Method for machining wafer

Abstract

Provided is a method for machining a wafer to obtain wafer-scale chip scale package (WLCSP) with good quality. The method comprises: a first cutting groove forming step, including forming a first cutting groove having a depth corresponding to the finished thickness of a device along a dividing preset line from a front side of the wafer with a cutting tool having a first thickness; a molding step, including coating the front side of the wafer subjected to the cutting groove forming step with a molded resin and embedding the molded resin in the first cutting groove; a second cutting groove forming step, including forming a second cutting groove reaching the wafer and having the depth deeper than that of the molded resin coating the front side of the wafer and that of the molded resin embedded in the molded resin with a cutting tool having a second thickness thinner than a first thickness; a protective member adhering step, including applying a protective member to the surface of the molded resin deposited on the front surface of the wafer on which the second cutting groove forming step is performed; and a back surface grinding step, including grinding the back surface of the wafer on which the protective member attaching step is carried out so that the second cutting groove is exposed to divide the wafer into individual devices.

Description

technical field [0001] The present invention relates to a processing method of a wafer, wherein a plurality of planned dividing lines are formed in a lattice shape on the front surface of the wafer and devices are formed in a plurality of regions divided by the plurality of planned dividing lines, and the wafer is formed along the planned dividing lines. The wire is divided into individual devices, and the individual devices are covered with resin. Background technique [0002] In the semiconductor device manufacturing process, a plurality of regions are divided by dividing lines arranged in a grid on the front surface of a substantially disk-shaped semiconductor wafer, and devices such as ICs and LSIs are formed in the divided regions. The semiconductor wafer formed in this way is cut along planned dividing lines to divide the regions where the devices are formed to manufacture individual devices. [0003] In recent years, packaging technology has been developed in which a...

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Problems solved by technology

[0011] However, in any of the above-mentioned processing methods, there is a problem that when the molded resin buried in the cutting groove is cut by the cutting tool, the cutting edge of the cutting tool is bent due to the resistance of the molded resin, Introduces damage to the sides of devices that make up Wafer Level Chip Scale Packages (WLCSP)

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