70 results about "Thermal transport" patented technology

A thermal management system includes a thermal circuit having a thermal transport bus with a thermal fluid flowing therethrough. The thermal transport bus includes first and second bus segments. First and second thermal loads are on the first and second bus segments, respectively, and have different first and second inlet temperature requirements. The thermal management system includes a plurality of heat exchangers in thermal communication with the first and second thermal loads. The heat exchangers include a first heat exchanger and one or more second heat exchangers. The first heat exchanger is on one of the first or second bus segments for rejecting heat to engine fuel. The thermal fluid is split between each of the first and second bus segments such that only a portion of the thermal fluid flows through the first heat exchanger to accommodate the different first and second inlet temperature requirements.

A receptacle assembly includes a receptacle cage including cage walls forming a cavity. The cage walls include a top wall, a first side wall, and a second side wall. The receptacle cage extending between a front and a rear. The cavity includes a module channel configured to receive a pluggable module. The receptacle assembly includes a thermal transport assembly coupled to the receptacle cage. The thermal transport assembly includes a thermal bridge is received in the cavity. The thermal bridge includes a thermal interface at a bottom of the thermal bridge configured to interface with the pluggable module and remove heat from the pluggable module. The thermal bridge includes an orientation tab extending from the bottom. The orientation tab defines a keying feature for keyed mating with the pluggable module to orient the pluggable module in the module channel.

Oil lubricated supercritical fluid pumps with oil separators are disclosed herein. An example pump system to pressurize a fluid within a closed loop thermal transport bus disclosed herein includes a pump housing, a duct fluidly coupled to the pump housing, a first portion of the duct to include a mixture of an oil and the supercritical fluid, a second portion of the duct to include the supercritical fluid, and a separator positioned in a third portion of the duct between the first portion of the duct and the second portion of the duct, the separator to separate the oil in the mixture from the supercritical fluid.

A computer-implemented method for modeling thermal and electrochemical properties of lithium-ion battery packs is disclosed. A physics-based thermo-electro-chemical battery model is received comprising electrochemical reaction equations and thermal transport equations. A computer aided design (CAD) file is imported defining physical cell arrangements within a battery pack. Thermal connectivity matrices are automatically generated from the CAD file, where the matrices define heat transfer pathways between adjacent cells. A scaling algorithm transforms single-cell Single-Particle Model (SPM) equations into multi-cell coupled differential equations for the battery pack. The thermal and electrochemical behavior are simulated across the battery pack using the scaled equations to determine at least one battery performance characteristic based on the simulation.

A closed-loop thermal management system includes a thermal transport bus configured to circulate a thermal working fluid therethrough, a thermal transport bus including a plurality of fluid conduits configured to circulate a thermal working fluid therethrough; an accumulator including a shell defining a multiphase fluid volume therein configured to contain a multiphase fluid. The shell defines an opening. The accumulator is fluidly coupled to the thermal transport bus in a closed-loop fluid circuit. A temperature regulator is configured to control a temperature of the multiphase fluid inside the multiphase fluid volume.

Method for storing and / or transporting temperature-sensitive materials. In one embodiment, the method involves predicting whether a given passive thermal shipping system will maintain a payload within a desired temperature range over its entire transport / delivery route. To this end, thermal capacitance data is compiled for the shipping system at a plurality of temperatures spanning a broad range of potential ambient temperatures to which the shipping system may be exposed. In addition, forecasted ambient temperature data is obtained for a plurality of time intervals spanning the transport / delivery route. An effective ambient temperature, based on the forecasted ambient temperature, as well as rolling and cumulative averages, is then determined at each of the various time intervals. Using the effective ambient temperature, the thermal capacitance is determined from the compiled data and is compared to the cumulative absorbed energy. The shipping system fails when the cumulative absorbed energy exceeds the thermal capacitance.

