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Preparation method of glass fibre fabric conductive material

A conductive material and glass fiber technology, applied in glass manufacturing equipment, glass production, braided wire conductors, etc., can solve the problems of low electromagnetic shielding efficiency, cannot be used in electronics, and high cost of chemical plating, achieve quality assurance, and reduce human factors. , the effect of high shielding efficiency

Inactive Publication Date: 2003-09-24
TIANNUO PHOTOELECTRIC MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, metal oxide coating, electroless plating, conductive adhesive coating and other processes are mainly used in China, which not only cannot meet the requirements of environmental protection and product quality, but also have high cost of electroless plating and serious pollution, while general vacuum plating soft glass fiber The surface of the fabric is easy to oxidize, but the electromagnetic shielding effect is low, and the surface resistance is high, generally only reaching more than 8Ω / cm. Shielding parts and advanced shielding rooms for electronics and precision instruments, that is, the original traditional technology and selected raw materials cannot meet the requirements of modern industry

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1：1、：，0.1mm，150g/m2，：0.028mm。2、，，，180℃，8.4×10-5Pa，1.8/，1.8g/m2。3、 1 and 1 。4、、、 Embodiment 2

[0020] The present invention will be further described below in conjunction with the examples, but not limited thereto. Embodiment 1: Nickel plating on glass fiber cloth 1. Substrate: plain glass fiber cloth, cloth thickness 0.1mm, 150g / m 2 , Glass fiber monofilament diameter: 0.028mm. 2. Vacuum nickel plating, place the glass fiber cloth under the protection of argon, and use the vacuum plating method to plate nickel, the temperature is 180°C, and the vacuum temperature of the vacuum chamber is 8.4×10 -5 Pa, glass fiber cloth moving speed 1.8m / min, sputtering nickel concentration 1.8g / m 2 . 3. Then use the existing plastic electroplating technology to continuously plate a layer of copper coating and a layer of nickel coating on the above materials. 4. Rinse, dry and coil the above materials. Example 2: Silver plating of glass fiber mesh

[0021] The operation steps are as in Example 1, the difference is that the substrate is a glass fiber mesh, the moving speed of the gla...

Embodiment 3

[0022] The operation steps are as in Example 1, the difference is that the substrate is a glass fiber mat, the moving speed of the glass fiber mat is 1.4m / min, and the vacuum plating copper is 2.2g / m 2 , followed by a layer of nickel plating and a layer of silver plating. Embodiment 4: As described in Embodiment 1, the difference is:

Embodiment 4

[0023] The substrate is glass fiber mesh, the mesh is square, 80g / m 2 , 135 mesh / inch, thickness: 0.06mm. Embodiment 5: the difference as described in embodiment 1 is:

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Abstract

A method for preparing glass fiber fabric conduction material includes vacuum coating with Ni or Cu, then continuously coated with Ni, Cu, Ag or Mu metal layer on glass fiber cloth, net and felt matrix. This invented material can be retardant, fire resistant, suitable for screening materials of space and military installations or screening materials of electronic and precision instruments.

Description

(1) Technical field [0001] The invention relates to a method for conducting conductive treatment on insulating, flame-retardant and soft glass fiber fabrics (including glass fiber cloth, net and felt) to prepare composite conductive materials (shielding materials), and belongs to the technical field of vacuum plating and electroplating. (2) Technical background [0002] With the development of science and technology, electronic technology products have penetrated into the lives of thousands of households and every corner of industry, military, aerospace, etc. Household appliances, mobile phones, computer office automation, medical equipment, military facilities, etc., if there is no electronic technology, No matter in the field of research or industry, today's achievements will not be achieved. Due to the increase of these devices, electromagnetic interference is also increasing, and it will cause signal distortion and errors to electronic instruments, resulting in damage to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B37/12H01B3/08H01B5/12H01B5/14H01B13/00H05K9/00
CPCY02P40/57
Inventor 夏芝林夏祥华夏登峰
Owner TIANNUO PHOTOELECTRIC MATERIAL
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