a nitrogen atmosphere, add 396.5 g of 4,4'-MDA into 4068 g of NMP solvent and stir until completely dissolved; then add 310.2 g of s-ODPA and 310.2 g of a-ODPA, followed by stirring for about 24 h to prepare a polyimide precursor solution with a solid content of 20 wt% and a viscosity of 4200 mPa·s.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a preparation method of a dual-layer glue-free type double-face flexible copper-clad plate. The plate is composed of a thermosetting polyimide layer, a thermoplastic polyimide layer, and two copper foil layers. The preparation method comprises the following steps: painting a thermosetting polyimide precursor solution on a copper foil to form a non-imidized precursor dry membrane; then painting a thermoplastic polyimide precursor solution on the copper foil to form a thermoplastic polyimide precursor dry membrane; then subjecting the polyimide precursor dry membranes to high-temperature imidization, covering a copper foil on the membrane-covered copper foil, and pressing. In the provided preparation method, only one high-temperature heat treatment is required during the production process, and thus the production cost is reduced. Moreover, the problem that layering easily appears between the multiple polyimide layers of the double-face flexible copper-clad plate is also solved by the preparation method, and the obtained polyimide layers are tightly bonded, so the performance of the copper-clad plate is more excellent, and the copper-clad plate is more practical.

Description

technical field [0001] The invention relates to a preparation method of a two-layer adhesive-free double-sided flexible copper-clad laminate. Background technique [0002] In recent years, with the high performance, miniaturization and light weight of digital cameras, digital video cameras, car navigators, computer accessories and other electronic products, as well as the emergence of high-end electronic products, such as tablet computers and smart phones, the electronic Lines are also constantly developing towards the trend of "light, thin, short, and small". Traditionally used rigid copper clad laminates do not have flexibility, and the electronic circuits obtained cannot be bent and assembled, and are bulky, which can no longer meet actual needs. Double-sided flexible CCL with high density, multi-layer, high heat resistance, and high dimensional stability is gradually replacing these rigid CCLs and becoming the mainstream of the market. [0003] The traditional manufact...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B32B37/15B32B37/10B32B37/06
CPCB32B15/01B32B37/153B32B2255/26B32B2255/28B32B2307/306B32B2307/734B32B2457/00
Inventor 周慧李奇琳曹肖翁建东周光大林建华
Owner HANGZHOU FIRST APPLIED MATERIAL CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap