Preparation method of dual-layer glue-free type double-face flexible copper-clad plate

Abstract

The invention discloses a preparation method of a dual-layer glue-free type double-face flexible copper-clad plate. The plate is composed of a thermosetting polyimide layer, a thermoplastic polyimide layer, and two copper foil layers. The preparation method comprises the following steps: painting a thermosetting polyimide precursor solution on a copper foil to form a non-imidized precursor dry membrane; then painting a thermoplastic polyimide precursor solution on the copper foil to form a thermoplastic polyimide precursor dry membrane; then subjecting the polyimide precursor dry membranes to high-temperature imidization, covering a copper foil on the membrane-covered copper foil, and pressing. In the provided preparation method, only one high-temperature heat treatment is required during the production process, and thus the production cost is reduced. Moreover, the problem that layering easily appears between the multiple polyimide layers of the double-face flexible copper-clad plate is also solved by the preparation method, and the obtained polyimide layers are tightly bonded, so the performance of the copper-clad plate is more excellent, and the copper-clad plate is more practical.

Description

technical field [0001] The invention relates to a preparation method of a two-layer adhesive-free double-sided flexible copper-clad laminate. Background technique [0002] In recent years, with the high performance, miniaturization and light weight of digital cameras, digital video cameras, car navigators, computer accessories and other electronic products, as well as the emergence of high-end electronic products, such as tablet computers and smart phones, the electronic Lines are also constantly developing towards the trend of "light, thin, short, and small". Traditionally used rigid copper clad laminates do not have flexibility, and the electronic circuits obtained cannot be bent and assembled, and are bulky, which can no longer meet actual needs. Double-sided flexible CCL with high density, multi-layer, high heat resistance, and high dimensional stability is gradually replacing these rigid CCLs and becoming the mainstream of the market. [0003] The traditional manufact...

AI Technical Summary

Problems solved by technology

The thickness of this flexible copper-clad laminate is reduced and the flexibility is improved, but adhesives are used in its production, and the dimensional stability, heat resistance, and solder resistance of the double-sided flexible copper-clad laminate prepared are greatly improved. reduce

[0008] The current production process of double-sided flexible copper clad laminates is relatively complicated, and generally involves multiple high-temperature heat treatment processes, which makes its production cost high

Moreover, the polyimide insulating layer in the middle is generally formed by laminating polyimide layers with different properties, and it is difficult to improve the bonding strength between them, and it is easy to cause cracking during use.

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