The present invention relates to an analysis method for the anisotropic thermal transport characteristics of a suspended WTe₂ film, comprising the following steps: S1, providing a suspended WTe₂ film; S2, determining the lattice orientation of the suspended WTe₂ film; S3, performing photo-heating Raman and electro-heating Raman tests along different lattice directions, thereby calculating the in-plane thermal conductivity and the thermal transport anisotropy ratio of the suspended WTe₂ film along the zigzag direction and the armchair direction. By analyzing the anisotropic thermal transport characteristics of the suspended WTe₂ through the method of the present invention, it can provide reference and guidance for the structural design, performance optimization, and regulation and management of thermal dissipation of WTe₂ functional devices.

The application discloses an interlayer-coupled reduced graphene oxide (rGO) film, a preparation method and application thereof. Although single-layer graphene sheets have excellent intrinsic thermal conductivity, stacked graphene films have serious thermal anisotropy and poor out-of-plane thermal transport performance due to weak van der Waals interaction between layers. The application discloses a strategy for scalable preparation of an interlayer-coupled rGO film, which is connected by covalent carbon bonds between stacked layers. A representative 200 μm-thick film prepared by the strategy has in-plane and out-of-plane thermal conductivities of 1465±63 W·m ‑1 ·K ‑1 and 14.0±1.2 W·m ‑1 ·K ‑1 , respectively. Under an extreme heat flux of 1200 W·cm ‑2 , the film can reduce temperature by 110℃ within 20 s and has excellent cycle stability. The film has high thermal and electrical conductivity, and can realize fast, uniform and durable electrothermal heating, and can be applied to the field of advanced thermal management.

The invention discloses a power semiconductor module residual life prediction method and device and a medium, and relates to the technical field of semiconductor life prediction, and the method comprises the steps: enabling collected material lattice parameters and thermodynamic working condition data to generate a transport data set through a molecular dynamics simulation method, and generating an inverted space group velocity tensor field according to the transport data set; generating a thermodynamic entropy change index according to the inverted space group velocity tensor field; performing time sequence accumulation analysis based on thermodynamic entropy change indexes, and outputting a phonon entropy change feature sequence; extracting a statistical feature subset and a dynamic gradient subset from the phonon entropy change feature sequence; constructing a pulse neural network and inputting the phonon entropy change feature sequence to generate an operation function; calling a transport equation and initializing based on the statistical feature subset to generate an initial transport equation; according to the method, the collision term of the transport equation is dynamically reconstructed through the pulse neural network, accurate modeling of the phonon scattering nonlinear effect is achieved, and the problem of mismatching of the heat transport model under the variable working condition is solved.

The invention relates to a Cs3Bi2I9 single-crystal material with double heat transfer operation parameters as well as a preparation method and application thereof, and belongs to the technical field of single-crystal materials. The preparation method comprises the following steps: uniformly mixing and grinding CsI and BiI3 according to a stoichiometric ratio, transferring into a quartz tube, vacuumizing and packaging, and sequentially carrying out high-temperature melting, quenching and annealing to obtain a Cs3Bi2I9 polycrystalline cast ingot of which the density is not less than 97%; placing the Cs3Bi2I9 polycrystalline cast ingot in a sealed quartz tube, placing the sealed quartz tube in which the Cs3Bi2I9 polycrystalline cast ingot is packaged in a vertical temperature gradient furnace, melting at high temperature, and cooling to room temperature, thereby obtaining the Cs3Bi2I9 single crystal material with the double heat transfer operation mode. Compared with the prior art, the Cs3Bi2I9 single crystal material with a unique double-heat transport behavior is innovatively prepared, a new design idea is provided for regulating and controlling heat transport through a crystal chemical means, and a new path is opened up for developing an anisotropic thermoelectric material with a heat management function.

