25 results about "Resin embedding" patented technology

Provided is an analytical method for measuring porosity in a weld cross-section, which is capable of suppressing variations in measurement results and obtaining quality results at a higher level. An analysis method for measuring porosity in a weld cross-section includes: an analysis TP manufacturing step of manufacturing an analysis TP (test piece) by subjecting a weld cross-section exposed by cutting a welded portion of a workpiece welded with a non-ferrous material to resin filling, and then polishing the weld cross-section with a polishing agent; an image input step in which a weld cross-section image obtained by capturing an image of a weld cross-section in the analysis TP is input to the analysis program; a pre-processing step for generating a mask image of the weld seam in the weld seam cross-sectional image using pre-acquired seam shape learning data; a post-processing step for generating a processed image in which the weld cross-section image and the mask image are superimposed and a portion that is not a weld is cut off; and a porosity measurement step for measuring the porosity of the weld seam on the basis of the processed image, the learning data being a combination of a plurality of weld seam cross-sectional images obtained by polishing the weld seam cross-section with a plurality of polishing agents and the resolution of the weld seam cross-sectional images.

This invention discloses a resin embedding device for rock samples, including a fume hood; a mold support platform located inside the fume hood, on which multiple cold embedding molds are spaced apart; and a robotic arm assembly integrated within the fume hood. The robotic arm assembly consists of a first robotic arm and a second robotic arm. The first robotic arm is used to add material into the corresponding cold embedding mold, and the second robotic arm is used to stir the cold embedding mold after the material has been added. The device also includes a control system that controls the operation of each mechanism. This resin embedding device enables automated resin embedding of rock samples, improving labor efficiency and reducing work hazards. It allows for rapid preparation of drilling cuttings samples from oil and gas exploration sites, and enables large-scale sample embedding 24 / 7.

The utility model discloses a demoulding clamp for a resin embedding block. The demoulding clamp comprises a lining, a pressing sleeve and a sealing cover, the upper part of the bushing is of a cylindrical structure with an external thread, the lower part of the bushing is of a cone frustum structure with a gradually reduced diameter, and a bracket for fixing the centrifugal tube is arranged in an inner cavity of the cylindrical structure and the cone frustum structure; a plurality of counterbores are uniformly formed in the conical surface of the cone frustum structure, and bolts facing an inner cavity of the cone frustum structure are arranged in the counterbores in a penetrating manner; an inner cavity of the pressing sleeve is matched with the outer wall face of the lining in shape. The sealing cover is in threaded fit with the cylindrical structure on the upper portion of the lining, and an inner hole for a self-tapping screw (7) to penetrate through is formed in the center of the sealing cover.

This invention provides a method for manufacturing embedded samples that suppresses the curvature of sheet-like samples and the peeling and curling of membranes in sheet-like samples laminated on a film, making it suitable for calculating the thickness of sheet-like samples and preparing horizontally sliced ​​sections. [Solution] A method for producing a resin-embedded sample, comprising the steps of: (a) placing a membrane on which cell samples are stacked in a container; (b) adding a gel material in a sol state to the container and gelling it to obtain a gel-embedded sample in which the cell samples are embedded in the gel; and (c) removing the gel-embedded sample from the container and embedding it in resin to obtain a resin-embedded sample.

The invention discloses a manufacturing method of a sediment rock core display specimen, belongs to the technical field of specimen manufacturing, and solves the problems of poor specimen safety and specimen visibility caused by a sealing material in the prior art. The manufacturing method of the sediment rock core display specimen comprises the following steps: sequentially carrying out infiltration treatment on a sediment rock core by adopting a hydrogen peroxide solution and a dodecyl dimethyl benzyl ammonium chloride solution under the conditions that the temperature is 15 to 25 DEG C and the humidity is 40 to 60 percent, so as to obtain a pretreated sediment rock core; embedding the pretreated sediment rock core by adopting transparent resin, and curing to obtain an embedded rock core; grinding and polishing the embedded rock core to obtain a sediment rock core display specimen; wherein biological remains / remain in the sediment core should be retained. The sediment rock core display specimen provided by the invention is simple in manufacturing method, high in practicability and low in cost.

