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a technology of thermal ducting and heat pipes, applied in the direction of cables, instruments, casings/cabinets/drawers of electric apparatus, etc., can solve the problem of adding to the cost of portable electronic devices, and achieve the effect of reducing acoustic sound
Active Publication Date: 2013-12-12
APPLE INC
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[0021]Additionally, during operation of the heat pipe, the sealed housing may reduce ac
Problems solved by technology
However, heat-dissipation mechanisms for portable electronic devices generally involve the use of additional parts and/or materials.
Such heat-diss
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[0044]FIG. 1 shows a bottom view of a portable electronic device 100, such as a laptop computer, with the bottom of the enclosure of portable electronic device 100 removed. Within portable electronic device 100, a number of components may be used to cool heat-generating components such as central-processing units (CPUs), graphics-processing units (GPUs), and / or video memory.
[0045]First, portable electronic device 100 may include a set of fans 102-104 for expelling heat generated by the heat-generating components outside portable electronic device 100. Fans 102-104 may utilize a set of intake and exhaust vents along a wall 118 of portable electronic device 100 to draw in cooler air from outside portable electronic device 100, circulate the air around the interior of portable electronic device 100 to dissipate heat from the heat-generating components, and expel the heated air out of portable electronic device 100.
[0046]Portable electronic device 100 may also include a heat pipe 106 th...
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Abstract
The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.
Description
CROSS REFERENCE TO RELATED APPLICATION[0001]This application claims priority under 35 U.S.C. §119(e) to: U.S. Provisional Application Ser. No. 61 / 657,532, entitled “Gaskets for Thermal Ducting Around Heat Pipes in Electronic Devices,” by Brett W. Degner, William F. Leggett and Jay S. Nigen, Attorney docket number APL-P14891USP1, filed on Jun. 8, 2012; and U.S. Provisional Application Ser. No. 61 / 657,454, entitled “Heat Pipe with Reduced Height,” by Frank F. Liang, and Richard H. Tan, Attorney docket number APL-P15187USP1, filed on Jun. 8, 2012, the contents of each of which are herein incorporated by reference.[0002]This application is also related to: U.S. Provisional Application Ser. No. 61 / 657,534, entitled “Fasteners for Creating Thermal Gaps in Electronic Devices,” by Brett W. Degner, Charles A. Schwalbach and William F. Leggett, Attorney docket number APL-P14893USP1, filed on Jun. 8, 2012; U.S. Provisional Application Ser. No. 61 / 657,505, entitled “Optimized Vent Walls in Elec...
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