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A lead free aluminum electrode slurry of PTC thermo-sensitive resistor and preparation method

A technology for thermistors and electrode pastes, applied to resistors with positive temperature coefficients, conductive coatings, metal/alloy conductors, etc., can solve the problem of narrow sintering temperature range and unlimited lead content in lead-free aluminum electrode pastes , falling off and other problems, to achieve the effect of a wide sintering range

Inactive Publication Date: 2008-07-09
GUANGZHOU RUXING TECH DEV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main problems of its existence are: (1) there is no limit for the lead content of the lead-free aluminum electrode paste
(2) Poor ohmic contact, compared with In-Ga electrode, the resistance change rate is greater than 10 parts
(3) The sintering temperature range is narrow, the sintering temperature range is only ±5°C, the high temperature sintering will fall off, it is difficult to meet the needs of process production

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] 1 Preparation of lead-free glass powder

[0020] parts by mass SiO 2 2 copies, B 2 o 3 20 copies, Al 2 o 3 2 copies, Bi 2 o 3 60 parts, 16 parts of ZnO, mixed evenly with a mixer, put into a porcelain crucible, dried in an oven at 150°C for 3 hours, put it in a high-temperature furnace, smelted at 900°C for 1 hour, water quenched, dried and ball milled to less than 10 μm.

[0021] 2 Preparation of organic binder

[0022] In parts by mass, 3 parts of ethyl cellulose, 5 parts of butyl carbitol, 19 parts of butyl carbitol acetate, 4 parts of benzyl alcohol, 65 parts of terpineol, 1 part of phenolic resin, 3 parts of castor oil, the above substances After mixing, heat and melt at 80-120°C to a transparent solution to obtain the desired organic adhesive.

[0023] 3 Aluminum powder: the commercially available purity is 99.82 parts, the average particle size is 3.2 μm, the aluminum powder span is 1.52, and the bulk density is 0.52 g / cm 3 spherical aluminum powder.

...

Embodiment 2

[0028] 1 Preparation of lead-free glass powder

[0029] parts by mass SiO 2 2 copies, B 2 o 3 22 parts, Al 2 o 3 1 copy, Bi 2 o 3 63 parts and 12 parts of ZnO are mixed evenly with a mixer, put into a porcelain crucible, dried in an oven at 150°C for 3 hours, put into a high temperature furnace, melted at 900°C for 1 hour, water quenched, dried and ball milled to less than 10 μm.

[0030] 2 Preparation of organic binder

[0031] In parts by mass, 3.5 parts of ethyl cellulose, 5 parts of butyl carbitol, 20 parts of butyl carbitol acetate, 3 parts of benzyl alcohol, 64.5 parts of terpineol, 1 part of phenolic resin, 3 parts of castor oil, and more After the materials are mixed, they are heated and melted at 80-120° C. to a transparent solution to obtain the desired organic binder.

[0032] 3 aluminum powder is identical with embodiment 1.

[0033] 4 Auxiliary: Bi 2 o 3 45 parts, red phosphorus 55 parts

[0034] 5 Preparation of lead-free aluminum electrode paste

[00...

Embodiment 3

[0038] 1 Preparation of lead-free glass powder

[0039] parts by mass SiO 2 1 copy, B 2 o 3 20 copies, Al 2 o 3 1 copy, Bi 2 o 3 63 parts and 20 parts of ZnO are mixed evenly with a mixer, put into a porcelain crucible, dried in an oven at 150°C for 3 hours, put into a high temperature furnace, melted at 900°C for 1 hour, water quenched, dried and ball milled to less than 10 μm.

[0040] 2 Preparation of organic binder

[0041] 5 parts by mass of ethyl cellulose, 4 parts of butyl carbitol, 23 parts of butyl carbitol acetate, 2 parts of benzyl alcohol, 62 parts of terpineol, 1 part of phenolic resin, 3 parts of castor oil, and more After the materials are mixed, they are heated and melted at 80-120° C. to a transparent solution to obtain the desired organic binder.

[0042] 3 aluminum powder is identical with embodiment 1.

[0043] 4 Auxiliary: Bi 2 o 3 35 parts, 65 parts of red phosphorus.

[0044] 5 Preparation of lead-free aluminum electrode paste

[0045] In pa...

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Abstract

The invention discloses a lead-free aluminum electrode paste for a PTC thermistor and the preparation method, the electrode paste is composed of the raw materials with the following parts by weight: 55 to 70 parts of aluminum powder, 10 to 20 parts of inorganic binder, 15 to 25 parts of organic binder and 2 to 4 parts of auxiliary; wherein, the organic binder is composed of 2 to 5 parts by weight of ethyl cellulose, 3 to 6 parts by weight of butyl carbitol, 15 to 23 parts by weight of butyl carbitol acetate, 2 to 4 parts by weight of benzyl alcohol, 60 to 70 parts by weight of terpineol, 0.5 to 2 parts by weight of phenolic resin and 1 to 4 parts by weight of castor oil; and the auxiliary is composed of 30 to 50 parts by weight of Bi2O3 and 50 to 70 parts by weight of phosphorus red. The electrode paste can prepare the aluminum conductive paste by rolling, an aluminum electrode can be formed by screen printing and sintering on a doped barium titanate semiconductor substrate within the range of 630 plus or minus 20 DEG C, the electrode and the substrate form good ohmic contact, the adhesion is good, the aluminum membrane dose not shed, and the long-term placement of the electrode has no oxidation.

Description

technical field [0001] The invention relates to electronic paste for resistors, in particular to a lead-free aluminum electrode paste and a preparation method thereof. Background technique [0002] PTC ceramic thermistor is one of the most widely used electronic ceramic components in recent years. In its production, a large amount of precious metal silver is used as the paste electrode every year. Due to economic and technical reasons such as the high price of silver and the migration of silver ions, many manufacturers use composite electrodes to improve. Such as electroless nickel plating with silver coating, electroless nickel plating and electroplating tin electrodes, which not only increases the difficulty of process operation, but also tends to cause the degradation of electrode surface quality, and make a large number of chips scrapped. Recently, some foreign manufacturers have used arc spraying, swallow plating, sputtering and other means to prepare aluminum conducti...

Claims

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Application Information

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IPC IPC(8): H01C7/02H01B1/02C09D5/24
Inventor 马进丁冰冰卓曼仪
Owner GUANGZHOU RUXING TECH DEV
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