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Immingled filling material filled polyurethane modified epoxy resin embedding material and preparation method

A technology of polyurethane modification and epoxy resin, applied in chemical instruments and methods, other chemical processes, etc., can solve problems such as poor temperature shock resistance, performance defects, and insufficient comprehensive performance

Inactive Publication Date: 2009-01-14
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most epoxy resin potting materials at home and abroad use bisphenol A glycidyl ether epoxy resin, adding a large amount of silicon micropowder filler. The heat resistance grade of this kind of material is B grade, and the low temperature cracking performance is only -20 ℃. Very poor resistance to temperature shock
In addition, epoxy resin potting materials are generally filled with single particle fillers at present, which often have insufficient comprehensive performance and even have certain performance defects.

Method used

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  • Immingled filling material filled polyurethane modified epoxy resin embedding material and preparation method
  • Immingled filling material filled polyurethane modified epoxy resin embedding material and preparation method
  • Immingled filling material filled polyurethane modified epoxy resin embedding material and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] Weigh 128g of PPG1000 into a clean and dry four-neck flask, stir, heat to 130°C for reflux dehydration for 1 hour, cool down to 55°C, add 38.6g of TDI, then slowly raise the temperature to 75°C, cool down after the reaction, add 4.18g of 1,4-BDO And 1.56gTMP mixes, obtains polyurethane standby.

[0054] Add 320g filler (MG / SiO 2 =50 / 50), 142g TDE-85 epoxy resin, 238gMeTHPA and 0.71gDMP-30 are mixed, then add 40g polyurethane, after the mixture is defoamed in a vacuum epoxy automatic pouring machine, the temperature rises and solidifies (120°C / 2h, 140°C / 2h , 160℃ / 2h) into a mold, the measured tensile strength is 62.65Mpa, and the impact strength is 14.57kJ m -2 , the volume resistivity is 4.25×10 15 Ω·cm, no cracking at low temperature (-55°C), temperature shock resistance (-55~75°C, 5 cycles of high and low temperature shock) qualified.

Embodiment 2

[0056] Weigh 128g of PPG1000 into a clean and dry four-neck flask, stir, heat to 120°C for reflux dehydration for 1 hour, cool down to 50°C, add 45g of TDI, then slowly raise the temperature to 70°C, cool after the reaction, add 4.18g of 1,4-BDO and 1.56g of TMP was mixed to obtain polyurethane for subsequent use.

[0057] Add 400g filler (MG / SiO 2 =50 / 50), 142g TDE-85 epoxy resin, 198gMeTHPA and 0.71gDMP-30 are mixed, then add 60g polyurethane, after the mixture is defoamed in a vacuum epoxy automatic pouring machine, the temperature rises and solidifies (120°C / 2h, 140°C / 2h , 160℃ / 2h) into a mold, the measured tensile strength is 70.97Mpa, and the impact strength is 17.15kJ m -2 , the volume resistivity is 4.02×10 15 Ω·cm, no cracking at low temperature (-55°C), temperature shock resistance (-55~75°C, 5 cycles of high and low temperature shock) qualified.

Embodiment 3

[0059] Weigh 128g of PPG1000 into a clean and dry four-neck flask, stir, heat to 110°C for reflux dehydration for 1 hour, cool down to 40°C, add 51.4g of TDI, then slowly raise the temperature to 60°C, cool after the reaction, add 4.18g of 1,4-BDO And 1.56gTMP mixes, obtains polyurethane standby.

[0060] Add 480g filler (MG / SiO 2 =50 / 50), 142gTDE-85 epoxy resin, 158gMeTHPA and 0.71gDMP-30 are mixed, then add 80g polyurethane, after the mixture is defoamed in a vacuum epoxy automatic pouring machine, the temperature rises and solidifies (120°C / 2h, 140°C / 2h , 160℃ / 2h) into a mold, the measured tensile strength is 58.85Mpa, and the impact strength is 15.45kJ m -2 , the volume resistivity is 3.62×10 15 Ω·cm, no cracking at low temperature (-55°C), temperature shock resistance (-55~75°C, 5 cycles of high and low temperature shock) qualified.

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Abstract

The invention relates to polyurethane modified epoxy resin encapsulating material filled with promiscuous padding and the preparation method, in particular to epoxy resin encapsulating material prepared by adopting the promiscuous padding mixed by glass fiber power (MG) and SiO2 or AIN and the TDE-85 epoxy resin modified by polyurethane and the preparation method thereof. By adopting the polyurethane to toughen and modify the TDE-85 epoxy resin basal body, and adopting methyl tetrahydrophthalic anhydride methpa as the curing agent, 1,4-butylene-glycol as the chain extender, trimethylol propane as the crosslinking agent, 2,4,6-tris(dimethylamino methyl) phenol as the curing accelerator, and the mixture of the MG and the SiO2 or the AlN as the padding, the epoxy resin encapsulating material is made by evenly mixing the components according to the prescriptive mass ratio, which had good technical performance, in particular to the mechanical property. The experiment indicates that the promiscuous padding can effectively make up for the performance defects of the epoxy resin encapsulating material filled with single particle padding, and has good integrated performance.

Description

technical field [0001] The invention belongs to the field of new polymer materials, and the invention relates to an epoxy resin potting material and a preparation method thereof, especially glass fiber powder (MG) and SiO 2 Or AlN hybrid filler and polyurethane modified TDE-85 epoxy resin to prepare epoxy resin potting material and method thereof. Background technique [0002] Epoxy resin potting materials have excellent mechanical properties, electrical insulation, heat resistance, corrosion resistance, and good bonding properties with various materials, so they are widely used in the overall potting and sealing of electronic products. It is of great significance to improve the integrity of electronic devices, resistance to external impact, insulation between internal components, and light weight of devices. At present, 80% to 90% of foreign semiconductor devices (almost all in Japan) are potted with epoxy resin, and its development situation is very promising. However, w...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L75/04C08K13/04C08K3/36C08K3/28C08K7/14C09K3/10B29B7/00B29B11/06C08K5/09C08K5/17B29K63/00B29K75/00
Inventor 李芝华林伟谢科予
Owner CENT SOUTH UNIV
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