High-luminous-efficiency LED lighting device and manufacturing method thereof

Abstract

The invention discloses a high-luminous-efficiency LED lighting device and a manufacturing method thereof, and relates to the technical field of lighting, the high-luminous-efficiency LED lighting device comprises a shell, a heat dissipation module used for avoiding light attenuation acceleration is arranged in the shell, the heat dissipation module comprises a ceramic heat dissipation plate and an aluminum substrate which are arranged in the shell, and concave-convex textures are arranged on the heat dissipation surface of the ceramic heat dissipation plate; the aluminum substrate is provided with a multi-channel assembly used for preventing the overall lighting effect from being reduced, and the opening of the shell is provided with an anti-glare assembly used for restraining glare under low light loss. Convection heat transfer is enhanced through concave-convex textures on the surface of the ceramic heat dissipation plate so as to delay light attenuation, the multi-channel assembly independently adjusts driving current through a power management system so as to achieve spectrum refined reconstruction, and the anti-dazzle assembly achieves dazzle suppression under low light loss through microstructure textures on the light-emitting face of a lens and light diffusion particles filled in the center area.

Description

Technical Field

[0001] This application relates to the field of lighting technology, and in particular to a high-efficiency LED lighting device and its manufacturing method. Background Technology

[0002] LED lighting technology is rapidly developing towards higher power, higher quality, and higher reliability. In applications such as municipal roads, commercial spaces, and industrial sites, lighting devices not only need to provide high luminous efficacy to achieve energy-saving goals, but also must have excellent thermal management capabilities, precise optical control, and a long service life.

[0003] Traditional LED lighting devices mostly use a single-band blue light chip to excite yellow phosphors. Although the technology is mature and the cost is low, the red light component in its spectrum is severely lacking, resulting in a low color rendering index (Ra). Introducing red phosphors or red light chips to improve color rendering will lead to a decrease in the overall luminous efficacy of the system due to differences in electro-optical conversion efficiency. When high-power LEDs are working, the increase in chip junction temperature will directly lead to a decrease in internal quantum efficiency and accelerated light decay. Secondly, as a typical point light source, the extremely high surface brightness of LEDs is the main cause of glare. Existing anti-glare solutions mostly use external diffusers or diffusers, which can reduce glare but significantly sacrifice the system's luminous efficacy. Summary of the Invention

[0004] To address the trade-offs between high luminous efficacy, high color rendering index, long lifespan, and low glare, this application provides a high-luminous-efficiency LED lighting device and its manufacturing method.

[0005] This application provides a high-efficiency LED lighting device and its manufacturing method, which adopts the following technical solution: A high-efficiency LED lighting device includes a housing, in which a heat dissipation module for preventing accelerated light decay is disposed. The heat dissipation module includes a ceramic heat sink and an aluminum substrate disposed in the housing. A welding layer is disposed between the ceramic heat sink and the aluminum substrate. The heat dissipation surface of the ceramic heat sink is provided with a textured surface. The aluminum substrate is provided with a multi-channel component to avoid a decrease in overall light efficiency. The multi-channel component includes a first blue light chip group, a second blue light chip group, and a third blue light chip group. A power management system is provided inside the housing. The power management system is electrically connected to the first blue light chip group, the second blue light chip group, and the third blue light chip group respectively, and is used to independently adjust the driving current of each channel. The opening of the housing is provided with an anti-glare component for suppressing glare under low light loss. The anti-glare component includes a pressure cap that is threaded to the housing. A lens is provided between the pressure cap and the housing. The lens is positioned below the multi-channel component. The light-emitting surface of the lens has a microstructure texture, and the central area of ​​the microstructure texture is filled with light-diffusing particles.

[0006] By adopting the above technical solution, the shell serves as an overall support structure, with a heat dissipation module inside. The aluminum substrate and the ceramic heat sink form a low thermal resistance heat conduction path through a welding layer, and the concave and convective heat transfer is enhanced by the uneven texture on the surface of the ceramic heat sink to delay light decay. The multi-channel components set on the aluminum substrate independently adjust the driving current of the first blue light chip group, the second blue light chip group and the third blue light chip group through the power management system to achieve fine spectrum reconstruction. The lens is fixed at the opening of the shell by a pressure cap with a threaded connection. The microstructure texture of the light-emitting surface of the lens and the light diffusion particles filled in the central area achieve glare suppression with low light loss.

