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116 results about "Resin embedding" patented technology

Epoxide resin curing agent, epoxide resin embedding glue and confecting method thereof

The invention discloses an epoxy resin curing agent, an epoxy resin pouring sealant as well as the relevant preparation methods. The epoxy resin curing agent comprises 10 to 60 diaminodiphenylmethane, 20 to 70 diaminodiphenyl ether or diaminodiphenylsulfone, and 10 to 40 multi-amine curing agent, all calculated in pbw (part by weight). The preparation method for the curing agent comprises the following steps: mixing and heating the substances, raising the temperature to 90-110 DEG C, then stirring for 1 to 3 hours in thermal insulation state, and finally simply cooling the mixture to room temperature. The curing agent is liquid under normal temperature, and mixes well with the epoxy resin. The epoxy resin pouring sealant comprises 100 pbw epoxy resin which has at least two epoxy groups and is liquid under normal temperature, and 10 to 40 pbw epoxy resin curing agent; the preparation method for the pouring sealant comprises the following steps: adding the epoxy resin curing agent into the epoxy resin, mixing for 10 to 30 minutes, then debubble in vacuum state for 10 to 30 minutes, and finally simply removing the vacuum state. The transition temperature of vitrification for the pouring sealant thus acquired is pretty high, and the compound of epoxy resin cured is excellent in electromechanical and thermal performance.
Owner:GUILIN ELECTRICAL EQUIP SCI RES INST

Joint construction method for preventing reflection cracks generated during spreading of asphalt on old concrete pavement

The invention relates to a joint construction method for preventing reflection cracks generated during spreading of asphalt on an old concrete pavement. The method comprises the following steps: firstly determining the inter-panel deflection difference of old concrete panels to be jointed for reinforcing; after qualification, cutting across the joints at the joints of the two old concrete panels to obtain equal-distance stripe-type grooves and then vertically drilling the end parts of the stripe-type grooves by using an impact drill; bending a reinforcing steel bar according to the hole depth, the length of the grooves and the width of the inter-panel joint and finishing forming of a horseshoe rib; after transplanting the horseshoe ribs into the stripe-type grooves and the vertical holes in the end parts, pouring epoxy resin embedded steel bar glue into the cleaned drilling holes; mixing concrete and broken stone concrete, pouring into the grooves to form an embedded steel bar protective layer; and sequentially spreading layers of protective covering surfaces on the upper layers of the two waste concrete panels from bottom to top. The method provided by the invention has the advantages that the relative vertical displacement at two sides of the old panel joint, the reflection cracks are prevented to generate and develop so as to reduce or stop reflection cracks generated during spreading of asphalt on an old concrete pavement.
Owner:SHANGHAI SHISHEN IND & TRADE CO LTD

Resin embedding method for biological tissues marked by fluorescent protein and application of alkaline solution

The invention discloses a resin embedding method for biological tissues marked by fluorescent protein. The resin embedding method comprises the following steps: (1), fixing the biological tissues marked by the fluorescent protein in a chemical fixing manner to obtain the fixed biological tissues marked by the fluorescent protein; (2), replacing the fixed biological tissues marked by the fluorescent protein with an organic solvent, so that the biologic tissues are dewatered to obtain dewatered biological tissues marked by the fluorescent protein; (3), performing embedding agent permeation treatment on the dewatered biological tissues marked by the fluorescent protein to obtain embedding-agent monomer-filled biological tissues marked by the fluorescent protein; (4), enabling the embedding agent to generate a polymerization reaction to obtain a resin-embedding sample of the biological tissues marked by the fluorescent protein; (5), soaking the resin-embedding sample in an alkaline solution, and adjusting the pH value to be 8-12. The resin embedding method for the biological tissues marked by the fluorescent protein can be suitable for biologic tissue samples of various sizes, the fluorescence intensity is high, the imaging effect is good, and the samples have excellent cutting performance.
Owner:HUAZHONG UNIV OF SCI & TECH

Bio-sample tomography micro-imaging system

The invention discloses a bio-sample tomography micro-imaging system which includes a low-light imaging sub system and a sample planar processing sub system. The low-light imaging sub system is used for performing integral imaging during planar processing on the sample, and the sample planar processing sub system is used for processing the surface of the sample to form a tomography for imaging by the low-light imaging sub system. The low-light imaging sub system comprises a linear scanning module and a light spot shaping module, wherein the linear scanning module comprises a linear detector and an imaging lens. The light spot shaping module, in the direction of light path, successively comprises a beam expansion unit and a beam shrinkage unit. In the invention, by means of separation of a cutting module from the imaging system, the low-light imaging sub system is designed, so that the bio-sample tomography micro-imaging system is suitable for various resin-embedded samples. By means of separation of cutting speed from imaging speed, longitudinal low-sampling quick imaging acquisition can be carried out. In addition, the bio-sample tomography micro-imaging system can perform quick 3D information acquisition on low-light objects, such as fluorescent biological organs and the like.
Owner:WUHAN OE BIO CO LTD

Fast and intelligent 10KV pole-mounted breaker

The invention discloses a fast and intelligent 10KV pole-mounted breaker. The fast and intelligent 10KV pole-mounted breaker is composed of a breaker body and an intelligent control box which are connected through multicore shield cables, an epoxy resin embedded pole is adopted, and the fast and intelligent 10KV pole-mounted breaker is good in weather resistance and ageing resistant, prevents ultraviolet light, and is high in strength and good in electrical insulation performance. Small-scale integrated design is adopted, a current transformer and a voltage transformer are integrated in the pole, the structure is compact, and mounting and maintenance are easy. A high-speed algorithm is adopted, exit protecting signals can be provided in 10ms, the fast mechanical property of a permanent magnetic mechanism is combined, and a line fault is removed and isolated in 25ms. A single-phase earth fault (including low current earthing) detecting function is achieved. The technology of self-diagnosis of the running state and the mechanical property of the breaker is achieved, and maintenance efficiency is improved. A low-power design technology is adopted, solar energy and CT are utilized to supply power and are mutually supplemented, an external power source is not needed, and the power-driven operation can be achieved. The fast and intelligent 10KV pole-mounted breaker is provided with an Ethernet port, and an IEC61850 specification interface is provided.
Owner:SHENZHEN JINBOLIAN ELECTRIC POWER TECH

Method for machining wafer

Provided is a method for machining a wafer to obtain wafer-scale chip scale package (WLCSP) with good quality. The method comprises: a first cutting groove forming step, including forming a first cutting groove having a depth corresponding to the finished thickness of a device along a dividing preset line from a front side of the wafer with a cutting tool having a first thickness; a molding step, including coating the front side of the wafer subjected to the cutting groove forming step with a molded resin and embedding the molded resin in the first cutting groove; a second cutting groove forming step, including forming a second cutting groove reaching the wafer and having the depth deeper than that of the molded resin coating the front side of the wafer and that of the molded resin embedded in the molded resin with a cutting tool having a second thickness thinner than a first thickness; a protective member adhering step, including applying a protective member to the surface of the molded resin deposited on the front surface of the wafer on which the second cutting groove forming step is performed; and a back surface grinding step, including grinding the back surface of the wafer on which the protective member attaching step is carried out so that the second cutting groove is exposed to divide the wafer into individual devices.
Owner:DISCO CORP
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