19 results about "Fin height" patented technology

A heat sink including a substrate having an upper surface. A plurality of fins extends outwardly from the upper surface. The plurality of fins extend from a base to a tip and a fin height is defined by a distance between the base and the tip. A plurality of dimples are round and 3D-printed. The plurality of dimples are located between the plurality of fins or on the plurality of fins.

The utility model provides a micro-channel heat exchanger. Comprising a liquid inlet pipe, a liquid outlet pipe, a flat pipe and fins, the liquid outlet pipe is parallel to the liquid inlet pipe, the flat pipe comprises a plurality of straight pipe sections which are arranged side by side at intervals, a plurality of bent pipe sections which are sequentially connected with two adjacent straight pipe sections in series and flow channels which extend along the interiors of the straight pipe sections and the bent pipe sections, and the two ends of the flat pipe are connected with the liquid inlet pipe and the liquid outlet pipe respectively. The fins are arranged between every two adjacent pipe sections and extend along the straight pipe sections to form a wavy structure, and the width of the flat pipes is smaller than that of the fins. On the premise that the width of the fins is not changed or the height of the fins is slightly increased, the overall weight is lighter by reducing the width of the flat pipes, increasing the heat exchange amount of the micro-channel heat exchanger and reducing wind resistance, and the overall performance and cost of the micro-channel heat exchanger are superior to those of a traditional micro-channel heat exchanger.

A semiconductor device includes: a vertical transport field-effect transistor (VTFET) device including a bottom source / drain (S / D) epitaxial layer, a vertical fin channel formed on the bottom S / D epitaxial layer, and a top S / D epitaxial layer formed on the vertical fin channel. The bottom S / D epitaxial layer has an asymmetric profile in cross-section where a first side of the vertical fin channel is aligned with a first side of the bottom S / D epitaxial layer, and the bottom S / D epitaxial layer has a stepped profile that extends beyond a second edge of the vertical fin channel.

A method of forming first and second fin field effect transistors (finFETs) on a substrate includes forming first and second fin structures of the first and second finFETs, respectively, on the substrate. The first and second fin structures have respective first and second vertical dimensions that are about equal to each other. The method further includes modifying the first fin structure such that the first vertical dimension of the first fin structure is smaller than the second vertical dimension of the second fin structure and depositing a dielectric layer on the modified first fin structure and the second fin structure. The method further includes forming a polysilicon structure on the dielectric layer and selectively forming a spacer on a sidewall of the polysilicon structure.

The application relates to a simple design method of a low-cost embedded core module radiator, which comprises the following steps: firstly, a radiator design model is constructed, the radiator design model is composed of a substrate, a plurality of radiator fins, air ducts formed between the radiator fins, and a heat dissipation step below the substrate; secondly, the radiator power consumption is preset, the radiator fin height is estimated, natural heat dissipation and forced air cooling heat dissipation are evaluated according to a natural heat dissipation and forced air cooling heat dissipation evaluation algorithm, if the evaluation result is forced air cooling heat dissipation, then the radiator height suggestion value is obtained based on the air duct characteristic curve of the radiator and the characteristic curve of a heat dissipation fan and according to a forced air cooling radiator design algorithm; compared with general experimental methods and computer simulation design methods, the technical scheme has the advantages of simple and convenient scheme, high design success rate based on the embedded core module of the company, and the like.

The present disclosure describes a method to form silicon germanium (SiGe) source / drain epitaxial stacks with a boron doping profile and a germanium concentration that can induce external stress to a fully strained SiGe channel. The method includes forming one or more gate structures over a fin, where the fin includes a fin height, a first sidewall, and a second sidewall opposite to the first sidewall. The method also includes forming a first spacer on the first sidewall of the fin and a second spacer on the second sidewall of the fin; etching the fin to reduce the fin height between the one or more gate structures; and etching the first spacer and the second spacer between the one or more gate structures so that the etched first spacer is shorter than the etched second spacer and the first and second etched spacers are shorter than the etched fin. The method further includes forming an epitaxial stack on the etched fin between the one or more gate structures.

A semiconductor IC device is presented and includes a first region and a second region. The first region includes a first fin upon a backside interlayer dielectric (ILD) comprising a first fin height or a first effective channel width. The second region includes a second fin upon the backside ILD comprising a second fin height or a second effective channel width that is less than the first fin height or the second effective channel width, respectively. The reduced second fin height or a second effective channel width may be provided by processing the second fin from the backside of the semiconductor IC device.