The present disclosure provides a transfer sheet used for producing an exterior member, the transfer sheet comprising: a releasing film, and a transfer layer disposed on one surface of the releasing film, wherein the transfer layer includes a first protective layer and a second protective layer, in this order from the releasing film side, in a thickness direction; the first protective layer includes a cured product of a first curable resin composition, and a weather resistant agent; the second protective layer includes a cured product of a second curable resin composition, and a weather resistant agent; the cured product of the first curable resin composition and the cured product of the second curable resin composition respectively include a (meth)acrylic component, and a urethane component; and when a cross-sectional sample piece of the transfer sheet is prepared using a resin embedding method and a microtome, an indentation hardness at a cross-section of the first protective layer is 150 MPa or more and 300 MPa or less, and an indentation hardness at a cross-section of the second protective layer is 2 MPa or more and 50 MPa or less.

The utility model relates to the technical field of molds, and discloses a mold structure for embedding resin into a large-radian inverted steel column structure, which comprises an upper inner mold, a lower inner mold and an opening mechanism, the upper inner mold is abutted against the top of the lower inner mold, and a forming mold cavity for forming injection molding raw materials is enclosed between the upper inner mold and the lower inner mold. A large-radian inverted steel column strip with elastic deformation is embedded in the bottom of the forming die cavity, the two ends of the steel column strip separately extend outwards away from the forming die cavity and are bent to form swing strips, the two swing strips are separately inserted into two opening mechanisms, and the two opening mechanisms are separately mounted in the bottom of the lower inner die; the contact area with a large-radian resin product can be reduced through the steel column strip, product demolding is assisted through the elastic deformation function of the steel column strip, the two opening mechanisms can make contact with the swing strip, the steel column strip is gradually opened along with ejection, it is ensured that the product is smoothly demolded, and the steel column strip is prevented from scraping a mold.

A resin sealing device (1) is provided with: a resin sealing mold (21) which seals an electronic component (P) with a resin by compression molding a resin material onto a workpiece (W); and a resin amount calculation unit (79) which calculates, for each workpiece, the resin amount in the resin material to be supplied to the workpiece (W) on the basis of the mounting state of the electronic component (P) on the workpiece (W). The resin material contains a first resin (R1) and a second resin (R2); the first resin (R1) is a sheet-like resin; the second resin is a granulated resin, a powdered resin or a liquid resin; and among the first resin (R1) and the second resin (R2), at least the amount of the second resin (R2) to be supplied is determined for each workpiece on the basis of the resin amount that is calculated by the resin amount calculation unit (79).

To provide a resin sealing device and a resin sealing method which can highly accurately remove a gate part and can achieve reduction in size and high density mounting of a molded article.SOLUTION: A resin sealing method includes a resin sealing step of charging a tablet-like resin R to a pot 240, pressing the resin R by a plunger 242, pressure-feeding the resin R from a cull 246 through a runner 247 to a cavity 208, and sealing workpiece W with the resin R, and a degate step of taking out a molded article Wp after the resin sealing step from a sealing mold 202, and removing an unnecessary resin part in the molded article Wp, wherein the degate step performs a runner brake step of removing a cull part Rc and a runner part Rr that are unnecessary resin parts formed at the positions of the cull 246 and the runner 247, and then performs a gate cut step of removing a gate part Rg that is an unnecessary resin part formed at a position of a gate 248 between the runner 247 and the cavity 208.SELECTED DRAWING: Figure 3

To provide a resin sealing device and a resin sealing method, which are capable of preventing molding defects caused by a gradual decrease in a surface temperature of a sealing die when an automatic operation continues at a given cycle.SOLUTION: A resin sealing method according to the present invention is configured in that: a temperature of a sealing die 202 at which a resin R is appropriately thermally cured during sealing is defined as normal set temperature, and a temperature of the sealing die 202, which is set as a temperature higher than the normal set temperature by a predetermined temperature is defined as a switching set temperature; and during a unit process in which a workpiece W and the resin R are carried into the sealing die 202, sealed, and then carried out as a molded product Wp, a temperature of the sealing die 202 is controlled by changing the set temperature of at least one of an upper die 204 and a lower die 206 from the normal set temperature to the switching set temperature at a predetermined start timing, and a temperature of the sealing die 202 is controlled by changing the set temperature from the switching set temperature to the normal set temperature at a predetermined end timing.SELECTED DRAWING: Figure 1

The utility model discloses a resin embedding mold, relates to the technical field of molds, and aims to solve the problems that a resin product is possibly damaged during demolding of a traditional mold, resin leakage is easily caused by poor sealing performance of the mold, and the embedding process is tedious in operation, low in efficiency and low in cost due to unreasonable structural design of the mold. The resin embedding mold comprises an upper mold and a lower mold which are used for forming the resin embedding mold, a plurality of cavities with different shapes are formed in the top of the lower mold, a plurality of buckles are fixedly connected to the bottom of the upper mold, and the buckles are fixedly connected with the upper mold and the lower mold. And a plurality of clamping grooves corresponding to the buckles are formed in the top of the lower mold. The utility model has the advantages that the size of the cavity can be flexibly changed so as to adapt to embedding of articles with different sizes, and the sealing performance is good.