[0007] Preferably, the main wavelength range of the first blue light chip group is 430-450nm, the main wavelength range of the second blue light chip group is 450-460nm, and the main wavelength range of the third blue light chip group is 470-480nm.

[0008] By adopting the above technical solution, the first blue light chip group with a main wavelength of 430-450nm is used to excite red phosphors, the second blue light chip group with a main wavelength of 450-460nm serves as the basic source of light flux, and the third blue light chip group with a main wavelength of 470-480nm is used to fill the gap in the blue and green light bands. The three work together through specific wavelength ranges to improve color rendering and ensure overall light efficiency.

[0009] Preferably, the system further includes a temperature sensor disposed on an aluminum substrate, the temperature sensor being used to collect the junction temperature data of the multi-channel component in real time, and a control unit disposed inside the housing, which is electrically connected to the temperature sensor and the power management system respectively, the control unit having a pre-stored temperature spectrum compensation model, which is used to adjust the driving current ratio of the power management system to each channel in real time according to the junction temperature data, so as to maintain the color rendering index of the output spectrum.

[0010] By adopting the above technical solution, the temperature sensor set on the aluminum substrate collects the junction temperature data of the multi-channel component in real time. The control unit set in the housing, through the pre-stored temperature spectrum compensation model, instructs the power management system to dynamically adjust the driving current ratio of each channel according to the junction temperature data, so as to maintain the stability of the output spectrum color rendering index.

[0011] Preferably, the housing has symmetrical through slots, and a locking block is slidably disposed in the through slot. One end of the locking block located inside the housing has an inclined surface. Side slots are formed on both sides of the through slots. Side plates that are fixedly connected to the locking blocks are slidably disposed in the side slots. Limiting posts are fixedly disposed on the side plates. A reset spring sleeved on the limiting posts is fixedly disposed between the side plates and the side slots.

[0012] By adopting the above technical solution, a locking block with an inclined surface is slidably arranged in the symmetrical through groove inside the housing. Side plates fixed to the locking block are slidably arranged in the side grooves on both sides of the through groove. A reset spring is sleeved on the limiting post on the side plate between the side plate and the side groove. The locking block is automatically popped out by the elastic force of the reset spring to realize the quick locking and fixing of the heat dissipation module.

[0013] Preferably, the ceramic heat sink is an alumina ceramic heat sink with a surface texture depth of 10-50 μm, and the texture is a biomimetic honeycomb hexagonal pit array.

[0014] By adopting the above technical solution, the ceramic heat sink is made of alumina ceramic material, and its surface is set with a biomimetic honeycomb hexagonal pit array with a depth of 10-50μm as a texture. This increases the radiative heat dissipation area and induces microscale eddies to enhance convective heat transfer.

[0015] Preferably, the upper surfaces of the first, second, and third blue light chip groups are covered with a full-spectrum phosphor layer, which includes red phosphor, green phosphor, and yellow phosphor, and its excitation spectrum matches the wavelength of the three-channel blue light.

[0016] By adopting the above technical solution, the full-spectrum phosphor layer covering the upper surface of the first blue light chip group, the second blue light chip group and the third blue light chip group, through the components containing red phosphor, green phosphor and yellow phosphor, utilizes the excitation spectrum that matches the wavelength of the three-channel blue light to efficiently convert the three-band blue light into full-spectrum white light that continuously covers the visible light range.

[0017] Preferably, the light-diffusing particles are made of silicon dioxide, and the light-diffusing particles are symmetrically distributed in an arc shape in the central region of the lens.

[0018] By adopting the above technical solution, the light diffusion particles are made of silicon dioxide and are symmetrically distributed in an arc shape in the central area of ​​the lens. Through the Mie scattering effect, the light emitted from different angles is fully mixed to eliminate the color layering in the center of the light spot, and uniform light distribution is achieved while ensuring high light transmittance.

[0019] Preferably, the welding layer is a metallized welding layer, and the lower surface of the aluminum substrate and the upper surface of the ceramic heat sink are integrated through the metallized welding layer. The welding layer is formed by active metal brazing process.

[0020] By adopting the above technical solution, the welding layer is a metallized welding layer formed by active metal brazing process, which integrates the lower surface of the aluminum substrate and the upper surface of the ceramic heat sink through metallurgical bonding to form an integrated structure, thereby eliminating interface gaps and contact thermal resistance and significantly improving thermal conductivity.

[0021] Preferably, the microstructure texture is composed of multiple concentric rings, and the cross-section of each ring is an asymmetrical triangle.

