Manufacturing method of array substrate for liquid crystal display

Abstract

The invention relates to a manufacturing method of an array substrate for a liquid crystal display, and the method comprises steps of: a) forming a grid on the substrate; b) forming a gate insulation layer on the substrate comprising the grid; c) forming a semiconductor layer on the gate insulation layer; d) forming a source electrode/drain electrode on the semiconductor layer; and e) forming a pixel electrode connected with the drain electrode; the step a) comprises steps of: forming a copper based metal film on the substrate, a multi-layer of a copper based metal layer and a metal oxide film, or a multi-layer of a copper based metal layer and a molybdo-based metal layer; and etching the film to form the grid through etching agent composition; the step d) comprises steps of: forming a copper based metal layer on the semiconductor, a multi-layer of a copper based metal layer and a metal oxide film, or a multi-layer of a copper based metal layer and a molybdo-based metal layer; and etching the film to from the source electrode/drain electrode through the etching agent composition.

Description

technical field [0001] The invention relates to a method for manufacturing an array substrate for a liquid crystal display device. Background technique [0002] The process of forming metal wiring on a substrate of a liquid crystal display device generally includes a process of forming a metal film using sputtering or the like, performing a process of applying a photoresist, forming a photoresist on a selective region based on exposure and development, and A process of etching is performed, and a cleaning process and the like are performed before and after each individual process. The etching process refers to a process of forming a metal film on a selective region using a photoresist as a mask, and generally includes dry etching using plasma or the like, or wet etching using an etchant composition. [0003] In this liquid crystal display device, resistance of metal wiring has recently become a major focus of attention. This is because, in the thin film transistor-liquid c...

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Problems solved by technology

But, under the situation of above-mentioned patent, because the damage of hydrochloric acid to copper metal layer is serious, there is the shortcoming that is difficult to use

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