The invention discloses an iodoform-epoxy resin embedding preparation method for SEM-EDS analysis of a coalbed methane reservoir sample, and relates to the technical field of reservoir sample detection. The method comprises the following steps: cutting, cleaning and performing low-temperature vacuum drying on a coalbed methane reservoir sample; adding iodoform into the epoxy resin, and fully stirring until the iodoform is completely dissolved to form a uniform and clear mixed solution; then adding a curing agent and stirring at a low speed; after natural and vacuum combined defoaming, embedding and curing the sample; and finally, a flat observation surface is obtained through step-by-step mechanical polishing and argon ion polishing, and sample preparation is completed after conductive treatment. According to the method, iodoform is dissolved firstly, and then the curing agent is added, so that iodoform crystal agglomeration and bubble introduction are effectively avoided, the contrast of the backscattered electron image is remarkably improved, the primary pores and cleat structures of the coal rock are protected, and the EDS quantitative analysis precision is improved; the method is simple in process, controllable in process parameter, good in repeatability, suitable for various samples such as coal rock, coal-containing clastic rock and coal seam dirt band, and capable of providing high-quality sample preparation guarantee for coal bed gas reservoir microcosmic characterization.

The invention discloses a culture dish marking method for a cell photoelectric correlation experiment and application of the culture dish marking method, and the method comprises the following steps: placing a stainless steel carrying net with a Marker pattern in a target area at the bottom of a culture dish, and taking the stainless steel carrying net as a mask plate; putting the culture dish with the mask plate into a metal ion sputtering instrument, taking platinum as a sputtering target material, and starting the metal ion sputtering instrument to carry out ion sputtering so as to form a Marker formed by a platinum plating layer at the bottom of the culture dish; and taking out the culture dish and removing the mask plate to obtain the culture dish with the Marker for the cell photoelectric correlation experiment. The method is easy and convenient to operate, low in cost, high in mark transfer rate and safe to use, no glass slag is left after resin separation, and the separated resin embedding block does not damage a slicing knife during slicing.

The invention provides a method for rapidly preparing a transmission electron microscope test ultrathin slice coal sample, which comprises the following steps of: crushing lump coal, embedding by using a room temperature curing embedding agent, grinding and polishing after a polished section is cured and formed, observing and identifying macerals in the coal under an optical microscope, selecting and marking the position where the ultrathin slice is required, and determining the thickness of the ultrathin slice coal sample. And cutting the selected area, carrying out secondary embedding by using a room-temperature curing embedding agent, and finally, completing slicing by using an ultrathin slicing machine. Compared with a traditional resin embedding slicing method, the method for rapidly preparing the transmission electron microscope test ultrathin slice coal sample has the advantages that point selection, point taking and secondary embedding are directly carried out on the polished section, the complex chemical treatment process of coal sample leaching and inorganic mineral removal is directly skipped, and the sample preparation step is simplified; acid and alkali agents are not used, so that the safety risk and the consumable consumption are reduced; visual point selection is achieved, and the accuracy of sample preparation is improved.

The invention discloses a fiber composite material thin-wall component and an integrated forming method thereof. The thin-wall component comprises a thin-wall layer formed by natural fiber prepreg and an open type grid forming framework formed by co-curing with the back face of the thin-wall layer. The forming framework is of a single-layer grating structure and is composed of a plurality of ribs, opening units are formed among the ribs, and a through type or communicated type mechanical lock key structure is arranged on the side, attached to the thin-wall layer, of the forming framework. In the co-curing process, resin in the prepreg enters the mechanical lock key structure under the action of heating and pressure and is cured, and a resin built-in integrated structure is formed. Structurally-reinforced grating units or framework modules are arranged in edge areas or connecting areas of the thin-wall components, so that the local compressive collapse resistance and the connecting durability are improved. On the premise that the weight is not obviously increased, the buckling resistance of the thin-wall component and the bearing capacity of a connecting area are improved.

