Low-silver-bearing printed circuit board silver paste and preparation method thereof

Abstract

A low-silver-bearing printed circuit board silver paste comprises, by weight, 1 part to 2 parts of glucose, 20 parts to 30 parts of nanoscale sheet cooper powder, 30 parts to 40 parts of 1-micrometer to 20-micrometer sheet silver powder, 13 parts to 16 parts of glass powder, 5 parts to 7 parts of hyperbranched polyester resin, 5 parts to 8 parts of terpilenol, 2 parts to 5 parts of sulfo-diglycol, 2 parts to 4 parts of bisphenol A epoxy resin, 6 parts to 8 parts of butyl carbitol, 7 parts to 9 parts of acetic ether, 1 part to 2 parts of nanometer titania, 1 part to 2 parts of nanometer crystalline cellulose, 3 parts to 5 parts of nanometer tantalum carbide powder and 3 parts to 5 parts of nanometer niobium carbide powder. According to the low-silver-bearing printed circuit board silver paste, the nanoscale sheet copper powder, the nanometer tantalum carbide powder and the nanometer niobium carbide powder are added, so that the good conductive performance is kept, and the use amount of the silver powder is saved; the glass powder does not contain lead and is environmentally friendly and good in caking property, and a circuit is firm; the organic vehicle solvents are sequentially volatilized, the high temperature resistance is good, the printing performance is good, and the circuit yield is high.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and in particular relates to a silver paste for a printed circuit board with low silver content and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The printed circuit board (PCB) was born to meet the needs of the microelectronics industry. Correspondingly, conduct research on new conductive pastes to match electronic pastes such as conductive pastes, electrode pastes, dielectric pastes, resistor pastes, and hole filling pastes with printed circuit boards (PCBs) that require new requirements. It is imperative. [0003] Generally speaking, the main components of electronic paste include functional phases such as metal, noble metal powder, etc., inorganic binders such as glass pow...

AI Technical Summary

Problems solved by technology

[0005] The binder in the conductive silver paste has a great influence on the yield of circuit printing, such as viscosity, cohesiveness, adhesion, leveling, film formation, solvent volatility, etc. will affect the printing performance of the circuit , there are pores, open circuits, etc., and sometimes the glass phase has not yet begun to melt after the organic matter has volatilized, resulting in the phenomenon that the conductive line falls off from the substrate, and the conductive line is scrapped. Therefore, the performance of the organic binder needs to be improved.

[0006] At present, many inorganic binders use glass powder. Glass powder is made of metal oxides, silicon oxide and other materials. If the melting point is too high, the glass phase has not yet started to melt after the volatilization of organic matter is completed, resulting in conductive lines obtained from conductive silver paste. The phenomenon of falling off from the substrate makes the conductive circuit scrapped; and many of the current glass powders contain harmful substances such as lead, which is not good for the environment, so it is necessary to develop glass powders with better performance