[0022] By adopting the above technical solution, the microstructure texture is composed of multiple concentric rings with asymmetrical triangular cross sections. The asymmetrical triangular prism structure refracts and deflects the concentrated light rays at a large angle, realizing the visual transformation from "point emission" to "surface emission" to reduce the light intensity per unit area and achieve the anti-glare effect.

[0023] A method for manufacturing a high-efficiency LED lighting device, for use in the aforementioned high-efficiency LED lighting device, includes the following steps: S1: An aluminum substrate is welded to a ceramic heat sink with a textured surface using an active metal brazing process to form a composite heat sink base.

[0024] S2: Multi-channel components and temperature sensors are mounted on an aluminum substrate using SMT technology.

[0025] S3: Apply a full-spectrum phosphor layer on top of the first blue light chip group, the second blue light chip group, and the third blue light chip group and cure it. Then push the assembled heat dissipation module into the housing and fix the heat dissipation module with a clip.

[0026] S4: The lens filled with light-diffusing particles and molded with microstructure texture is fixed to the opening of the housing by a pressure cap, so that the lens covers the multi-channel assembly.

[0027] S5: Install the control unit inside the housing, and electrically connect the temperature sensor to the control unit, and electrically connect the control unit to the power management system.

[0028] In summary, this application includes at least one of the following beneficial technical effects: 1. This application adopts a three-channel independent power management system to drive three sets of blue light chips with main wavelength ranges of 430-450nm, 450-460nm, and 470-480nm respectively. The three-channel blue light chips work together to excite the full-spectrum phosphor layer, which not only makes up for the missing red light but also avoids energy waste, achieving continuous and balanced output in the visible light band. Through fine spectral matching, phosphor conversion loss is reduced and luminous efficiency is avoided.

[0029] 2. This application adopts an aluminum substrate and ceramic heat sink structure. The ceramic heat sink has high thermal conductivity and large heat capacity, and is integrated through a metallized welding layer, which eliminates the interfacial thermal resistance of traditional thermal grease. At the same time, the micron-level uneven texture (depth 10-50μm) set on the surface of the ceramic heat sink effectively increases the heat dissipation surface area and induces local air disturbance, breaks the thermal boundary layer, improves the convective heat transfer coefficient, and avoids accelerated light decay.

[0030] 3. This application creates a ring-shaped microstructure texture (concentric rings with an asymmetrical triangular cross-section) on the light-emitting surface of the lens to geometrically redistribute the light emitted from the point source, spreading the concentrated light energy in space and realizing the visual transformation from point emission to surface emission. At the same time, the symmetrical arc-shaped distribution area in the central region of the lens is filled with light diffusion particles, which fully mix different wavelengths of light through the Mie scattering effect, reduce spatial chromatic aberration, and achieve glare suppression with low light loss.

[0031] 4. This application uses a temperature sensor on an aluminum substrate to collect the junction temperature data of the three-channel LED array in real time. The temperature spectrum compensation model embedded in the control unit (including the light decay and temperature characteristic curves of each channel chip) dynamically adjusts the driving current ratio of each channel. When the ambient temperature changes and causes the junction temperature to fluctuate, the control system compensates for the difference in luminous efficacy of each channel according to the spectrum priority strategy to ensure the stability of the output spectrum.

[0032] 5. This application uses clips on both sides to connect the housing and the ceramic heat sink, eliminating the need for screws or adhesives, simplifying the assembly process and improving production efficiency. At the same time, the clip structure can effectively absorb the stress caused by the difference in thermal expansion, avoiding connection failure or ceramic cracking caused by the mismatch of thermal expansion coefficients under high and low temperature cycling conditions. Attached Figure Description

[0033] Figure 1 This is a three-dimensional schematic diagram of the overall structure of this application; Figure 2 This is a bottom view of the overall structure of this application; Figure 3 This is an anatomical diagram of the lens and housing in this application; Figure 4 This is a cross-sectional view of the internal structure of the shell in this application; Figure 5 for Figure 4 Enlarged structural diagram at point A in the middle; Figure 6 This is a schematic diagram of the heat dissipation module structure of this application; Figure 7 This is a schematic diagram of the location structure of the multi-channel component in this application; Figure 8 This is a schematic diagram of the raised and recessed texture of the ceramic heat sink in this application.

