Semiconductor device

Abstract

A semiconductor chip is produced through dicing without removing a conductive film for forming an interconnection and the like from a dicing line region. A prescribed insulating sheet member is adhered to this semiconductor chip at its back face, and the back face and the side face of semiconductor chip, and part of a front face along the periphery of semiconductor chip are covered by insulating sheet member. Thus, even when the conductive film in the dicing line region is curled up by dicing and a burr is resulted at the periphery of semiconductor chip, burr is covered by insulating sheet member to prevent a wire and burr from directly contacting to each other. Thus, a semiconductor device in which an electrical short circuit is prevented without removing a conductive film from a dicing line can be obtained.

Description

technical field [0001] The present invention relates to a semiconductor device, in particular to a semiconductor device which prevents electrical short circuit between burr and welding wire which occurs during cutting. Background technique [0002] In the manufacture of semiconductor devices, first, elements, wiring, and the like are formed by subjecting the surface of the wafer to a predetermined process in the state of a semiconductor substrate (wafer). Once all the processing to be carried out in the state of the wafer has been completed, the wafer is diced along dicing lines, and individual semiconductor chips are cut out. [0003] A predetermined packaging process including a predetermined die bonding process and a wire bonding process is performed on each of the cut out semiconductor chips to complete a semiconductor device. [0004] However, if the wafer is diced along the dicing line, the conductive film in the area of ​​the dicing line is rolled up. Therefore, whe...

AI Technical Summary

Problems solved by technology

[0007] However, in the manufacturing method of the above-mentioned semiconductor device, there is a problem that an additional process for removing the conductive film located in the dicing line region must be provided in the state of the wafer.

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