Circulation flowing pulsating heat pipe for cooling electronic device
Patent Information
- Authority / Receiving Office
- CN ยท China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CENT SOUTH UNIV
- Publication Date
- 2005-10-19
- Estimated Expiration
- Not applicable ยท inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
Technical field:
[0001] The invention belongs to the technical field of electronic cooling, and relates to components for cooling semiconductors or other solid devices. Background technique:
[0002] With the continuous development of electronic assembly technology, the physical size of components is getting smaller and smaller, and the assembly density is increased; the performance of chips is improved, and the heat generated by them is also increased accordingly, resulting in the formation of high heat density of electronic devices. Therefore, it is more and more important to find effective heat dissipation methods for electronic devices.
[0003] The conventional heat dissipation method mainly relies on the heat sink on the radiator to dissipate heat through heat conduction, which cannot meet the heat dissipation requirements of high heat flux.
[0004] As shown in Figure 4: the circulation type heat pipe is a serpentine pipe, and its two ends are sealed and connected to...