Nano-enhanced rich resin mica tape with high thermal conductivity and applications thereof
A nano-enhanced, high thermal conductivity technology, applied in mica, winding insulation materials, insulators, etc., can solve the problems of increasing the temperature rise of generators, poor mechanical properties, low thermal conductivity, etc., to improve operational reliability, reduce temperature rise and The effect of the whole machine manufacturing cost
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[0016] This embodiment takes the preparation of 100 kilograms of nano-enhanced high thermal conductivity multi-glue powder mica tape as an example. In the nano-enhanced high thermal conductivity multi-glue powder mica tape prepared in the embodiment, it contains a layer of glass cloth, a layer of powder mica paper, and an adhesive resin. and nano Al 2 o 3 Powder, the weight per unit area of each component material is: powder mica 105 g / ㎡, alkali-free glass cloth 20 g / ㎡, adhesive resin 78g / ㎡, nano-Al 2 o 3 12g / ㎡, the total weight per unit area is 215g / ㎡, and the thickness is 0.14mm.
[0017] The specific preparation steps of the nano-reinforced high thermal conductivity multi-rubber mica tape are as follows:
[0018] (1) Preparation of adhesive resin (epoxy phenolic resin)
[0019] The weight ratio of the raw materials used to prepare the adhesive resin consists of: 10 parts of CYD128 epoxy resin; 40 nanometers of Al 2 o 3 30 parts of epoxy resin-based nano-composite m...
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