To provide a resin sealing device which enables a sheet-like release film to be used without increasing the number of forward movements of a press loader into a die, and to provide a resin sealing method.SOLUTION: A resin sealing device 1 includes a resin sealing die 60 and a loader hand 88. The resin sealing die 60 includes an upper die 62 and a lower die 61, in which a cavity recessed part 63 is formed at the side facing the upper die 62, and performs resin sealing to an electronic component E with a resin material R supplied to the cavity recessed part 63 through a release film F. The loader hand 88 is configured to be able to enter a space 60S between the upper die 62 and the lower die 61 and retreat from the space 60S. The loader hand 88 holds the used release film F' and a resin sealing component M while entering the space 60S and retreats from the space 60S while holding the release film F' and the resin sealing component M.SELECTED DRAWING: Figure 2D

The embodiment of the present application discloses a kind of 3D printing resin inserts silica gel open mould method, including steps: silver plate mould and 3D printing resin mould are mutually matched installation, obtain an installed silver plate mould and 3D printing resin mould connecting body;The silver plate mould and 3D printing resin mould connecting body are carried out silica gel open mould;The silver plate mould in the silica gel mould is demoulded, and 3D printing resin mould is embedded in the silica gel mould;Wax is injected into the silica gel mould, after waiting cooling, wax plate mould is formed in the position of original silver plate mould;The plaster open mould is carried out to the wax plate mould;The plaster mould is heated, and the wax plate mould is vaporized and volatilized;High-temperature molten liquid noble metal is injected into the plaster mould, and after waiting the liquid noble metal solidification, the finished product is obtained.The method of the embodiment of the present application can replace laser typewriter printing technology, greatly reduce the loss and economic loss caused by laser typewriter printing to make noble metal vaporize and volatilize.

Methods of making a carbon-carbon composite from thermosetting polymer resin include (a) infusing bis-Schiff base resin into a carbon fiber reinforcement to form an uncured resin embedded composite, (b) positioning the uncured resin embedded composite on a substrate under a vacuum enclosure, (c) curing the bis-Schiff base resin at a first elevated temperature under vacuum to form a polymer matrix composite, (d) heating the polymer matrix composite at a second elevated temperature under inert atmosphere to form a porous carbon-carbon composite, (e) re-infusing bis-Schiff base resin into the porous carbon-carbon composite and curing under vacuum at a third elevated temperature to generate a reinfused porous carbon-carbon composite, and (f) heating the reinfused porous carbon-carbon composite at a fourth elevated temperature under inert gas to form the carbon-carbon composite. Further, the second elevated temperature and / or the fourth elevated temperature is less than 900° C.

The application discloses a manufacturing method of an embedded chip substrate and a temporary bonding structure, and relates to the technical field of semiconductor packaging, so as to solve the problem of excessive warping of the substrate in the manufacturing process. The manufacturing method of the embedded chip substrate comprises the following steps: substrate windowing, first temporary bonding, chip pasting, first compression and resin embedding, second temporary bonding, first debonding, second compression and resin embedding, second debonding, circuit manufacturing, resin insulation layer processing, intermediate circuit manufacturing and solidification. In the method, the resin in the structure is in an incomplete solidification state before the symmetric structure is formed, pre-solidification is performed after each resin layer is processed, and complete solidification is not performed. After all the resin layers are processed, solidification is performed once again, so that the symmetric structure can be formed after the low warping state is maintained, and the solidification rate is above 90%, and the resin cracking can be effectively avoided. The temporary bonding structure is a temporary structure generated in the manufacturing method of the embedded chip substrate.

The invention relates to the field of proton exchange membrane preparation, and discloses a composite proton exchange membrane and a preparation method and application thereof. A composite proton exchange membrane comprises a first proton exchange resin layer and at least one proton exchange membrane unit which is overlapped with the first proton exchange resin layer, and the proton exchange membrane unit is composed of a porous reinforcing layer and a second proton exchange resin layer. The porous reinforcing layer comprises a porous reinforcing material and proton exchange resin embedded in the porous reinforcing material; the first proton exchange resin layer and the adjacent porous enhancement layer are integrally formed; wherein in any 5cm * 5cm composite proton exchange membrane, after a hydrogen peroxide foaming method is adopted for testing, the number of defects between the proton exchange resin and the porous reinforcing material is 0. According to the composite proton exchange membrane disclosed by the invention, the PEM resin and the porous reinforcing material are combined compactly, no defect is generated, and the composite proton exchange membrane has lower surface resistance rise rate and performance attenuation rate.

