Technological process for manufacturing rigid bent plate

A process flow and a technology for bending plates, applied in the field of PCB board manufacturing, can solve problems such as difficulty in bending, and achieve the effects of compact structure, light weight and improved reliability

Pending Publication Date: 2020-10-27
科惠白井(佛冈)电路有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a production process of rigid bending plat

Method used

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  • Technological process for manufacturing rigid bent plate
  • Technological process for manufacturing rigid bent plate
  • Technological process for manufacturing rigid bent plate

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Embodiment Construction

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0042] see Figure 1 to Figure 9 , the present invention provides a technical solution for the production process of a rigid bent plate: a process flow for the production of a rigid bent plate, characterized in that it includes the following steps:

[0043] S1: Cutting: Select a suitable copper-clad substrate for cutting when making rigid bending boards.

[0044] S2: Inner layer circuit: Lay the circuit board printed in the previous stage on the copper-clad s...

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Abstract

The invention discloses a technological process for manufacturing a rigid bent plate. The technological process comprises the steps of selecting a proper copper-clad substrate for cutting operation when the rigid bent plate is manufactured; attaching a circuit board printed in the earlier stage to the copper-clad substrate on the cut copper-clad substrate; etching the circuit after transfer printing, and cleaning the circuit board when the copper film exposed on the circuit board is completely etched; additionally arranging a copper-clad substrate on the etched circuit board, and laminating the copper-clad substrate and the circuit board; metalizing resin and glass fiber of the non-conductor part on the hole wall of the circuit board, and carrying out electro-coppering on the circuit board; mounting an outer layer circuit according to the requirement of manufacturing the circuit board; carrying out copper plating and tin plating on the outer-layer circuit; etching a dry film on the circuit board and the copper under the protection of the dry film, and printing solder mask ink on the circuit board through silk-screen printing; and adopting a depth-controlled milling machine and a Cvertical special milling tool. The rigid bent plate designed by the invention can be bent according to installation requirements so as to adapt to different installation environments.

Description

technical field [0001] The invention relates to the technical field of PCB board manufacturing, in particular to a manufacturing process flow of a rigid bent board. Background technique [0002] Printed circuit board {PCB circuit board}, also known as printed circuit board, is a provider of electrical connections for electronic components. Its design is mainly layout design; the main advantage of using circuit boards is to greatly reduce wiring and assembly errors and improve According to the level of automation and production labor rate, according to the number of layers of circuit boards, it can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards, because printed circuit boards are not general end products. [0003] Rigid-flex board has both the durability of rigid PCB and the adaptability of flexible PCB. Rigid-flex board is light, thin, and compact, which increases assembly flexibility and rel...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/02
CPCH05K3/00H05K3/0002H05K3/02
Inventor 张伟连
Owner 科惠白井(佛冈)电路有限公司
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