The invention relates to the technical field of copper part manufacturing, and discloses an external-fin internal-thread double-effect copper pipe for a heat pump system and a manufacturing method thereof.The manufacturing method comprises the steps that a preset copper raw material is melted and then subjected to horizontal continuous casting, a hollow copper pipe blank is subjected to planetary rolling, the outer side of an internal-thread copper pipe is coaxially sleeved with a preset aluminum pipe, and a composite pipe is subjected to expansion treatment; forming a plurality of groups of spiral fins on the copper-aluminum composite tube blank in an inclined angle distribution manner to obtain the double-effect copper tube with the outer fins and the inner threads; the spiral fin structure distributed in an inclined angle mode is machined on the outer surface of the copper-aluminum composite pipe blank, vacuum annealing and inert gas cooling treatment are assisted, the formed outer fin has good shape consistency and mechanical stability, the stress concentration risk of the root of the fin is remarkably reduced, and the service life of the outer fin is prolonged. According to the whole structure, the problem of stress cracking in the fin forming process of copper material integral forming is avoided, further improvement of the height and density of the fins is guaranteed, and therefore the effective heat exchange area of the air side of a heat pump system is expanded.

The utility model relates to the technical field of sealing tooth measurement, in particular to a turbine rotor sealing fin height detection tool. The tool comprises a dial indicator and a dial indicator frame, the dial indicator penetrates through the dial indicator frame in the longitudinal direction and is connected with the dial indicator frame, the dial indicator comprises a measuring head, the measuring head is arranged below the dial indicator frame, the measuring head is provided with grooves matched with the sealing teeth, and the measuring head rolls on the sealing teeth in the circumferential direction of the sealing piece and is used for measuring the height of the sealing teeth. The device further comprises a plurality of first rolling wheels, the plurality of first rolling wheels are symmetrically arranged on the two sides of the meter frame along the center line of the measuring head, and the width of each first rolling wheel is matched with the width of a sealing gap between every two adjacent sealing teeth. According to the utility model, the height of the sealing sheet can be directly and accurately measured before trial assembly of a rotor, and the accurate turning amount of each sealing tooth can be directly obtained by comprehensively calculating the size of the inner hole of the sealing sleeve, so that the accurate measurement of the height of the sealing tooth is realized.

This invention provides a cost-effective and efficient spiral condenser, comprising a condensing assembly including a condensing tube, heat dissipation fins, a liquid inlet pipe, a liquid outlet pipe, and a baffle sponge. The condensing tube is a serpentine pipe, and heat dissipation fins are uniformly fixedly connected to its outer wall. This invention's innovative design of the condensing system's airflow enhances heat dissipation efficiency. In the production of small condensers, the height of the heat exchange fins can be determined based on the outer diameter of the heat exchange tube, ensuring good condensation performance while reducing the fin height, saving materials and installation space. Furthermore, the condensing assembly can be fixed to the cooling system using a mounting component, which is easy to assemble, simple in structure, and low in cost. By arranging the heat exchange fins in a spiral shape, wind resistance and noise are reduced during external airflow, minimizing the environmental impact of the condenser's operation.

A dowel pin is disclosed. The dowel pin has a central shaft, one or more fins, and at least one channel. The shaft includes a plurality of shaft sections having similar or different height and width dimensions. The one or more fins each have a fin length and a fin height, and extend outward from the shaft around discrete perimeters of the shaft. The one or more fins are spaced incrementally along the length of the shaft with even and uneven spacing. The at least one channel extends approximately an entire length of the shaft.

A liquid-cooling heat dissipation plate having an uneven fin density and an unequal fin height includes a heat dissipation plate body having first and second heat dissipation surfaces opposite to each other, and multiple full-height fins and non-full-height fins formed on the second heat dissipation surface. The heat dissipation plate body is divided into a first to an N-th heat dissipation region along a cooling-liquid flowing direction. Multiple chips correspond in position respectively to the first to the N-th heat dissipation region. Each heat dissipation region is divided into a front region, a heat source region, and a rear region according to the cooling-liquid flowing direction. In each heat dissipation region, a fin density of the heat source region is greater than or equal to that of the rear region, and the fin density of the heat source region is greater than that of the front region.