[0034] Reference numerals: 1. Housing; 2. Heat dissipation module; 21. Ceramic heat sink; 22. Aluminum substrate; 23. Welding layer; 24. Textured surface; 3. Multi-channel components; 31. First Blu-ray chipset; 32. Second Blu-ray chipset; 33. Third Blu-ray chipset; 34. Power management system; 4. Anti-glare components; 41. Lens; 42. Light diffusion particles; 43. Microstructure texture; 44. Cover; 5. Control unit; 6. Temperature sensor; 7. Locking block; 8. Through slot; 9. Side slot; 10. Side plate; 11. Return spring; 12. Limiting post. Detailed Implementation

[0035] The following is in conjunction with the appendix Figures 1-8 This application will be described in further detail.

[0036] This application discloses a high-efficiency LED lighting device and its manufacturing method.

[0037] Example 1 Reference Figures 1 to 8 A high-efficiency LED lighting device includes a housing 1, which serves as an integral support and protective structure. The housing 1 is die-cast from a high thermal conductivity aluminum alloy material, forming an internal space. A heat dissipation module 2 is disposed in the middle of the inner wall of the housing 1 to prevent accelerated light decay. The heat dissipation module 2 includes a ceramic heat sink 21 and an aluminum substrate 22 disposed within the housing 1. An opening matching the shape of the ceramic heat sink 21 is formed in the middle of the bottom inner wall of the housing 1. The aluminum substrate 22 is a high thermal conductivity aluminum alloy substrate. A welding layer 23 is disposed between the ceramic heat sink 21 and the aluminum substrate 22. The heat dissipation surface of the 1 has a textured surface 24. The ceramic heat sink 21 is an alumina ceramic heat sink, and the textured surface 24 is a biomimetic honeycomb hexagonal pit array. The textured surface 24 has a texture depth of 25μm. It is used to increase the heat dissipation surface area and induce local air turbulence, break the thermal boundary layer, and improve the convective heat transfer efficiency. The welding layer 23 is a metallized welding layer 23. The lower surface of the aluminum substrate 22 and the upper surface of the ceramic heat sink 21 are integrated by using an active metal brazing process. A multi-channel component 3 is provided on the aluminum substrate 22. The multi-channel component 3 is used to avoid the overall light efficiency reduction.

[0038] When this device is working, the heat generated by the multi-channel component 3 is first conducted to the aluminum substrate 22. Since the aluminum substrate 22 and the ceramic heat sink 21 are integrated metallurgically bonded by the metallized welding layer 23 formed by the active metal brazing process, there are no physical gaps and contact thermal resistance at the interface caused by traditional thermal grease or thermal adhesive. The heat can be transferred directly from the aluminum substrate 22 to the ceramic heat sink 21 with extremely low loss. The ceramic heat sink 21 is made of alumina ceramic material, which uses its own high thermal conductivity to quickly diffuse the heat to the entire surface of the heat sink. At this time, the biomimetic honeycomb hexagonal pit array set on the heat dissipation surface of the ceramic heat sink 21 serves as a texture 24. Its 25μm micron-level depth significantly increases the effective radiation heat dissipation area. On the other hand, when air flows through the heat dissipation surface, the biomimetic structure induces microscale eddies, which continuously destroy the thermal boundary layer and greatly improve the convective heat transfer coefficient. This effectively controls the chip junction temperature within the ideal range and avoids the problem of accelerated light decay caused by excessive junction temperature.

[0039] Reference Figures 4 to 8 The multi-channel component 3 includes a first blue light chip group 31, a second blue light chip group 32, and a third blue light chip group 33. A power management system 34 is provided inside the housing 1. The power management system 34 adopts three independent constant current drive circuits. The power management system 34 is electrically connected to the first blue light chip group 31, the second blue light chip group 32, and the third blue light chip group 33 respectively, and is used to independently adjust the drive current of each channel to achieve fine control of the spectrum. The main wavelength of the first blue light chip group 31 is 445nm, the main wavelength of the second blue light chip group 32 is 455nm, and the main wavelength of the third blue light chip group 33 is 475nm. Each chip group is integrated into the same package. Three independent pads are provided at the bottom of the package to form electrical connections with the three chip groups respectively. The spacing between adjacent chip groups is 0.4mm. The package is soldered to the aluminum substrate 22. The upper surfaces of the first blue light chip group 31, the second blue light chip group 32 and the third blue light chip group 33 are covered with a full-spectrum phosphor layer. The phosphor layer contains red phosphor, green phosphor and yellow phosphor, and its excitation spectrum matches the wavelength of the three-channel blue light to convert blue light into full-spectrum white light.

