The invention provides a semiconductor package with an electrical connection structure and a manufacturing method thereof, and the semiconductor package comprises a conducting wire layer, a chip, a welding wire, a packaging colloid, an anti-welding layer and welding balls, wherein the conducting wire layer comprises a chip carrier and a plurality of conducting wires annularly arranged on the periphery of the chip carrier; the packaging colloid comprise a plurality of recesses which are used for embedding the chip carrier and the conducting wires, in the depth of greater than the thickness of the chip carrier and the conducting wires and further exposed on the surface of the conducting wires and the chip carrier; the anti-welding layer is formed in the recesses of the packaging colloid, and the anti-welding layer comprises a plurality of open holes of the anti-welding layer for exposing all conducting wire terminals and part of the chip carrier; and the welding balls are formed in all the open holes of the anti-welding layer to electrically connect with the corresponding conducting wire terminals. Therefore, the adhesion strength of the anti-welding layer is improved by mutual embedding and clamping between the anti-welding layer and the packaging colloid, a path for enabling wet gas to infiltrate into the package is prolonged, and the product reliability is enhanced.