A high-strength PCB circuit board conductive silver paste, made of the following raw materials in parts by weight: antimony tin oxide 10‑20, calcium sulfate whiskers 2‑4, micron silver powder 50‑60, tantalum carbide whiskers 4‑6, Herotropine 1‑2, glass powder 7‑10, isopropyl tris (dioctyl pyrophosphate acyloxy) titanate 1‑2, E‑12 epoxy resin 8‑12, isocyanate 2‑3, Diethylene glycol 3-5, glyceryl triacetate 5-7, itaconic acid 1-2, terpineol 4-6; the silver paste of the present invention increases printing by adding calcium sulfate whiskers and tantalum carbide whiskers. The strength of the circuit is not easy to fall off and break; by adding tin antimony oxide, while ensuring excellent electrical conductivity, the amount of silver powder is saved, and the prepared silver paste has low cost, excellent electrical conductivity and good dispersibility; by using the glass of the present invention Powder, low melting point, easy to solidify and form, does not affect electrical conductivity.