[0040] The power management system 34 independently drives the first blue light chip group 31, the second blue light chip group 32, and the third blue light chip group 33. The first blue light chip group 31 has a dominant wavelength of 445nm, and its high photon energy is used to efficiently excite the red phosphor in the full-spectrum phosphor layer, enhancing the red light component in the spectrum. The second blue light chip group 32 has a dominant wavelength of 455nm, serving as the basic luminous flux source for white light output. The third blue light chip group 33 has a dominant wavelength of 475nm, used to fill the spectral gaps in the blue-green light band and improve color. In terms of saturation, when the light emitted by the three sets of chips passes through the full-spectrum phosphor layer covering their surface, the red, green, and yellow phosphors contained in the phosphor layer are excited by the corresponding bands of blue light. Since the excitation spectrum of the three sets of chips matches the absorption spectrum of the phosphor layer, the phosphors work together to efficiently convert the three bands of blue light into full-spectrum white light that continuously covers the visible light range. This achieves high luminous efficiency while obtaining excellent color rendering performance, avoiding the problem of overall luminous efficiency reduction caused by spectral deficiencies in traditional single-band blue light solutions.

[0041] Reference Figures 2 to 6 An anti-glare component 4 is provided at the opening of the housing 1. The anti-glare component 4 is used to suppress glare under low light loss. The anti-glare component 4 includes a pressure cap 44 that is threaded to the housing 1 and is used to fix the lens 41 at the opening of the housing 1. The lens 41 is provided between the pressure cap 44 and the housing 1. The bottom surface of the lens 41 is convex. The bottom opening size of the pressure cap 44 is smaller than the maximum diameter of the lens 41 and is used to fix the lens 41. The lens 41 is placed under the multi-channel component 3 and is used to distribute and mix the light emitted by the multi-channel component 3. The light-emitting surface of the lens 41 has a microstructure texture 43. The microstructure texture 43 is composed of multiple concentric rings. The cross section of each ring is an asymmetrical triangle and is used to geometrically redistribute the light emitted by the point light source, spreading the concentrated light energy in space. The central area of ​​the microstructure texture 43 is filled with light diffusion particles 42. The light-diffusing particles 42 are made of silicon dioxide with a particle size of 5μm and a volume fill rate of 10%. The light-diffusing particles 42 are symmetrically distributed in an arc shape in the central region of the lens 41. They are used to fully mix light of different wavelengths through the Mie scattering effect, eliminate spatial chromatic aberration, and form a uniform beam angle of 120°.

[0042] The light emitted from the multi-channel component 3 illuminates the lens 41. The lens 41 is pressed and fixed to the housing 1 by a pressure cap 44 threaded connection, ensuring its precise and stable relative position with the multi-channel component 3. The light first enters the central region of the lens 41, which is filled with symmetrically distributed silicon dioxide light-diffusing particles 42. When the light passes through these particles, the Mie scattering effect occurs, which fully mixes the light from different angles generated by the physical position differences of the three-channel chip, eliminating the color layering phenomenon at the center of the light spot. Subsequently, the light reaches the light-emitting surface of the lens 41. The microstructure texture 43 on this surface is composed of multiple concentric rings with asymmetrical triangular cross-sections. Each asymmetrical triangular prism structure refracts and deflects the originally concentrated light at a large angle. Through the step-by-step control of multiple concentric rings, the high-brightness light from the point source is evenly dispersed to a larger spatial angle, realizing the visual transformation from "point emission" to "surface emission". This process effectively reduces the light intensity per unit area while maintaining high light transmittance, thereby achieving the effect of suppressing glare with low light loss.

[0043] Reference Figures 4 to 6 It also includes a temperature sensor 6 mounted on the aluminum substrate 22. The temperature sensor 6 is used to collect the junction temperature data of the multi-channel component 3 in real time. It is arranged close to the multi-channel component 3. The temperature sensor 6 is a thermistor and is used to collect the junction temperature data of the multi-channel component 3 in real time. The housing 1 is equipped with a control unit 5 that is electrically connected to the temperature sensor 6 and the power management system 34 respectively. The control unit 5 is a microcontroller. The control unit 5 has a pre-stored temperature spectrum compensation model, which is used to adjust the driving current ratio of each channel of the power management system 34 in real time according to the junction temperature data to maintain the color rendering index of the output spectrum.

