Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Carbon nanotube containing PCB silver paste and preparation method thereof

A PCB circuit board and carbon nanotube technology, which is applied in the manufacture of circuits, printed circuit components, cables/conductors, etc., can solve the problems of scrapped conductive lines, falling off of conductive lines, melting of glass phase, etc., so as to save consumption and not easily break , easy sintering effect

Inactive Publication Date: 2015-09-23
TONGLING HONGZHENG NETWORK SCI & TECH CO LTD
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The binder in the conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film formation, solvent volatility, etc. will affect the printing performance of the circuit , there are pores, open circuits, etc., and sometimes the glass phase has not yet begun to melt after the organic matter has volatilized, resulting in the phenomenon that the conductive line falls off from the substrate, and the conductive line is scrapped. Therefore, the performance of the organic binder needs to be improved.
[0006] At present, many inorganic binders use glass powder. Glass powder is made of metal oxides, silicon oxide and other materials. If the melting point is too high, the glass phase has not yet started to melt after the volatilization of organic matter is completed, resulting in conductive lines obtained from conductive silver paste. The phenomenon of falling off from the substrate makes the conductive circuit scrapped; and many of the current glass powders contain harmful substances such as lead, which is not good for the environment, so it is necessary to develop glass powders with better performance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] A silver paste for PCB circuit boards containing carbon nanotubes, made of the following raw materials in parts by weight (kg): ultrafine silver powder 60, silver-coated glass powder 15, aluminum stearate 1.5, glass powder 9, ethylene dioleic acid Amide 1.5, non-drying alkyd resin 9, polyurethane resin 2.5, ethyl acetate 5, diisobutyl ketone 4, butyl carbitol acetate 4, ethanol 4, linseed oil 0.6, carbon nanotubes 5, grape Seed oil 0.4, simethicone 0.4;

[0018] The glass powder is made of the following raw materials in parts by weight (kg): SiO2 11, V2O5 17, Sb2O3 6, fumed alumina 3, activated alumina 17, P2O5 5, anoxic cerium oxide 4, MgO2.5, Four-needle zinc oxide whisker 3; the preparation method is: mix SiO2, V2O5, Sb2O3, gas-phase aluminum oxide, activated alumina, P2O5, anoxic cerium oxide, and MgO, put them into a crucible, and heat and melt at 1300 ° C to form Liquid, then add four-needle zinc oxide whiskers, stir evenly, and then carry out vacuum defoaming, t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
widthaaaaaaaaaa
thicknessaaaaaaaaaa
electrical resistivityaaaaaaaaaa
Login to View More

Abstract

A carbon nanotube containing PCB silver paste comprises the following raw materials by weight: 55-65 parts of superfine silver powder, 10-20 parts of silver-coated glass powder, 1-2 parts of aluminum stearate, 8-10 parts of glass powder, 1-2 parts of ethylene bis oleamide, 7-10 parts of non-dry alkyd resin, 2-3 parts of polyurethane resin, 4-6 parts of acetic ether, 3-5 parts of diisobutyl ketone, 3-5 parts of butyl carbitol acetate, 3-5 parts of ethanol, 0.4-0.7 parts of linseed oil, 3-6 parts of carbon nanotubes, 0.2-0.5 parts of grape seed oil, and 0.3-0.6 parts of dimethyl silicone oil. As carbon nanotubes are added, the electrical conductivity, dispersity and circuit bonding strength are increased, the silver paste is not easy to fracture or fall off, and the consumption of silver powder is reduced. Through the use of glass powder, the melting point is low, sinter-molding is easy, and the electrical conductivity is not affected. Moreover, the silver paste has good printing performance, and the circuit is clear and continuous and has no bubbles.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, in particular to a silver paste for a PCB circuit board containing carbon nanotubes and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The printed circuit board (PCB) was born to meet the needs of the microelectronics industry. Correspondingly, conduct research on new conductive pastes to match electronic pastes such as conductive pastes, electrode pastes, dielectric pastes, resistor pastes, and hole filling pastes with printed circuit boards (PCBs) that require new requirements. It is imperative. [0003] Generally speaking, the main components of electronic paste include functional phases such as metal, noble metal powder, etc., inorganic binders such as glass powder, oxide p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B1/16H01B13/00H05K1/09
Inventor 周正红
Owner TONGLING HONGZHENG NETWORK SCI & TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products