The invention belongs to the technical field of micro-nano manufacture, in particular to a micro-
complex type method for inducing electric fields under the
restrict of a non-contact moulding board, which comprises the following steps: 1) preparing a moulding board: depositing conductive nanometer
indium-
tin metal oxide ITO glass on a SiO2 base material to prepare a graphical moulding board; 2) vapor-depositing conductive nanometer
indium-
tin metal oxide ITO glass on the surface of the SiO2 base material; 3) pasting
corrosion-proof glue on the surface of the SiO2 base material; 4)
processing the prepared moulding board on the
corrosion-proof glue layer; 5) circumscribing a
DC source to allow the
corrosion-proof glue to generate rheological deformation; 6) carrying out
electric field to induce micro-
complex type; and 7) exposing to
ultraviolet to solidify the corrosion-proof glue so as to obtain a required micro-nano structure. The method has the advantages that the
processing cost is low; the required time is short; and the production efficiency is improved, therefore, the method can be used for
processing various MEMS / NEMS (micron electromechanical
system / nanometer electromechanical
system) devices such as a micro-fluidic device, a micro-sensor, a micro-
brake, a raster, a minitype
biochip, a photoelectron device, a
solar battery and the like.