682 results about "Temperature limit" patented technology

Certain embodiments provide a heater. The heater includes an inner electrical conductor. A heater section at least partially surrounds the inner electrical conductor. The heater section is configured to generate an electrically resistive heat output during application of time-varying electrical current to the heater section. The heater section includes ferromagnetic material. An outer electrical conductor at least partially surrounds the heater section. An applied time-varying electrical current is configured to propagate through the inner electrical conductor and the outer electrical conductor in substantially the same direction. The applied time-varying electrical current is configured to propagate through the heater section in a substantially opposite direction. The heater provides a first heat output when time-varying electrical current is applied to the heater below a selected temperature, and a second heat output approximately at and above the selected temperature during use. The second heat output is reduced compared to the first heat output.

An SOI substrate having an SOI layer that can be used in practical applications even when a substrate with low upper temperature limit, such as a glass substrate, is used, is provided. A semiconductor device using such an SOI substrate, is provided. In bonding a single-crystal semiconductor layer to a substrate having an insulating surface or an insulating substrate, a silicon oxide film formed using organic silane as a material on one or both surfaces that are to form a bond is used. According to the present invention, a substrate with an upper temperature limit of 700° C. or lower, such as a glass substrate, can be used, and an SOI layer that is strongly bonded to the substrate can be obtained. In other words, a single-crystal semiconductor layer can be formed over a large-area substrate that is longer than one meter on each side.

Joint temperature monitoring and control systems and methods are described herein in which the temperature of a fluid within a body or joint space is determined and/or monitored despite the energy generated during treatment by an ablation probe. One or more temperature sensors are positioned along the probe proximally of the electrode assembly and measure the temperature of an electrically conductive fluid without being overly influenced by the surgical effect occurring proximate the electrode assembly. The controller coupled to the probe can also be configured to set temperature limits and treatment times as well as moderating joint temperature by altering the electrically conductive fluid flow.

A method of operation of a plasma torch and the plasma apparatus to produce a hot gas jet stream directed towards a workpiece to be coated by first injecting a cold high pressure carrier gas containing a powder material into a cold main high pressure gas flow and then directing this combined high pressure gas flow coaxially around a plasma exiting from an operating plasma generator and converging directly into the hot plasma effluent, thereby mixing with the hot plasma effluent to form a gas stream with a net temperature based on the enthalpy of the plasma stream and the temperature and volume of the cold high pressure converging gas, establishing a net temperature of the gas stream at a temperature such that the powdered material will not melt or soften, and projecting the powder particles at high velocity onto a workpiece surface. The improvement resides in mixing a cold high pressure carrier gas with powder material entrained in it, with a cold high pressure gas flow of gas prior to mixing this combined gas flow with the plasma effluent which is utilized to heat the combined gas flow to an elevated temperature limited to not exceeding the softening point or melting point of the powder material. The resulting hot high pressure gas flow is directed through a supersonic nozzle to accelerate this heated gas flow to supersonic velocities, thereby providing sufficient velocity to the particles striking the workpiece to achieve a kinetic energy transformation into elastic deformation of the particles as they impact the onto the workpiece surface and forming a dense, tightly adhering cohesive coating. Preferably the powder material is of metals, alloys, polymers and mixtures thereof or with semiconductors or ceramics and the powder material is preferably of a particle size range exceeding 50 microns. The system also includes a rotating member for coating concave surfaces and internal bores or other such devices which can be better coated using rotation.

A system (300) and method (400) for wireless charging are provided. A control circuit (304) charges one or more cells (301) in a secondary wireless charging circuit (308) that receives power wirelessly from a primary (312). The control circuit determines the state of charge and temperature of the cells. The control circuit then calculates a current limit as a function of a combination of the state of charge, input voltage to the control circuit for the wireless controller, FET power dissipation and the temperature and adjusts a wireless power control device (305) in the secondary such that its current limit is set to the state of charge current limit. Different temperature limits can be used for different states of charge such that the cells can be charged at higher temperatures at low states of charge than at higher states of charge.

A charging system capable of charging a battery cell so that the surface temperature of the battery cell does not exceed an upper temperature limit, is provided. A battery charger is configured in a manner such that a setting current is variable during charging. The battery charger starts charging of a secondary battery with a setting voltage set to a minimum charging current value. The surface temperature of the secondary battery is measured during charging. An estimated temperature value is calculated which is a surface temperature of the secondary battery, at which the secondary battery is charged up until a charging amount corresponding to the maximum surface temperature under assumption that the charging is performed with a present charging current value. The setting current is increased when the estimated temperature value is lower than the target temperature range and is reduced when the estimated temperature value is higher than the target temperature range. When the estimated temperature value belongs to the target temperature range, a present setting current is maintained.

A method of exterminating organisms is provided utilizing heated circulating air. First, a determination is made as to which enclosed areas of the building or other structure are to undergo extermination. This step defines an application zone. Next, a desired elevated temperature limit is established for heated air that is to be circulated through the application zone. Heaters are provided in airflow communication with the application zone, and circulation fans are positioned throughout the application zone to move the heated air for proper heat distribution. The heaters utilize an amount of recirculated air already present in the application zone to cut down on the amount of energy needed to raise the air temperature within the application zone towards the desired elevated temperature limit, and to eliminate the need for high CFM airflow heaters to achieve air temperature elevation. The temperature at various nodes within the application zone may be monitored to allow personnel to redirect circulating airflow within the application zone to balance out areas of higher air temperature with areas of lower air temperature. The method takes advantage of convection heat transfer to raise the temperature evenly within an application zone, minimizing temperature stratification which could result in ineffective pest extermination and/or damage to equipment and facilities.

The invention belongs to the technical field of materials and particularly relates to a self-temperature-limited polyurethane grouting material and a preparation method. The self-temperature-limited polyurethane grouting material is composed of three components, the component A includes isocyanate and prepolymer thereof and accounts for 30-50% of total mass of the grouting material, the component B includes polyether polyol and auxiliaries and accounts for 5-50%, preferably 30-50% of the total mass of the grouting material, and the component C includes self-temperature-limited additive with the boiling point adjustable within 66-130 DEG C and accounts for 5-55% of the total weight of the grouting material. By adding the self-temperature-limited additive into the isocyanate and the polyether polyol, heat storage temperature after the grouting material is solidified is lower than the boiling point of the self-temperature-limited additive, and accordingly, potential hazards of fire breaking due to overhigh storage heat of the grouting material are reduced, and fire disasters during grouting to underground engineering, especially coal mines are avoided.

This application relates to a hybrid power supply apparatus comprising a fuel cell and an energy storage device for use in off-road electric vehicles, such as lift trucks. The apparatus is a substitute for conventional lead acid batteries and is sized to fit within a conventional lift truck battery receptacle tray. The fuel cell and fuel processor systems are designed to meet the average load requirements of the vehicle, while the batteries and power control hardware are capable of responding to very high instantaneous load demands. The invention has a similar electrical interface as conventional battery systems and does not require vehicle modification. The apparatus is air-cooled to ensure that the hybrid power components operate within a preferred temperature range and to maintain the external surfaces of the apparatus and exhaust gases within safe temperature limits. Apart from vehicular applications, low power hybrid fuel cell products as exemplified by the present invention may also find application in uninterruptable power supply systems, recreational power, off-grid power generation and other analogous applications.

A meltable ink which is solid at room temperature, which ink is suitable for use in an indirect printing process, in which printing process the ink is transferred, by the use of an inkjet printhead, to a transfer element, whereafter the ink is transferred to a receiving material under pressure from the transfer element, the ink having a composition such that it is pressure-transferable at a temperature between a bottom temperature limit and a top temperature limit, wherein the ink has a deformation energy of less than 20×10⁵ Pa.s at a temperature equal to said top temperature limit.

An image forming apparatus, an image fixing apparatus, and an image fixing method that fix a toner image onto an recording medium in an electrophotographic process capable of effectively controlling an image fixing temperature. In one example, when a narrower recording medium, narrower than a maximum allowable size, is continuously fed at an image fixing temperature, a gap between the conveyed recording mediums is controlled to be longer than a default gap corresponding to a wider recording medium in a feeding direction to avoid an increase of the temperature of the ends of the fixing member in the longitudinal direction, to thereby maintain an allowable temperature limit.

The invention discloses a method and a system for realizing standardized cooking by using intelligent temperature control. According to the invention, operators failing to master cooking techniques also can make standardized dishes which are good and uniform in taste, and the method and system disclosed by the invention can be widely applicable to families and places of business. The system comprises an electric-heating temperature-controllable stove and a cooking container, wherein the electric-heating temperature-controllable stove is provided with a control unit, and the cooking container is placed on the electric-heating temperature-controllable stove. The system also comprises a temperature sensor, a cooking module, a temperature deviation digestion sub-module, a temperature compensation module and a high-temperature limit module, wherein the control unit is connected with the temperature sensor, the cooking module, the temperature deviation digestion sub-module, the temperature compensation module and the high-temperature limit module; and the cooking module compiles the technological process and the control program for each time node control temperature in the process of making each dish, and the like according to a preset temperature range for water, oil, water-oil mixtures and water vapor and a temperature control model of U = P-k (t-T).

An ink-jet printhead and a method of manufacturing the ink-jet printhead include a substrate on which at least one heater and a passivation layer protecting the at least one heater are formed, a passage plate formed on the substrate to provide a chamber corresponding to the at least one heater, and a nozzle plate in which an orifice corresponding to the chamber is formed. The passage plate is formed of photoresist, and the nozzle plate is formed of a silicon-family material at a temperature limited by characteristics of the passage plate.

The invention relates to a dynamic capacity increasing method for an oil-immersed transformer, and belongs to the field of transformers. The method includes the steps that heat conduction process in the transformer is simplified into a circuit model; winding hot-spot temperature, top oil temperature, average oil temperature, average winding temperature of the transformer under the current load condition are calculated; according to the limit that the winding hot-spot temperature does not exceed 140 DEG C, whether temperature in the transformer will exceed the limit temperature or not under the current load and environment conditions is calculated, whether a temperature limit value is reached or not if long-term emergency loads or short-term emergency loads occur at the moment is calculated, and if the temperature in the transformer possibly exceeds the limit value of the short-term emergency loads, the time for reaching the limit value and the finally reached steady state temperature are calculated to serve as alarm signals; if it is monitored that the temperature will exceed the standard within t minutes, an early-warning signal is sent out, certain time delay is set, and if the loads are not reduced within the set time delay, a cooling fan of the transformer is turned on. Long-term continuous operation of cooling equipment can be avoided, and operation life of the cooling equipment is prolonged.

Aspects of the disclosure pertain to a system and method for providing temperature limiting for a voice coil of a speaker. The system and method provide the aforementioned temperature limiting based upon monitoring (e.g., measurement) of an amplifier output signal provided to the speaker. Providing the aforementioned temperature limiting promotes improved protection for the speaker.

To provide an SOI substrate with an SOI layer that can be put into practical use, even when a substrate with a low allowable temperature limit such as a glass substrate is used, and to provide a semiconductor substrate formed using such an SOI substrate. In order to bond a single-crystalline semiconductor substrate to a base substrate such as a glass substrate, a silicon oxide film formed by CVD with organic silane as a source material is used as a bonding layer, for example. Accordingly, an SOI substrate with a strong bond portion can be formed even when a substrate with an allowable temperature limit of less than or equal to 700° C. such as a glass substrate is used. A semiconductor layer separated from the single-crystalline semiconductor substrate is irradiated with a laser beam so that the surface of the semiconductor layer is planarized and the crystallinity thereof is recovered.

An automatic thermal throttling protection method is described. a computer system executes a main BIOS for initializing an embedded controller when the computer system is power on or boots. And the sub BIOS of the embedded controller is also executed. The sub BIOS of the embedded controller obtains an upper temperature limit and a lower temperature limit set by the main BIOS, and obtains a temperature of the CPU through a thermal sensor. The sub BIOS of the embedded controller compares the temperature of the CPU with the upper temperature limit. When the temperature of the CPU is higher than the upper temperature limit, the sub BIOS sends a system control interrupt event to the main BIOS through the embedded controller. When receiving the SCI event, the main BIOS enables a throttling function to perform a throttling operation on the CPU or shuts down the computer system.