The
micropump comprises a
silicon wafer, a first sealing piece and a second sealing piece, the
silicon wafer is provided with a first face and a second face which are opposite to each other, a first groove used for forming a pump cavity is etched in the first face, and a plurality of grooves which meet the equal-width condition and are used for forming a
moving body, an annular rib and a first valve body of an outlet valve are etched in the second face. The annular rib surrounds the
moving body and is connected to a pump membrane around the
moving body, and the first valve body is connected to a valve membrane of the outlet valve. The first sealing piece is fixed to the first face of the
silicon wafer and covers the first groove to form a pump cavity. The second sealing sheet is fixed on the second surface of the silicon wafer. The second sealing sheet is provided with a connecting port used for connecting a driver at a position corresponding to the moving body. According to the
micropump, through reasonable structural design, better
etching uniformity can be obtained within shorter
etching process time, the process cost is reduced, meanwhile, the product yield is improved, the situation that normal use in a low-temperature environment is affected due to the fact that much liquid is accumulated on the outlet valve is avoided, and the service life is prolonged.