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Electrodeposition solution for forming water-dispersed insulating film

An insulating coating and electrodeposition technology, applied in the direction of electrophoretic plating, electrophoretic coating, electrolytic coating, etc., can solve the problems of insufficient stability of dispersion, reduce the quality of electrodeposition resin, and deteriorate the productivity of insulating materials, etc., to achieve excellent dispersion performance, suppression of productivity decline, and improvement of dispersibility

Active Publication Date: 2020-11-27
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in an electrodeposition solution using polymer particles containing polyamic acid (hereinafter referred to as polyamic acid particles), even if the same method as above is carried out, the dispersibility is not sufficiently stable, and as a result, the Gelation of the synthesized resin or failure to stably obtain an electrodeposition solution in which polymer particles with the same average particle size are dispersed
In addition, by adding a large amount of basic compounds, some degree of improvement in dispersibility can be observed, but many basic compounds will remain in the electrodeposition solution, which will reduce the charge per unit when forming an insulating film by electrodeposition. electrodeposition resin quality (coulombic efficiency), thus deteriorating productivity of insulators

Method used

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  • Electrodeposition solution for forming water-dispersed insulating film
  • Electrodeposition solution for forming water-dispersed insulating film
  • Electrodeposition solution for forming water-dispersed insulating film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0111] Next, examples of the present invention will be described in detail together with comparative examples.

[0112]

[0113] First, 3.00 g (15 mmol) of 4,4'-diaminodiphenyl ether, 3.00 g (15 mmol) of N,N-dimethyl 45 g of acetamide (DMAc) was stirred and dissolved. Next, 3.16 g (15 mmol) of chlorinated trimellitic anhydride and 15 g of DMAc were added to the above-mentioned flask, and the contents of the above-mentioned flask were stirred at room temperature (25° C.) for 6 hours under an argon atmosphere to allow the reaction to proceed. Thus, a first reaction mixture liquid was prepared.

[0114] Then, 0.32 g (1.5 mmol) of chlorinated trimellitic anhydride was added to the first reaction liquid mixture in the above-mentioned flask, and the reaction was further stirred for 1 hour to prepare a second reaction liquid mixture.

[0115] Next, water and alcohol were put into a beaker at a mass ratio of 3:1, and vigorously stirred to prepare a mixed solution. In 800 ml of th...

Embodiment 2

[0120] An electrodeposition liquid was obtained in the same manner as in Example 1 except that the addition amount of 2-aminoethanol was 0.015 g. And, using this electrodeposition solution, an insulator was produced by the same method and conditions as in Example 1.

Embodiment 3

[0122] An electrodeposition liquid was obtained in the same manner as in Example 1 except that the addition amount of 2-aminoethanol was 0.005 g. And, using this electrodeposition solution, an insulator was produced by the same method and conditions as in Example 1.

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Abstract

A water-based electrodeposition dispersion for forming an insulating film includes: polymer particles; an organic solvent; a basic compound; and water, wherein the polymer particles include polyamic acid having a predetermined structural unit, and a volume-based median diameter (D50) of the polymer particles is 0.08 μm to 0.7 μm.

Description

technical field [0001] The present invention relates to a water-dispersed electrodeposition liquid for forming an insulating coating used when forming insulating materials such as insulated wires by electrodeposition. [0002] This application claims priority based on Patent Application No. 2015-133394 filed in Japan on July 2, 2015 and Patent Application No. 2016-115966 filed in Japan on June 10, 2016, and the contents thereof are used here. Background technique [0003] Conventionally, insulators such as insulated electric wires whose surfaces are covered with insulating coatings have been used in motors, reactors, transformers, and the like. As a method of forming an insulating coating on the surface of an electric wire, a dipping method, an electrodeposition method (electrodeposition coating), or the like is known. The dipping method is a method in which, for example, a flat wire or the like is used as an object to be coated, and the process of dipping it in a paint, pu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D13/06C08L79/08C09D5/44C09D179/08
CPCC08G73/105C08G73/1071C08G73/14C09D5/4461C09D179/08C25D13/04C08L79/08C25D9/02C25D13/06
Inventor 矶村洵子樱井英章
Owner MITSUBISHI MATERIALS CORP
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