The invention provides a semiconductor phonon thermal transport data management system and a semiconductor phonon thermal transport data management method, and relates to the technical field of micro-nano electronic device thermal simulation and material thermophysical property management. The system comprises a database module used for storing and managing a phonon heat transport database, the phonon heat transport database comprises thermophysical property data of a semiconductor material, and the thermophysical property data of the semiconductor material comprises a material table, a dispersion model table and a scattering model table. The material table, the dispersion model table and the scattering model table are stored by adopting a multi-table association architecture; and the data management and interface module is used for carrying out at least one of remote calling, authority management and multi-user isolation on the phonon heat transport database. The comprehensive influence of various factors on the phonon thermal performance of the material can be accurately reflected, and coupling modeling and systematic management of the thermal performance of the material under the multi-factor condition are achieved.

This invention discloses a method and system for screening high-performance layered nitride thermoelectric materials, comprising: obtaining a series of crystal structures of initial layered nitrides; performing magnetic tests on the materials using first-principles calculations to select non-magnetic materials; optimizing the structure of non-magnetic materials, and after calculation convergence, performing static calculations and electronic band structure calculations to select materials with a band gap range of 0.1~3 eV and high band structure degeneracy; calculating the partial charge density of the materials to determine whether there is a two-dimensional electron gas, i.e., alternating conductive and insulating layers; determining stability by performing phonon spectrum and molecular dynamics simulations on the materials to select materials with no imaginary frequencies in the phonon spectrum and stable dynamics; calculating the thermal transport properties of the materials, obtaining the lattice thermal conductivity and Green'sson parameters, and searching for materials with strong anharmonicity; and finally performing electrical transport calculations to obtain the ZT value of the materials.

The application relates to a method for regulating the thermal conductivity of a nanometer semiconductor interface in contact and non-contact states, which comprises the following steps: (1) establishing a molecular dynamics thermal transport model composed of a hot region A and a cold region B; (2) performing molecular dynamics simulation and data processing: comparing the interface thermal conductivities under different twist angles in the contact state and the non-contact state to determine the dependence of the interface thermal conductivity on the twist angle; in the contact state, comparing the overlapping areas of the phonon state density at the contact interface under different twist angles to determine the influence of the overlapping area of the phonon state density on the thermal transport of different interface twist angles; in the non-contact state, comparing the force constants of the interface interaction potential and the LJ potential under different twist angles to determine the influence of the force constant on the thermal transport of different interface twist angles. The application realizes effective regulation of the ITC by regulating the twist angle, the normal load and the potential well depth, and provides an important basis for the thermal management of nanometer devices.

A cooling system comprises a system heat sink and a first magnetocaloric thermal transport medium. The first magnetocaloric thermal transport medium is connected to the system heat sink. The first magnetocaloric thermal transport medium comprises a semimetal.

A method is provided for the controlled routing of hydronic flow within a climate control system. The method includes determining a condition type request for a plurality of area zones corresponding to a particular thermal zone. The method further includes determining a supply temperature type associated with at least a supply line of a primary supply loop and a supply line of a secondary supply loop. The supply temperature type is indicative of a thermal transport fluid temperature within the respective supply line. The method further includes providing an actuation signal set to a valve assembly. The actuation signal set is configured to describe a position for each value of the valve assembly and the position for each valve is based on the conditioning type request and the determined supply temperature types.

The invention relates to a thermally insulated transport container (1). The invention is characterized in that the central refrigerated goods chamber (40) is surrounded by a plurality of decentralized refrigerated goods chambers (41, 42, 43, 44, 45, 46), the decentralized refrigerated goods chambers are connected or can be connected to the central refrigerated goods chamber (40) via a respective transfer gate (41′, 42′, 43′, 44′, 45′, 46′), and the central refrigerated goods chamber (40) is equipped with a tubular ring slide device (6, 6′) that can be rotated about a central axis (X) and has at least one transfer opening (65), which can be brought into register with a respective transfer gate by rotating the ring slide device, in the peripheral wall (62) of the ring slide device, thereby forming a passage from a paired decentralized refrigerated goods chamber to the central refrigerated goods chamber (40).

