Printed wiring board fabrication method, printed wiring board photomask, and program for creating a photomask

A technology of printed circuit board and manufacturing method, which is applied in the direction of printed circuit manufacturing, printed circuit making wiring diagram, printed circuit, etc., can solve the problem of unsuitable wiring pattern and the like

Inactive Publication Date: 2007-02-14
SHARP KK
View PDF2 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] However, in the above-mentioned prior art 3, since the correction is performed at the curved portion, it is not applicable to the wiring pattern of the straight portion other than the curved portion.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed wiring board fabrication method, printed wiring board photomask, and program for creating a photomask
  • Printed wiring board fabrication method, printed wiring board photomask, and program for creating a photomask
  • Printed wiring board fabrication method, printed wiring board photomask, and program for creating a photomask

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0066] First, a method of manufacturing a printed wiring board according to the present invention will be described.

[0067] The substrate of the printed circuit board is made of insulating resin such as glass fiber epoxy resin and paper phenolic resin. A metal foil such as copper foil is formed on the surface of the substrate. Then the dry film photoresist layer is pasted on the metal foil, overlapped with the photomask, and the resist layer is formed by irradiating ultraviolet rays. Then, the portion not covered with the resist layer is etched with an etchant. Then, the resist layer is removed, a wiring pattern is formed, and finally, a printed circuit board is produced.

[0068] The wiring pattern has a circuit pattern constituting a circuit and a dummy pattern not required for constituting the circuit. The circuit pattern has, for example, pads connected to terminals such as semiconductors, terminals connected to other electronic components, leads connected to these pa...

Embodiment approach 2

[0090] Below, refer to Figure 1 to Figure 7 The photomask for printed wiring boards concerning this invention is demonstrated.

[0091] A mask pattern for manufacturing the wiring pattern 20 is formed on the photomask. As described in Embodiment 1, the wiring pattern 20 has a circuit pattern constituting a circuit and a dummy pattern 21 which is unnecessary for constituting the circuit. On the contrary, the mask pattern has a circuit pattern, a circuit mask pattern corresponding to the dummy pattern 21, and a dummy mask pattern.

[0092] When manufacturing the printed wiring board 1, by using such a photomask, a photoresist layer corresponding to the circuit pattern and the dummy pattern 21 can be formed, and the printed wiring board 1 with the circuit pattern and the dummy pattern 21 can be produced.

Embodiment approach 3

[0094] Below, refer to Figure 1 to Figure 7 The photomask creation program according to the present invention will be described.

[0095] The photomask generating program has a circuit block for forming a circuit mask pattern from a circuit pattern constituting a circuit, a dummy block for forming a dummy mask pattern corresponding to the dummy pattern 21, and a synthetic circuit mask pattern and a synthesis of the dummy mask pattern. department.

[0096] The circuit module generates a circuit mask pattern with respect to the circuit pattern input to the photomask generation program.

[0097] The dummy module designs the position and shape where the dummy pattern 21 can be arranged according to the circuit pattern input into the photomask generating program, and generates a corresponding dummy mask pattern according to the designed dummy pattern 21 .

[0098] In addition, the circuit mask pattern and the dummy mask pattern are synthesized by the synthesizing unit to generat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention is configured such that a wiring pattern, formed by forming an etching resist on metal foil that has been layered on an insulating resin board and performing etching via this etching resist, is provided with a circuit pattern constituting an electronic circuit and a dummy pattern provided in the vicinity of and separated from the circuit pattern, such that side etching of the circuit pattern is suppressed by mitigating the rate at which etching advances for the circuit pattern.

Description

[0001] This application claims priority based on Japanese Patent Application No. 2005-232053 filed on August 10, 2005 in Japan. By mentioning this matter, this application includes its entirety. technical field [0002] The present invention relates to a method of manufacturing a printed wiring board for forming a wiring pattern, a photomask for a printed wiring board, and a photomask generation program. Background technique [0003] First, a conventional method of manufacturing a printed circuit board will be described with reference to the drawings. [0004] The substrate of the printed circuit board is composed of insulating resin, and copper foil is laminated on the surface. A dry film photoresist layer is pasted on the copper foil, overlapped with a photomask, and a resist layer is formed by irradiating ultraviolet rays. Next, the portion not covered with the resist layer is etched with an etchant. Then, the resist layer is removed to form a wiring pattern, and final...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06
CPCH05K1/111H05K3/0002H05K3/06H05K2203/056H05K3/064H05K2201/09781
Inventor 上野幸宏冈林升
Owner SHARP KK
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap