The present invention discloses a
flip chip interconnect reliability test method and
computer equipment, the method manufactures a test
chip for a
flip chip that needs to be tested for reliability, the test
chip adopts the same packaging process as the actual
chip, realizes the
interconnection between the chip and the substrate through a multi-channel independent
daisy chain solder joint structure, realizes solder
joint temperature monitoring through built-in temperature measuring elements at the chip end and the substrate end, realizes solder
joint temperature stress loading through built-in heating elements at the chip end and the substrate end, realizes
temperature control of the chip and current loading of the interconnect solder joint through external current stress loading, and thus can realize reliability tests such as high temperature,
power cycle,
electromigration and thermal migration. The present invention can effectively solve the problems that the traditional solution needs to carry multiple sets of
temperature control equipment, a large number of test samples, the thermal gradient difference is difficult to quantify and evaluate during the thermal migration test, and the actual temperature of the solder joint during the
electromigration test is higher than the temperature set by the
temperature control equipment.