A flip-
chip electrode light-emitting element formed by multilayer coatings where a translucent conducting layer and a highly reflective
metal layer acts as flip-
chip electrode for enhancing the LED luminous efficiency. The flip-
chip electrode light-emitting element includes a translucent substrate, a
semiconductor die structure attached on the translucent substrate and made of group III
nitride compounds, and an intermediate layer adapted to support the inverted
semiconductor die structure on a submount. The flip-chip electrode formed by multiplayer coatings includes a current-spreading transparent conducting layer formed on a top side of the second type
semiconductor layer, a highly reflective
metal layer formed on a top side of the transparent conducting layer, a metallic
diffusion barrier layer formed on a top side of the highly reflective
metal layer, and a bonding layer electrically coupled to the intermediate layer and formed on a top side of the
barrier layer. Moreover, an
ohmic contact layer is formed on the transparent conducting layer. And a
passivation layer encloses the die structure for insulating p / n interface and for avoiding the creation of the leakage current.