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Polyimide copper foil laminates and method for manufacturing same

A technology of polyimide layer and polyimide, which is applied in the direction of coating, metal pattern material, printed circuit secondary treatment, etc., can solve the problems of inconvenience, general products without structure, etc., and achieve the effect of reducing production cost

Inactive Publication Date: 2007-03-14
THINFLEX CORP
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0007] This shows that above-mentioned existing polyimide copper-clad laminate and its manufacture method obviously still have inconvenience and defect in structure, method and use, and urgently need to be further improved
In order to solve the problems existing in polyimide copper foil laminates and their manufacturing methods, relevant manufacturers have tried their best to find solutions, but for a long time no suitable design has been developed, and general products have not been suitable. A cut structure can solve the above problems, which is obviously a problem that the relevant industry is eager to solve

Method used

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  • Polyimide copper foil laminates and method for manufacturing same

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Embodiment Construction

[0032]In order to further illustrate the technical means and effects that the present invention adopts to achieve the intended purpose of the invention, the polyimide copper foil laminate and its manufacturing method proposed according to the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments. Embodiments, structures, methods, steps, features and effects thereof are described in detail below.

[0033] Please refer to FIG. 1 , which shows a cross-sectional view of a polyimide copper foil laminate according to a preferred embodiment of the present invention, which includes a first copper foil 100 and is positioned on the first copper foil 100. The first thermosetting polyimide layer 110, the thermoplastic polyimide layer 120 on the first thermosetting polyimide layer 110, the second thermosetting polyimide on the thermoplastic polyimide layer 120 layer 130 , and a second copper foil 140 on the second thermo...

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Abstract

This invention relates to one polyamide-imides foil deposition layer to process flexible print circuit board, which comprises copper foil, heat fixing polyamide layers, heating plastic polyamide layers and copper foil. This invention method comprises the following steps: coating heated fix polyamide copper foil structure; then using plastic polyamide adhesive structure for heat fix polyamide layers; finally binding and pressing to the invention product.

Description

technical field [0001] The invention relates to a polyimide copper foil laminate, in particular to a polyimide copper foil laminate used for flexible printed circuit boards. The present invention also relates to a method of manufacturing the polyimide copper foil laminate. Background technique [0002] Polyimide copper foil laminates are mainly used for the preparation of flexible printed circuit boards, and flexible printed circuit boards have been widely used in notebook computers, mobile phones, personal digital assistants and digital cameras, etc. consumer electronics. With the gradual trend of consumer electronics products becoming thinner and smaller, flexible printed circuit boards are also developing towards the use of thinner polyimide copper foil laminates. [0003] The main process of the existing known flexible printed circuit board is to coat a layer of adhesive on the polyimide layer, and then press it with copper foil. The copper foil is coated with photores...

Claims

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Application Information

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IPC IPC(8): H05K1/09H05K3/22B05D7/24C08L101/00
Inventor 郭培荣李国维
Owner THINFLEX CORP
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