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Thermoplastic polyimide and method for preparing flexible copper-clad plate from thermoplastic polyimide

A polyimide and polyimide film technology, applied in the field of thermoplastic polyimide, can solve the problems of low production efficiency and product yield, complicated operation, etc., achieve high peel strength, simple operation, and improve production efficiency and yield effect

Active Publication Date: 2014-04-23
RAYITEK HI TECH FILM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is more complicated to operate, and in the continuous coating process, the production efficiency and product yield are relatively low

Method used

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  • Thermoplastic polyimide and method for preparing flexible copper-clad plate from thermoplastic polyimide
  • Thermoplastic polyimide and method for preparing flexible copper-clad plate from thermoplastic polyimide
  • Thermoplastic polyimide and method for preparing flexible copper-clad plate from thermoplastic polyimide

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0043] In a 500ml four-neck flask equipped with a stirring device, add 10.08g of 2-(4-aminophenyl)-5-aminobenzimidazole, 4.96g of 1,3-bis(3-aminopropyl) Tetramethyldisiloxane, 4.1g of 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 5g of 4,4'-diaminodiphenyl ether, 220ml of dimethyl Acetamide, while stirring nitrogen gas, after the above-mentioned diamine monomer is completely dissolved, add 18.6g of 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride at room temperature, stir for 1 hour and then add 12.05 g of 3,3',4,4'-biphenyltetracarboxylic dianhydride was stirred continuously for 5 hours and then stopped to obtain a polyamic acid solution, that is, a thermoplastic polyimide precursor solution.

Synthetic example 2

[0045] In a 500ml four-neck flask equipped with a stirring device, add 11.25g of 2-(4-aminophenyl)-5-aminobenzoxazole, 8.16g of 1,11-bis(3-aminopropyl ) dodecamethylpolysiloxane, 4.1g of 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 5g of 4,4'-diaminodiphenyl ether, 220ml of diaminodiphenyl ether Methyl acetamide, while stirring nitrogen gas, after the above-mentioned diamine monomer is completely dissolved, add 18.6g of 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride at room temperature, and stir for 1h Then add 12.05g of 3,3',4,4'-biphenyltetracarboxylic dianhydride, continue to stir and react for 5h, add 3.16g of pyridine and 8.16g of acetic anhydride and stop stirring for 30min to obtain a polyamic acid solution. That is, the precursor solution of thermoplastic polyimide.

Synthetic example 3

[0047] In a 500ml four-necked flask equipped with a stirring device, sequentially add 12g of 4,4'-diaminodiphenyl ether, 4.32g of p-phenylenediamine, and 160ml of dimethylacetamide, and pass nitrogen gas while stirring , after the above-mentioned diamine monomer is completely dissolved, add 17.44g of pyromellitic dianhydride at room temperature, stir for 1 hour and then add 6.17g of 3,3',4,4'-biphenyltetracarboxylic dianhydride, The reaction was stopped after continuous stirring for 5 hours to obtain a polyamic acid solution, that is, a precursor solution of a thermosetting polyimide.

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Abstract

The invention provides a thermoplastic polyimide which is prepared by polymerizing a diamine monomer and a dianhydride monomer. The thermoplastic polyimide is characterized by comprising at least one of structural units expressed by a general formula (1), a general formula (2) and a general formula (3) as shown in specification, wherein the proportion of the structural unit expressed by the general formula (1) is more than 30mol%, the proportion of the structural unit expressed by the general formula (2) is more than 10mol%, the proportion of the structural unit expressed by the general formula (3) is more than 10mol%, and n in the general formula (3) is an positive integer greater than 1; Ar1, Ar2 and Ar3 are quadrivalent aromatic groups, Ar4 is a bivalent aromatic group containing hetero atoms, and Ar5 is a bivalent aromatic group without hetero atoms. The thermoplastic polyimide is mainly terminated with the anhydride group, and can be applied to the production of a no-adhesive flexible copper-clad plate by a two layer method.

Description

technical field [0001] The invention relates to a thermoplastic polyimide material, especially a thermoplastic polyimide containing an aromatic heterocycle. The invention also relates to a method for preparing a two-layer adhesive-free flexible copper-clad laminate from the aromatic heterocycle-containing thermoplastic polyimide material. Background technique [0002] With the demand trend of thin, light, short and small electronic information products, flexible circuit boards show a trend of multi-function, high density, high reliability and thinner, and increasingly require flexible copper clad laminates to be lighter and thinner and have High heat resistance and high reliability. At present, according to different product structures, there are three-layer flexible copper-clad laminates and two-layer flexible copper-clad laminates. The three-layer flexible copper clad laminate is composed of three layers of materials, one layer of copper foil, one layer of polyimide film...

Claims

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Application Information

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IPC IPC(8): C08G73/10B32B15/08B32B27/06B32B27/28
Inventor 胡勇肖贤彬汤昌丹
Owner RAYITEK HI TECH FILM CO LTD
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