[0044] A temperature sensor 6 mounted on the aluminum substrate 22 collects the junction temperature data of the multi-channel component 3 in real time and transmits the data to a control unit 5 located inside the housing 1. The control unit 5 has a pre-stored temperature spectral compensation model, which is based on the light intensity-current-temperature characteristic curves of blue light chips of different wavelengths. When the control unit 5 receives the junction temperature data, it calculates the current compensation value required for each channel at the current temperature according to a preset algorithm and instructs the power management system 34 to dynamically adjust the driving current ratio of the first blue light chip group 31, the second blue light chip group 32, and the third blue light chip group 33. For example, when the temperature rises and causes the efficiency of the third blue light chip group 33 with a main wavelength of 470-480nm to decrease, the control unit 5 automatically increases the driving current of that channel to compensate for the light flux loss, thereby maintaining the color rendering index of the output spectrum stable under different operating ambient temperatures and achieving active spectral balance and thermal drift compensation.

[0045] Reference Figures 4 to 6The housing 1 has symmetrical through slots 8, and a locking block 7 is slidably disposed within the through slot 8. The outer wall of the locking block 7 fits against the through slot 8. One end of the locking block 7 located inside the housing 1 has an inclined surface to guide the heat dissipation module 2 to be pushed in and automatically compress the locking block 7. Side slots 9 are symmetrically disposed on both sides of the through slot 8, and side plates 10 are slidably disposed within the side slots 9. The side plates 10 are fixedly connected to the locking blocks 7. Limiting posts 12 are fixedly disposed on the side plates 10, and a return spring 11 is fixedly disposed between the side plates 10 and the side slots 9 for resetting. Spring 11 is sleeved on limit post 12 and is used to automatically reset block 7 after heat dissipation module 2 is pushed into place, so as to realize the snap-fit ​​fixation of heat dissipation module 2. The reset spring 11 is made of 304 stainless steel spring wire, and the production process adds a standing treatment (i.e., 24 hours of pre-compression in an environment 20°C higher than the working temperature) to eliminate initial plastic deformation. At the same time, the fit clearance between block 7 and side groove 9 is set to 0.05-0.10mm, and high drop point high temperature synthetic silicone grease is applied to ensure smooth sliding.

[0046] When assembling the heat dissipation module 2, the operator pushes the heat dissipation module 2 into the housing 1. When the ceramic heat dissipation plate 21 contacts the inclined surface of the locking block 7 located at one end of the housing 1, the locking block 7 is pushed outward under the guidance of the inclined surface and slides outward along the through groove 8. At this time, the side plate 10, which is fixedly connected to the locking block 7, slides outward in the side groove 9 and compresses the return spring 11 sleeved on the limiting post 12. When the heat dissipation module 2 is pushed into place, the locking block 7 loses the external force, the return spring 11 releases the elastic potential energy, pushes the side plate 10 to return inward, and then drives the locking block 7 to slide inward along the through groove 8. The end of the locking block 7 automatically pops out and forms a locking engagement with the corresponding part of the heat dissipation module 2. The limiting post 12 plays a guiding and limiting role in the compression and rebound process of the return spring 11, ensuring that the side plate 10 moves smoothly and preventing deviation and jamming. This structure enables tool-free rapid assembly between the heat dissipation module 2 and the housing 1. At the same time, under high and low temperature cycling conditions, the snap-fit ​​structure can effectively absorb the stress caused by the difference in thermal expansion and avoid connection failure.

[0047] Example 2 A method for manufacturing a high-efficiency LED lighting device, for use in the aforementioned high-efficiency LED lighting device, includes the following steps: S1: An aluminum substrate 22 is welded to a ceramic heat sink 21 with a textured surface 24 using an active metal brazing process to form a composite heat sink base. Specifically, a titanium-nickel alloy transition layer is deposited on the lower surface of the aluminum substrate 22 by vacuum sputtering. The aluminum substrate 22 and the ceramic heat sink 21 are then brazed in a vacuum furnace at a temperature of 650°C for 15 minutes to form an integrated composite heat sink structure.

[0048] S2: The multi-channel component 3 and the temperature sensor 6 are mounted on the aluminum substrate 22 using SMT technology. Specifically, the first blue LED chip group 31, the second blue LED chip group 32 and the third blue LED chip group 33 are mounted on the upper surface of the aluminum substrate 22 at predetermined positions using a reflow soldering process, and the temperature sensor 6 is mounted at the same time.