The invention discloses a preparation method of a profile sample of a beta-cyclodextrin microsphere modified resin embedded powder material, and belongs to the technical field of microstructure morphology characterization. The preparation method of the profile sample comprises the following steps: mixing beta-cyclodextrin microspheres with resin, adding a to-be-detected powder material and a curing agent, mixing, spreading on a glass slide, covering with a cover glass, and curing to obtain an embedded sample; the mass of the beta-cyclodextrin microspheres is 2-10 wt% of the mass of the resin; and carrying out section cutting on the embedded sample, and polishing to obtain a section sample. The beta-cyclodextrin microspheres are introduced into the preparation of the profile sample, so that the mechanical damage to the powder in the sample preparation process can be reduced, the generation of microcracks in an embedding body is inhibited, and the imaging quality during electron microscope shooting can be improved to a certain extent.

The present invention discloses a manufacturing method and a temporary bonding structure for an embedded chip substrate, which relates to the field of semiconductor packaging technology to solve the problem of excessive warping of the substrate during the manufacturing process. The manufacturing method for the embedded chip substrate includes the steps of substrate windowing, first temporary bonding, chip attachment, first pressing and embedding resin, second temporary bonding, first debonding, second pressing and embedding resin and second debonding, blind hole processing, etc. In the steps of chip attachment, resin embedding, pre-curing, etc., the first support plate and / or the second support plate are used to support the substrate. The first support plate and / or the second support plate can reduce the overall warping of the substrate caused by structural asymmetry, ensuring that the substrate is always in a low-warping state during the manufacturing of the embedded chip substrate. In addition, each time the insulating layer is processed on the intermediate layer circuit, curing is performed once. The temporary bonding structure is a temporary structure generated during the above-mentioned manufacturing method of the embedded chip substrate.

The application relates to the field of proton exchange membrane preparation, and discloses a composite proton exchange membrane as well as a preparation method and application thereof. The composite proton exchange membrane comprises a first proton exchange resin layer and at least one proton exchange membrane unit stacked with each other, the proton exchange membrane unit is composed of a porous reinforcing layer and a second proton exchange resin layer, the porous reinforcing layer comprises a porous reinforcing material and a proton exchange resin embedded in the porous reinforcing material; the first proton exchange resin layer and the adjacent porous reinforcing layer are integrally formed; wherein in any 5cm*5cm composite proton exchange membrane, the number of defects between the proton exchange resin and the porous reinforcing material is 0 after being tested by adopting a hydrogen peroxide bubbling method. The composite proton exchange membrane has the advantages that the PEM resin and the porous reinforcing material are combined compactly, no defects are generated, the surface resistance increasing rate and the performance attenuation rate are lower.

The invention relates to the technical field of functional coating materials, and discloses a graphene fluorosilicone resin composite antibacterial anti-skid coating which comprises hydroxyl-terminated polytrifluoropropyl methyl siloxane, few-layer graphene, ionic liquid, chelated titanate, a fluorine-containing silane cross-linking agent, an organic tin catalyst and a solvent. A graphene-ionic liquid-titanate supramolecular precursor is prefabricated, the precursor is driven to migrate to the surface through solvent evaporation, in-situ hydrolysis of titanate is induced through humidity, and a microcosmic anti-skid texture anchored by an inorganic network and a component gradient structure are constructed on the surface. By means of the scheme, firm locking and efficient enrichment of active components on the surface layer are achieved, the problems that traditional coating filler is embedded by resin and prone to falling off and powder falling off are effectively solved, the surface friction coefficient, abrasion resistance stability and antibacterial activity of a coating are improved, and meanwhile the excellent adhesive force of the coating to a base material is guaranteed.

To provide a resin sealing device and a resin sealing method which suppress positional deviation of a workpiece to achieve an improvement in reliability of a molded product.SOLUTION: A resin sealing device 1 is one for sealing an electronic component P of a workpiece W with a resin, including a resin sealing mold 21 which seals the electronic component P with a resin by compression molding a resin R onto the workpiece W. The resin sealing mold 21 includes a first mold 23 and a second mold 22 which pairs with the first mold. The first mold 23 has a cavity recess 25 and a workpiece guide 28 provided on the outer peripheral surface of the cavity recess 25 on a side facing the second mold 22. The workpiece guide 28 positions the workpiece W from outside the workpiece W in plan view of the first mold 23, while the resin sealing mold 21 is opened.SELECTED DRAWING: Figure 3A