Immingled filling material filled polyurethane modified epoxy resin embedding material and preparation method

A technology of polyurethane modification and epoxy resin, applied in chemical instruments and methods, other chemical processes, etc., can solve problems such as poor temperature shock resistance, performance defects, and insufficient comprehensive performance
CN101343399AInactive Publication Date: 2009-01-14CENT SOUTH UNIV
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
CENT SOUTH UNIV
Publication Date
2009-01-14
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to polyurethane modified epoxy resin encapsulating material filled with promiscuous padding and the preparation method, in particular to epoxy resin encapsulating material prepared by adopting the promiscuous padding mixed by glass fiber power (MG) and SiO2 or AIN and the TDE-85 epoxy resin modified by polyurethane and the preparation method thereof. By adopting the polyurethane to toughen and modify the TDE-85 epoxy resin basal body, and adopting methyl tetrahydrophthalic anhydride methpa as the curing agent, 1,4-butylene-glycol as the chain extender, trimethylol propane as the crosslinking agent, 2,4,6-tris(dimethylamino methyl) phenol as the curing accelerator, and the mixture of the MG and the SiO2 or the AlN as the padding, the epoxy resin encapsulating material is made by evenly mixing the components according to the prescriptive mass ratio, which had good technical performance, in particular to the mechanical property. The experiment indicates that the promiscuous padding can effectively make up for the performance defects of the epoxy resin encapsulating material filled with single particle padding, and has good integrated performance.
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Description

technical field

[0001] The invention belongs to the field of new polymer materials, and the invention relates to an epoxy resin potting material and a preparation method thereof, especially glass fiber powder (MG) and SiO 2 Or AlN hybrid filler and polyurethane modified TDE-85 epoxy resin to prepare epoxy resin potting material and method thereof. Background technique

[0002] Epoxy resin potting materials have excellent mechanical properties, electrical insulation, heat resistance, corrosion resistance, and good bonding properties with various materials, so they are widely used in the overall potting and sealing of electronic products. It is of great significance to improve the integrity of electronic devices, resistance to external impact, insulation between internal components, and light weight of devices. At present, 80% to 90% of foreign semiconductor devices (almost all in Japan) are potted with epoxy resin, and its development situation is very promising. However, w...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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