Silicon carbide-silver palladium composite resistor paste and preparation method thereof

Abstract

The invention discloses silicon carbide-silver palladium composite resistor paste. The composite resistor paste comprises a resistance functional phase and an organic carrier, wherein the resistance functional phase comprises superfine silver powder, nano-palladium powder, superfine silicon carbide powder and lead-free glass powder, the organic carrier comprises resin, a solvent and an additive, the resin is ethyl cellulose, the solvent is formed by mixing one or more of butyl carbitol, terpilenol and a DBE solvent, and the additive comprises a liquid defoaming agent, a liquid flatting agent and a dispersing agent. The invention also discloses a preparation method of the composite resistor paste. With the composite resistor paste prepared according to the method, the technical problem of difficulty in thin and light of the prior art can be effectively solved, direct silk printing or spraying can be performed, the technical development requirements of an electric heater tending to miniaturization, thinness and lightness are satisfied, and the composite resistor paste is wide in application range.

Description

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AI Technical Summary

Benefits of technology

This patented method involves adding specific amounts of water ethoxypropyltriacetone/terpinen-4β glycerin monomaleate(TGMB)/DBE into a solution containing certain chemicals like defoamer, dispersant, leveler agent, etc., then mixing them together. These mixtures help create high quality resistors used in electronic devices. They also have excellent flow characteristics when printed onto various surfaces without sagging over time due to their low molecular weight components. Additionally, they provide superior flexibility during application by allowing for different shapes and sizes needed for optimal functionality. Overall, this new approach simplifies manufacturing processes while maintaining consistently high productivity levels.

Problems solved by technology

This patented describes different methods used during fabrication processes on electronic devices such as electricity meters. However, current techniques have limitations with regard to producing small, highly precise elements while maintaining their durability over time due to factors like complexity, lengthy processing cycles, difficulty in achieving thinning/lightenings, poor quality control caused by residual moisture content, insufficient adhesion between layers when they come together without being too tightly bound, lack of flexibility in designing circuits, difficulties controlling the size of the element, limited use within specific applications, and potential health concerns associated with chemical substances released into environmentally sensitive areas through these conventional methods.

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