The present disclosure relates to a device for thermal transport measurement, comprising: a female seat for electrically and thermally connecting with a sample holder in a pluggable manner, the sample holder being electrically and thermally connected with a sample as a thermal transport measurement object for bearing the sample; and the shielding cover is in airtight connection with the female seat and is used for sealing the sample support and the sample in a vacuum environment and shielding heat radiation of an external environment to the sample.

A method for measuring an atomic scale microscopic thermal conductivity, said method being based on a focused ion beam-based sample preparation method and scanning transmission electron microscopy-electron energy loss spectroscopy. A temperature gradient is generated by locally heating a sample in a scanning transmission electron microscope; the temperature is measured in the electron microscope by means of electron energy loss spectrums; local heating in a nano-scale region of a sample is realized, and a stable temperature field having a large temperature gradient is constructed; and atomically resolved phonon spectrum detection and temperature measurement are realized in space. Local temperature information and a relative value of a microscopic thermal conductivity can be measured at an atomic scale, so that the quantitative analysis of the microscopic thermal conductivities of structures at different positions inside the sample can be performed; and the present invention has the advantages of accurate measurement, high spatial resolution, capability of studying nano-scale thermal transport and micro-zone thermal conductivity, etc., and is suitable for samples having complex structures and a plurality of material systems.

A thermal management system includes a thermal circuit having a thermal transport bus with a thermal fluid flowing therethrough. The thermal transport bus includes first and second bus segments. First and second thermal loads are on the first and second bus segments, respectively, and have different first and second inlet temperature requirements. The thermal management system includes a plurality of heat exchangers in thermal communication with the first and second thermal loads. The heat exchangers include a first heat exchanger and one or more second heat exchangers. The first heat exchanger is on one of the first or second bus segments for rejecting heat to engine fuel. The thermal fluid is split between each of the first and second bus segments such that only a portion of the thermal fluid flows through the first heat exchanger to accommodate the different first and second inlet temperature requirements.

The invention relates to the technical field of thermoelectric materials, in particular to a preparation method of a wide-temperature-range high-performance n-type Bi2Te3-based magnetic nano composite thermoelectric material, which comprises the following steps: adding a Bi2Te2. 7Se0. 3 thermoelectric material into a Ni0. 3Zn0. 7Fe2O4 nano suspension to obtain a magnetic nano composite suspension, carrying out ultrasonic dispersion on the obtained suspension, and drying to obtain the wide-temperature-range high-performance n-type Bi2Te3-based magnetic nano composite thermoelectric material. And centrifuging the suspension subjected to ultrasonic dispersion, drying in vacuum, and sintering the obtained powder in vacuum to obtain the n-type Bi2Te3-based magnetic nano composite thermoelectric material. The magnetic effect and the nanometer effect generated by the Ni0. 3Zn0. 7Fe2O4 magnetic nanoparticles synergistically improve the electric and heat transport performance of the matrix thermoelectric material, and when x is equal to 0.43%, the obtained magnetic thermoelectric material has a high average zT value (0.72) within a wide temperature range (300-400 K), and the average zT value is significantly higher than the average zT value of the matrix material.

A heat pipe is provided that that can raise the efficiency of circulation of a working fluid, and thereby possesses a superior thermal transport property. A heat pipe 1 includes a container 2 having an internal space S in which a working fluid F is sealed, the container 2 including: a evaporation portion 3 that evaporates a liquid-phase working fluid FL to change phase to a gas-phase working fluid Fg; a condensation portion 4 arranged at a position that is separated from the evaporation portion 3, and condenses the gas-phase working fluid Fg to change phase into the liquid-phase working fluid FL; and a middle portion 5 positioned between the evaporation portion 3 and the condensation portion 4; in which, viewing a transverse section of the evaporation portion 3, the heat pipe includes: a first sintered body layer 6 consisting of a sintered body of a first copper powder, and formed in a specific area on an inner circumferential surface 2a of the container 2; and a second sintered body layer 7 consisting of a sintered body of a second copper powder having a larger average particle size than the first copper powder, and formed annularly over an entirety of an inner circumferential surface 2a of the container 2, in a state in which the first sintered body layer 6 is interposed between the inner circumferential surface 2a of the container 2 and the second sintered body layer.

