108 results about "Thermal transport" patented technology

A system and method for performing a simulation of an electrosurgical procedure are disclosed. The method includes the steps of generating a three-dimensional medium, which includes one or more material regions representing a physical object. The method also includes the steps of dividing the medium into multiple hexahedron elements to generate a three-dimensional conformal mesh and assigning each element to the material region. The method further includes the steps of calculating an electrical energy solution and a thermal transport solution and generating graphical representations illustrating one or more aspects of the electrical energy and the thermal transport solutions.

A thermal transport structure having a thermal transport layer and a resin layer is provided. The thermal transport layer may include a first surface and a second surface, and having a thermally conductive material disposed in the thermal transport layer, where the thermally conductive material is oriented in a predetermined direction in order to facilitate heat conduction relative to the predetermined direction. Further, the resin layer is secured to the thermal transport layer second surface, where the resin layer is relatively less thermally conductive than the thermal transport layer.

Liquid-cooled electronics racks and methods of fabrication are provided wherein a liquid-based cooling apparatus facilitates cooling of electronic subsystems when docked within the electronics rack. The cooling apparatus includes a liquid-cooled cooling structure mounted to a front of the rack, and a plurality of heat transfer elements. The cooling structure is a thermally conductive material which has a coolant-carrying channel for facilitating coolant flow through the structure. Each heat transfer element couples to one or more heat-generating components of a respective electronic subsystem, physically contacts the cooling structure when that electronic subsystem is docked within the rack, and provides a thermal transport path from the heat-generating components of the electronic subsystem to the liquid-cooled cooling structure. Advantageously, electronic subsystems may be docked within or undocked from the electronics rack without affecting flow of coolant through the liquid-cooled cooling structure.

An article includes a display layer having an outward facing surface and an inward facing surface. The display layer includes a light-emitting device that generates heat and light during use. A thermal transport layer may be secured to the display layer. The thermal transport layer may include a thermally conductive material that can transport heat generated by the light-emitting device away from the light-emitting device.

An article includes a display layer having an outward facing surface and an inward facing surface. The display layer includes a light-emitting device that generates heat and light during use. A thermal transport layer may be secured to the display layer. The thermal transport layer may include a microfluidic layer including a coolant that can transport heat generated by the light-emitting device away from the light-emitting device. An article includes a display structure having a height, a width, and a thickness that define a volume. The display structure can include components that emit light to generate a three-dimensional image within the volume. The display structure includes a stack. The display structure also includes a thermal dissipation layer in contact with the sheet or stack that can transport generated heat from the sheet or stack to a heat absorbing structure.

A thermal management system for a gas turbine engine and / or an aircraft is provided including a thermal transport bus having a heat exchange fluid flowing therethrough. The thermal management system also includes a plurality of heat source exchangers and at least one heat sink exchanger. The plurality of heat source exchangers and the at least one heat sink exchanger are in thermal communication with the heat exchange fluid in the thermal transport bus. The plurality of heat source exchangers are arranged along the thermal transport bus and configured to transfer heat from one or more accessory systems to the heat exchange fluid, and the at least one heat sink exchanger is located downstream of the plurality of heat source exchangers and configured to remove heat from the heat exchange fluid.

An article includes a stack of display layers including a display layer having a high-shear modulus that is sandwiched between two display layers having a low-shear modulus. The display layers include a light-emitting device that generates heat and light during use. The heat generated by the display layers may form localized heat-sources in the stack. The display layer with the high-shear modulus is a thermal transport layer through which the localized heat-sources-induced guided elastic waves propagate along an acoustic waveguide plane and can transport the heat generated by the light-emitting device away from the light-emitting device. Alternately, a display layer having a high refractive index may be sandwiched between two display layers having a low refractive index. The display layers with low shear modulus or low refractive index may be replaced with thermal transport layers having low shear modulus or low refractive index respectively.