The inner spiral finned tube of the present invention includes a tube body, a plurality of grooves arranged in the inner peripheral direction of the aforementioned tube body, and a plurality of fins, characterized in that the aforementioned plurality of grooves and the aforementioned plurality of fins are formed in a spiral shape in the longitudinal direction of the aforementioned tube body, the outer diameter of the aforementioned tube body is 3 mm or more and 10 mm or less, the number of the aforementioned fins formed on the inner peripheral surface of the aforementioned tube body is 30 to 60, the aforementioned inner spiral finned tube is made of metal, the cross-sectional shape of each of the aforementioned fins in the cross section of the aforementioned tube body is a rectangle with an apex angle of 0 ± 10º, the ratio h / f is 0.90 or more and 3.40 or less, h is the fin height, f is the fin width, the ratio c / f is 0.50 or more and 3.80 or less, c is the fin pitch between adjacent fins in the aforementioned inner peripheral direction of the aforementioned tube body, and the average value obtained by summing the aforementioned ratio h / f and the aforementioned ratio c / f and dividing the sum by two is 0.8 or more and 3.3 or less.

The present disclosure relates to techniques of active cooling of an electronic device. Particularly, it is provided a cooling device comprising a base plate comprising a first main surface extending in a longitudinal direction and comprising a plurality of fins extending from the first main surface in a fin height direction. Each fin has a cross section perpendicular to the fin height direction with a contour defined by two halves of the contour that are symmetric to each other with respect to a symmetry axis perpendicular to the fin height direction, wherein the first half of the two halves of the contour consists of a first round arc region between and extending into a first and a second extension region and the second half of the two halves of the contour consists of a second round arc region between and extending into a third and a fourth extension region.

A serrated panel for a trailing edge of a wind turbine rotor blade, the serrated panel comprising a plurality of teeth, each tooth having a tip, a base, two edges continuing from the tip to the base, a longitudinal axis, a pressure side surface and a suction side surface, and a plurality of vanes arranged side by side with gaps between adjacent vanes, each fin starts at one of said edges and extends in a rearward direction, where each fin has a fin length, a fin width and a fin height, characterized in that the pressure side surface and / or the suction side surface of the tooth comprises a wave-shaped element starting at or near one of the edges and extending in a forward direction, wherein each waveform element has a peak aligned with one of the fins and a waveform element width greater than the fin width.

The invention discloses a chip based on a novel heat dissipation structure and a manufacturing method. The chip comprises a chip body, a 3D heat dissipation channel layer integrated on the surface of the chip body and a micro-nano structure heat dissipation fin layer covering the outer surface of the 3D heat dissipation channel layer. The 3D heat dissipation channel layer is made of a graphene-carbon nanotube composite heat conduction material, honeycomb-shaped heat dissipation channels which are communicated with one another are formed in the 3D heat dissipation channel layer, the aperture of each honeycomb-shaped heat dissipation channel is 5-20 microns, and the thickness of the channel wall is 1-3 microns; the fin height of the micro-nano structure heat dissipation fin layer is 10-50 microns, the fin distance is 5-15 microns, and the surfaces of the fins are provided with nanoscale concave-convex texture.The manufacturing method is simple, heat can be rapidly and effectively transmitted to the external environment from the interior of the chip, the temperature of the chip in the working process can be reduced, the heat dissipation efficiency of the chip is improved, and the service life of the chip is prolonged. And the problem of performance reduction caused by over-high temperature can be reduced, and the chip can be ensured to efficiently operate in a stable temperature range.

The application discloses a three-dimensional variable cross-section airfoil fin heat exchange plate core structure, and relates to the technical field of heat exchangers. The heat exchanger core is formed by diffusion welding of a plurality of alternately arranged hot-side heat exchange plates and cold-side heat exchange plates. The hot-side heat exchange plates and the cold-side heat exchange plates are photochemically etched to form three-dimensional variable cross-section airfoil fin structures in the respective interiors. Fluid flow channels are formed between the hot-side heat exchange plates and the cold-side heat exchange plates. The cross-section of the three-dimensional variable cross-section airfoil fin structure is in the shape of a NACA airfoil, and mainly comprises an airfoil fin upper end surface, an airfoil fin 1 / 2 fin height cross-section and an airfoil fin lower end surface. The side walls of the airfoil fin upper end surface and the airfoil fin lower end surface connected to the airfoil fin 1 / 2 fin height cross-section are both smooth curves. The application can effectively reduce the flow resistance of the heat exchanger, improve the comprehensive heat exchange performance of the airfoil flow channel printed circuit board heat exchanger, and reduce the flow loss in the airfoil flow channel.

A heat sink for cooling computing devices is disclosed. The heat sink includes a plurality of fin stages arranged in spaced relation between an intake side and an exhaust side. The plurality of fin stages each include a plurality of fins extending along a flow direction. At least one of the plurality of fin stages is distinct in fin width and / or fin height from another one of the plurality of fin stages.