[0049] S3: A full-spectrum phosphor layer is coated and cured on the first blue light chip group 31, the second blue light chip group 32, and the third blue light chip group 33. Specifically, red phosphor, green phosphor, and yellow phosphor are mixed in silicone in a predetermined ratio and uniformly coated on the surface of the multi-channel component 3 using a dispensing or spraying process, and then thermo-cured at 150°C for 1 hour. Subsequently, the assembled heat dissipation module 2 is pushed into the housing 1 and fixed by the locking block 7.

[0050] S4: The lens 41, filled with light-diffusing particles 42 and molded with microstructure texture 43, is fixed to the opening of the housing 1 through the pressure cap 44, so that the lens 41 covers the multi-channel component 3. Specifically, the lens 41 is formed by precision injection molding. During the injection molding process, the light-diffusing particles 42 are evenly filled in the central area and form a symmetrical arc distribution. Then, the lens 41 is threadedly fixed to the housing 1 through the pressure cap 44.

[0051] S5: Install the control unit 5 inside the housing 1, and electrically connect the temperature sensor 6 to the control unit 5. Then, electrically connect the control unit 5 to the power management system 34. After completing the above steps, perform a full-machine aging test and an optical performance test to ensure product quality.

[0052] The first blue light chip group 31, the second blue light chip group 32, the third blue light chip group 33, the power management system 34, and the temperature sensor 6 are existing technologies, and their structural principles will not be described in detail. The power management system 34 is located inside the housing 1 and adopts three independent constant current drive circuits, which are electrically connected to the first blue light chip group 31, the second blue light chip group 32, and the third blue light chip group 33 respectively, forming three independent and controllable drive channels. The temperature sensor 6 is attached to the aluminum substrate 22 and is adjacent to the multi-channel component 3. Its signal output terminal is electrically connected to the input terminal of the control unit 5, and the output terminal of the control unit 5 is electrically connected to the control terminal of the power management system 34, forming a closed-loop feedback control loop. Upon startup, the power management system 34 drives the three blue light chip groups according to the preset initial current ratio, causing them to emit blue light of different wavelengths and excite the full-spectrum phosphor layer on the upper surface to produce white light output. At the same time, the temperature sensor 6 collects the junction temperature data of the multi-channel component 3 in real time and transmits it to the control unit 5. The control unit 5 calculates the current compensation required for each channel in real time according to the pre-stored temperature spectrum compensation model, which includes the light decay-temperature characteristic curve of each channel chip, and outputs a PWM adjustment signal to the power management system 34. The power management system 34 dynamically adjusts the driving current ratio of each channel accordingly, compensating for the difference in light efficiency caused by temperature changes while maintaining a constant total power, thereby ensuring that the color rendering index of the output spectrum is stable at Ra≥95, realizing closed-loop regulation of temperature-spectrum coordinated control.

[0053] The implementation principle of a high-efficiency LED lighting device and its manufacturing method in this application embodiment is as follows: When the device is in use, the heat dissipation module 2 is pushed into the housing 1. After the locking block 7 is pressed, it compresses the reset spring 11. After it is in place, the reset spring 11 drives the locking block 7 to lock into the slot to complete the fixation. When the power is turned on, the power management system 34 drives the three groups of blue light chips to excite the full-spectrum phosphor layer to generate white light according to the preset ratio. When the white light passes through the lens 41, the microstructure texture 43 performs geometric redistribution of the light. The light diffusion particles 42 mix the light of different wavelengths, eliminate color difference and form a uniform beam angle of 120° to achieve low light loss and anti-glare lighting. During the operation, the temperature sensor 6 collects junction temperature data in real time. The control unit 5 calculates the current compensation amount through the temperature spectrum compensation model and outputs a PWM signal to adjust the power management system 34 to dynamically adjust the driving current ratio of each channel to compensate for the difference in luminous efficacy and stabilize the color rendering index. During maintenance, the locking block 7 is pressed to make it disengage from the slot, and the heat dissipation module 2 can be removed.