Jet engine thermal transport bus pumps are disclosed. Disclosed herein is an aircraft comprising a gas turbine engine configured to burn fuel at a fuel flow rate to generate an engine power (Pengine), the fuel characterized by a first specific heat capacity (cp_fuel) and a net heat of combustion (NHCfuel); and a thermal management system configured to transfer heat from a working fluid to a heat sink fluid, the working fluid characterized by a second specific heat capacity (cp_pump) and a first density (ρpump), the thermal management system including a pump configured to generate a pump power (Ppump) to pressurize the working fluid, and whereinPOW=Ppump(cp⁢_⁢pumpcp⁢_⁢water)⁢(ρwaterρpump)2,FFR=(PengineN⁢H⁢Cfuel)⁢(cp⁢_⁢fuelcp⁢_⁢pump),0.008≤POW / FFR5 / 3≤12, FFR is between 0.05 pounds-mass per second and 16 pounds-mass per second, and ρwater and cp_water is the density and specific heat capacity of water, respectively.

Method for storing and / or transporting temperature-sensitive materials, In one embodiment, the method involves predicting whether a given passive thermal shipping system will maintain a payload within a desired temperature range over its entire transport / delivery route. To this end, thermal capacitance data is compiled for the shipping system at a plurality of temperatures spanning a broad range of potential ambient temperatures to which the shipping system may be exposed. In addition, forecasted ambient temperature data is obtained for a plurality of time intervals spanning the transport / delivery route. An effective ambient temperature, based on the forecasted ambient temperature, as well as rolling and cumulative averages, is then determined at each of the various time intervals. Using the effective ambient temperature, the thermal capacitance is determined from the compiled data and is compared to the cumulative absorbed energy. The shipping system fails when the cumulative absorbed energy exceeds the thermal capacitance.

The invention discloses an infrared scene rendering method based on rasterization and path tracking hybrid architecture, and belongs to the field of image processing, and the method comprises the steps: building a corresponding heat transport tracking path for each heat transport mechanism in a virtual space; according to all the heat transport tracking paths, determining a comprehensive heat transport environment of a virtual space formed by the combined action of all heat transport mechanisms; rasterization rendering is carried out based on the comprehensive heat transport environment, so that an infrared image of the virtual space under the target virtual camera shooting view angle is obtained; and according to the infrared image, generating an imaging image under the target virtual camera view angle. According to the method, the authenticity of the infrared image is improved, the calculation cost and the visual angle sensitivity are reduced, and the adaptability of the infrared rendering process in a complex scene is enhanced.

The present invention relates to an insulated transport container (1) having an outer shell (2) surrounding an outer insulating chamber (28), an inner shell (3) disposed within the outer shell (2), and a cooling chamber shell (47) surrounding a cooling chamber (4), the cooling chamber shell (47) being connected to a closable tubular inlet channel element (5), the interior (52) of which opens to the cooling chamber (4). The cooling chamber (4) has a plurality of chambers (40, 41, 42, 43, 44, 45, 46) for receiving items (7) to be refrigerated, wherein the cooling chamber (3) has a central refrigerated item chamber (40), and the tubular inlet channel element (5) is disposed at the center of the outer shell (2) and the inner shell (3) and is flush with the central refrigerated item chamber (40). The present invention is characterized in that a central refrigerated goods compartment (40) is surrounded by a plurality of centrifugal refrigerated goods compartments (41, 42, 43, 44, 45, 46); the centrifugal refrigerated goods compartments (41, 42, 43, 44, 45, 46) are connected to or can be connected to the central refrigerated goods compartment (40) through their respective conveyor gates (41', 42', 43', 44', 45', 46'); and the central refrigerated goods compartment (40) is equipped with a tubular annular sliding device (6). The tubular annular sliding device (6') is rotatable about the central axis (X) and has at least one conveying port (65). By rotating the annular sliding device on the circumferential wall (62) of the annular sliding device, the conveying port can be aligned with the corresponding conveying gates (41', 42', 43', 44', 45', 46') to form a passage from the paired centrifugal refrigerated compartments (41, 42, 43, 44, 45) to the central refrigerated compartment (40).

