Low-expansion-coefficient insulating medium slurry and preparation method thereof

Abstract

The invention provides low-expansion-coefficient insulating medium slurry. The low-expansion-coefficient insulating medium slurry is prepared from the following materials in percentage by weight: 8%-45% of an organic carrier, 55%-90% of glass powder, 0-5% of an auxiliary agent and 0-5% of a colorant; the organic carrier is prepared from the following materials in percentage by weight: 45%-60% of terpineol, 15%-25% of texanol, 5%-15% of butyl carbitol acetate,1%-10% of butyl carbitol and 4%-15% of ethyecellulose; and the glass powder is prepared from the following materials in percentage by weight: 50%-75% of silicon dioxide (SiO2), 10%-25% of aluminum oxide (Al2O3), 5%-15% of boron oxide (B2O3), 0-15% of calcium oxide (CaO), 0.1%-5% of strontium oxide (SrO), 0.1%-10% of zinc oxide (ZnO) and 0-5% of a fluxing agent. Glass glaze formed by the medium slurry has good acid and alkali corrosion resistance, good insulation, good water resistance and good gas resistance, a circuit on the surface of electronic ceramic can be effectively protected against corrosion damage, and short-circuiting or electric leakage of the circuit is prevented.

Description

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AI Technical Summary

Benefits of technology

This technology improves upon existing methods such as solvent casting techniques and coating processes. These improvements include improved protection against environmental factors like acids (H2S) and bases due to their ability to resist erosion caused by these environments over longer periods of use without losing effectiveness. Additionally, this new method allows for precise control during manufacturing process while maintaining consistently strong bond between the material being applied onto the device's surfaces. Overall, it provides technical benefits with enhanced durability and reliance on electronic devices protected through various means including chemical vapor deposition (CVI).

Problems solved by technology

This patents discusses different methods used to prepare ceramic materials like AlN (aluminum oxynaphosphor). However, there may have issues related to these processes due to their lower thermal conductivity compared to traditional techniques involving firing at very high temperatures. Additionally, some manufacturing companies require specific conditions while producing certain types of material without sacrificially affecting them' quality. These technical challengings include ensuring proper matching between the refractory properties needed for optimal functioning of the final component made through the method described above, controlling the size of the starting components, maintaining consistency throughout the procedure, avoidance of defects caused by impurity particles, and achieving desired levels of mechanical stability over time.

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