[0054] The above are merely optional embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A high-efficiency LED lighting device, characterized in that: Includes a housing (1), and a heat dissipation module (2) for preventing accelerated light decay is provided inside the housing (1). The heat dissipation module (2) includes a ceramic heat sink (21) and an aluminum substrate (22) disposed inside the housing (1). A welding layer (23) is provided between the ceramic heat sink (21) and the aluminum substrate (22). The heat dissipation surface of the ceramic heat sink (21) is provided with a textured surface (24). The aluminum substrate (22) is provided with a multi-channel component (3) to avoid the overall light efficiency reduction. The multi-channel component (3) includes a first blue light chip group (31), a second blue light chip group (32) and a third blue light chip group (33). The housing (1) is provided with a power management system (34). The power management system (34) is electrically connected to the first blue light chip group (31), the second blue light chip group (32) and the third blue light chip group (33) respectively, and is used to independently adjust the driving current of each channel. An anti-glare component (4) for suppressing glare under low light loss is provided at the opening of the housing (1). The anti-glare component (4) includes a pressure cap (44) threadedly connected to the housing (1). A lens (41) is provided between the pressure cap (44) and the housing (1). The lens (41) is covered below the multi-channel component (3). The light-emitting surface of the lens (41) is provided with a microstructure texture (43), and the central area of ​​the microstructure texture (43) is filled with light diffusion particles (42).

2. The high-efficiency LED lighting device according to claim 1, characterized in that: The main wavelength range of the first blue light chip group (31) is 430-450nm, the main wavelength range of the second blue light chip group (32) is 450-460nm, and the main wavelength range of the third blue light chip group (33) is 470-480nm.

3. The high-efficiency LED lighting device according to claim 1, characterized in that: It also includes a temperature sensor (6) disposed on an aluminum substrate (22), the temperature sensor (6) being used to collect the junction temperature data of the multi-channel component (3) in real time, and a control unit (5) disposed in the housing (1) being electrically connected to the temperature sensor (6) and the power management system (34) respectively, the control unit (5) having a pre-stored temperature spectrum compensation model, used to adjust the driving current ratio of the power management system (34) to each channel in real time according to the junction temperature data, so as to maintain the color rendering index of the output spectrum.

4. A high-efficiency LED lighting device according to claim 3, characterized in that: The housing (1) is symmetrically provided with through grooves (8), and a locking block (7) is slidably provided in the through groove (8). One end of the locking block (7) located in the housing (1) is provided with an inclined surface. Side grooves (9) are provided on both sides of the through groove (8). A side plate (10) fixedly connected to the locking block (7) is slidably provided in the side groove (9). A limit post (12) is fixedly provided on the side plate (10). A reset spring (11) sleeved on the limit post (12) is fixedly provided between the side plate (10) and the side groove (9).

5. A high-efficiency LED lighting device according to claim 1, characterized in that: The ceramic heat sink (21) is an alumina ceramic heat sink with a surface texture (24) of 10-50 μm depth, and the texture (24) is a biomimetic honeycomb hexagonal pit array.

6. A high-efficiency LED lighting device according to claim 2, characterized in that: The upper surfaces of the first blue light chip group (31), the second blue light chip group (32) and the third blue light chip group (33) are covered with a full-spectrum phosphor layer, which includes red phosphor, green phosphor and yellow phosphor, and its excitation spectrum matches the wavelength of the three-channel blue light.

7. A high-efficiency LED lighting device according to claim 1, characterized in that: The light-diffusing particles (42) are made of silicon dioxide and are distributed in a symmetrical arc shape in the central region of the lens (41).

8. A high-efficiency LED lighting device according to claim 5, characterized in that: The welding layer (23) is a metallized welding layer (23). The lower surface of the aluminum substrate (22) and the upper surface of the ceramic heat sink (21) are integrated through the metallized welding layer (23). The welding layer (23) is formed by active metal brazing process.

9. A high-efficiency LED lighting device according to claim 7, characterized in that: The microstructure texture (43) is composed of multiple concentric rings, and the cross section of each ring is an asymmetrical triangle.

10. A method for manufacturing a high-efficiency LED lighting device, used in any one of claims 1 to 9, characterized in that, Includes the following steps: S1: The aluminum substrate (22) is welded to the ceramic heat sink (21) with a textured surface (24) using an active metal brazing process to form a composite heat sink base; S2: A multi-channel component (3) and a temperature sensor (6) are mounted on an aluminum substrate (22) using an SMT process. S3: Coat and cure the full-spectrum phosphor layer on the first blue light chip group (31), the second blue light chip group (32) and the third blue light chip group (33), then push the assembled heat dissipation module (2) into the housing (1) and fix the heat dissipation module (2) by the card block (7); S4: The lens (41) filled with light diffusion particles (42) and molded with microstructure texture (43) is fixed to the opening of the housing (1) through the pressure cap (44), so that the lens (41) covers the multi-channel assembly (3). S5: Install the control unit (5) inside the housing (1), and electrically connect the temperature sensor (6) to the control unit (5), and electrically connect the control unit (5) to the power management system (34).

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