The present invention relates to a method for regulating interface thermal conductivity based on the coupling of interface commensurability and normal load, and the method comprises the following steps: (1) establishing a molecular dynamics heat transfer model; (2) performing simulation and processing data: (1) determining the dependence of interface thermal conductivity on the mismatch angle; (2) revealing the intrinsic reasons why interface commensurability affects interface thermal conductivity; (3) determining the influence of state density on heat transport of interfaces with different commensurabilities; (4) obtaining the relationship between the change curve of interface thermal conductivity and normal load under different commensurabilities; (5) revealing the intrinsic mechanism of normal load affecting interface thermal conductivity; (6) determining the influence of interface thermal conductivity on heat under different interface commensurability and normal load. Based on the study of interface commensurability and normal load on energy and heat transport of silicon / silicon interface, the present invention provides an important basis for understanding the internal mechanism of heat transfer of solid materials with different contact interfaces and finding an effective method for controlling interface thermal conductivity.

Heat transfer fluid (3) for the piping system (2) of a heat transport device (1), consisting of demineralized water (9) in which carbon nanoparticles (10) are dispersed, wherein the carbon nanoparticles (10) have a surface area ratio of 250 to 300 square meters per gram of weight.

The application provides a frequency modulation type annular laser heating thin film thermal diffusivity transient measurement method and device, and relates to the technical field of thin film material thermal diffusivity measurement. The method comprises the following steps: generating a cosine electrical signal and converting the same into radio frequency power through a driving circuit to obtain a periodic heat flow with cosine distribution over time on the surface of a sample through laser modulation; the modulated light beam is expanded, phase shaped and bright spot eliminated to form an annular heating light beam and realize non-contact rapid heating and generation of a uniform annular heating zone; a micro displacement table is used to adjust a thermocouple probe to a light contact state on the back of the heating zone to collect an original temperature measurement signal; then, the signal is phase-locked amplified and post-processed to finally obtain the thermal diffusivity of the thin film. The application can significantly improve the non-destructiveness and high signal-to-noise ratio of the temperature measurement process, solve the problems of uneven heat flow distribution and large edge heat loss, and realize rapid and accurate evaluation and measurement of the thermal transport characteristics of the thin film.

A layered topology microchannel heat sink with a low-flow-resistance manifold structure includes a cover plate layer, a manifold layer, a return flow layer, and a heat dissipation layer arranged sequentially. The cooling medium flows into the manifold layer from an inlet on the heat dissipation layer and through an inlet hole penetrating the return flow layer and the manifold layer. Within the manifold layer, the medium is divided into two or more paths within a branch manifold structure. At the end of the branch manifold structure, the medium enters the heat dissipation structure on the heat dissipation layer through a jet hole and an annular through-hole on an annular boss structure in the return flow layer, where it undergoes convective heat transfer. Then, at the edge of the heat dissipation structure, it enters the return flow layer through a return flow groove in the return flow layer, and finally flows out through a return flow hole penetrating the return flow layer and an outlet in the heat dissipation layer. This invention features low flow resistance, uniform flow distribution, and high heat exchange efficiency. It employs topology optimization technology to optimize the design of the branch manifold structure and the microchannel fin structure, effectively achieving heat transport and dissipation in high heat flux density electronic devices.