Epoxide resin curing agent, epoxide resin embedding glue and confecting method thereof

Abstract

The invention discloses an epoxy resin curing agent, an epoxy resin pouring sealant as well as the relevant preparation methods. The epoxy resin curing agent comprises 10 to 60 diaminodiphenylmethane, 20 to 70 diaminodiphenyl ether or diaminodiphenylsulfone, and 10 to 40 multi-amine curing agent, all calculated in pbw (part by weight). The preparation method for the curing agent comprises the following steps: mixing and heating the substances, raising the temperature to 90-110 DEG C, then stirring for 1 to 3 hours in thermal insulation state, and finally simply cooling the mixture to room temperature. The curing agent is liquid under normal temperature, and mixes well with the epoxy resin. The epoxy resin pouring sealant comprises 100 pbw epoxy resin which has at least two epoxy groups and is liquid under normal temperature, and 10 to 40 pbw epoxy resin curing agent; the preparation method for the pouring sealant comprises the following steps: adding the epoxy resin curing agent into the epoxy resin, mixing for 10 to 30 minutes, then debubble in vacuum state for 10 to 30 minutes, and finally simply removing the vacuum state. The transition temperature of vitrification for the pouring sealant thus acquired is pretty high, and the compound of epoxy resin cured is excellent in electromechanical and thermal performance.

Description

(1) Technical field [0001] The invention relates to the application field of epoxy resin, in particular to an epoxy resin curing agent, an epoxy resin potting glue obtained by using the curing agent and a preparation method thereof. (2) Background technology [0002] Epoxy resin potting glue is an epoxy resin composition obtained by mixing epoxy resin curing agent, epoxy resin and additives. At present, commonly used amine epoxy resin curing agents include aliphatic amines and their modified curing agents for medium temperature curing and aromatic amine curing agents for high temperature curing. [0003] The aliphatic amines and their modified curing agents cured at medium temperature are liquid at room temperature, easy to mix with epoxy resin, and have good process performance. However, due to its low cross-linking density and low glass transition temperature, it is difficult to obtain satisfactory heat resistance of the obtained epoxy resin composition. [0004] Aromati...

AI Technical Summary

Problems solved by technology

In the hot state, the viscosity of the mixture is relatively large, and the pot life is relatively short, which is difficult to meet the requirements of the general casting process.

In addition, the curing temperature of these aromatic ami