Composite liquid-cooling heat pipe radiator

Abstract

The invention belongs to the technical field of heat transfer, and particularly relates to a composite liquid-cooling heat pipe radiator. The composite liquid-cooling heat pipe radiator comprises a flat plate heat pipe, wherein heat generated by a heating component is transferred to a bottom plate of the flat plate heat pipe, a top plate of the flat plate heat pipe is provided with protrusions perpendicular to the bottom plate of the flat plate heat pipe, the protrusions form a tubular heat pipe, and an inner cavity of the flat plate heat pipe is communicated with an inner cavity of the tubular heat pipe. The composite liquid-cooling heat pipe radiator further comprises a shell. The flat plate heat pipe and the tubular heat pipe are both located in the shell, and the bottom plate of the flat heat pipe is attached to the bottom surface of the shell in a sealed mode; an area defined by the outer surface of the flat plate heat pipe, the outer surface of the tubular heat pipe and the innerwall of the shell forms a cooling liquid channel; and the shell is provided with a cooling liquid inlet and a cooling liquid outlet. According to the radiator, the tubular heat pipe is combined withthe flat plate heat pipe, so that the radiator can be attached to a flat surface of the heating component and has a good radiating effect; and meanwhile, heat released by a refrigerant of a condensation section is taken away through liquid cooling, and compared with air convection heat dissipation, the heat exchange capacity of the composite heat pipe with the outside is improved.

Description

technical field [0001] The invention belongs to the technical field of heat transfer, and in particular relates to a novel composite liquid-cooled heat pipe radiator. Background technique [0002] With the development of the semiconductor industry, the integration of electronic components is increasing, which also leads to a gradual increase in its power density. The increase in power density causes a substantial increase in the heat flux density of components. In the current research, it is found that the high operating temperature is often one of the main reasons for the damage of components. Therefore, in order to ensure the working life of the components, it is necessary to ensure that the junction temperature of the components is within a certain range, which puts forward higher requirements for the heat dissipation means. As a high-efficiency heat sink and easy to miniaturize, heat pipes are currently receiving extensive attention. [0003] The shell of a traditiona...

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Problems solved by technology

[0007] The purpose of the present invention is to solve the problems in the prior art that the plane of the tubular heat pipe and the heating element cannot be well bonded, local hot spots are prone to appear on the evaporation side of the flat heat pipe, and the combined heat pipe can only be air-cooled and the heat dissipation effect is not good. A new composite liquid-cooled heat pipe radiator is proposed

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