243results about "Non-surface-active detergent solvents" patented technology

This invention relates to compositions and methods for cleaning and peeling. This disclosure provides a composition for cleaning or peeling materials from a substrate. The composition includes a primary solvent and a co-solvent. The co-solvent includes one or more caprolactam-derived solvents.

This disclosure relates to a method that includes applying a polishing composition to a surface of a substrate; bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate to create a polished substrate; treating the polished substrate with a rinse solvent; flowing a vapor over a meniscus formed at an interface between air and the rinse solvent on the polished substrate. The vapor includes a first component containing a water miscible organic solvent, a second component containing a cleaning agent, and a third component containing an inert gas.

Proposed is a lacquer for treating a 3D printing-created printed matter that is configured to contain a perfluorinated acrylic resin having a relatively high surface hardness and excellent water resistance and contamination resistance, as well as an excellent force of adhesion to a printing resin making up a 3D printed matter. While the 3D printed matter that is printed through a photocuring-type 3D printer is cleaned and rinsed, an uncured resin remaining on the 3D printed matter is removed, and at the same time, a protective film layer is formed on a surface of the 3D printed matter by being coated thereon. As a result, the surface of the 3D printed matter is protected from damage during a post curing process. Furthermore, the 3D printed matter, which is to be manufactured, is also effectively safeguarded against quality degradation that is caused by contamination through the surface thereof and subsequent discoloration.

To provide a composition for removing edge beads of a metal-containing resist, in detail, a composition for removing edge beads of a metal-containing resist that minimizes a resist residue.SOLUTION: A composition for removing edge beads of a metal-containing resist includes: an additive including at least one selected from a group consisting of phosphoric acid, a phosphorous acid-based compound, and a hypophosphorous acid-based compound and a carboxylic acid-based compound; and an organic solvent. A mixing mass ratio of the at least one selected from the group consisting of the phosphoric acid, the phosphorous acid-based compound, and the hypophosphorous acid-based compound to the carboxylic acid-based compound is 9:1 to 1.2:1.SELECTED DRAWING: Figure 1

SOLVENT COMPOSITIONS The present invention relates to a solvent composition for solvent-based paints or other coatings characterized in that it comprises a combination of dimethyl glutarate and at least one other compound selected from isobutyl acetate, ethyl lactate, dimethyl 2-methylglutarate, 2-methyltetrahydrofuran, ethyl acetate, cyclopentyl methyl ether, dithoxymethane, dimethyl carbonate, dimethyl succinate, benzyl alcohol, dimethyl adipate, and glyceryl triacetate. Fig. 1

To provide a manufacturing method for a semiconductor substrate using a cleaning agent composition with excellent adhesive removal properties.SOLUTION: The manufacturing method for a semiconductor substrate includes the steps of (1) bonding a wafer to a fixed member with an adhesive, (2) polishing the back surface of a bonded surface of the wafer to the fixed member, (3) processing the polished surface of the wafer, (4) separating the processed wafer from the fixed member, and (5) removing residual adhesive on the separated wafer with a cleaning agent. The step (3) includes a heat treatment of the wafer fixed to the fixed member with adhesive at a temperature of 230°C or higher. The cleaning agent composition used in step (5) is a cleaning agent which contains an alkanolamine (component A) and a glycol ether (component B) represented by the following formula (I) and has a content of component A of not less than 35 mass% and not more than 85 mass%. R-O-(EO)n-H (I)SELECTED DRAWING: None

Provided is a maintenance fluid excellent in terms of humectant property and cleaning property. The maintenance fluid is for use in ink-jet recording devices, and comprises organic solvents that comprise a lactone-based solvent and an organic solvent A, wherein the organic solvent A has a boiling point of 240-310°C. The maintenance fluid has a volatile content X, as determined by the following test, of 900 g / L or less. Testing method: In accordance with the provisions of GB / T13173-2008, Chapter 15, the volatile content X is determined using equation (A) . VolatilecontentX=Wv×p×0.01 (In equation (A), Wv is the mass fraction (unit, mass%) of the organic solvents contained in the maintenance fluid and p indicates the specific gravity (unit, g / L) of the maintenance fluid. A two-gram portion of the maintenance fluid is precisely weighed out and put on a dish having a diameter of 5 cm and a height of 1 cm. This dish is put in an oven heated to 105°C to dry the maintenance fluid for four hours. Thereafter, the dish is allowed to cool for 30 minutes in a desiccator and then precisely weighted, and the amount Wv (mass%) of volatilized components of the organic solvents is calculated.)

The present invention relates to: [1] a cleaning composition for an inkjet head, the cleaning composition containing a solvent (A) and water, the dipole moment of the solvent (A) at 25 DEG C as determined by a density pan-function method being 5.0 D or more, and the water content in the cleaning composition being 30 mass% or more; [2] The use of a composition as an inkjet head cleaning agent, said composition containing: a solvent (A) having a dipole moment of 5.0 D or more at 25 DEG C as determined by a density pan-function method, and a water content of 30 mass% or more; [3] A method for cleaning an inkjet head using a composition containing a solvent (A) and water, the dipole moment of the solvent (A) at 25 DEG C as determined by a density pan-function method being 5.0 D or more, and the content of the water being 30 mass% or more.

The application discloses a cleaning method for PFA bottles, which comprises the following steps: multiple static washing of the PFA bottles with clean water; first dynamic washing of the PFA bottles with a first cleaning solution, wherein the first cleaning solution comprises propylene glycol methyl ether acetate and cyclopentanone; second dynamic washing of the PFA bottles with a second cleaning solution, wherein the second cleaning solution comprises propylene glycol methyl ether acetate and N-methyl pyrrolidone; third dynamic washing of the PFA bottles with a third cleaning solution, wherein the third cleaning solution comprises nitric acid and hydrogen peroxide; and fourth dynamic washing of the PFA bottles with a fourth cleaning solution, wherein the fourth cleaning solution comprises nitric acid and hydrochloric acid. The application has the beneficial effect of providing a cleaning method for PFA bottles, which effectively removes residues in the bottles by using multiple composite cleaning solutions.

To provide a peeling solution that can effectively remove resin. [Solution] This stripping solution contains water, an organic solvent having a δP value of 5.0 to 11.9, a δH value of 4.3 to 15.8, and a δD value of 15.9 to 18.6, and an alkaline compound having a pH of 12 or higher in the aqueous phase.

Azeotropic or azeotrope-like compositions, particularly azeotropic or azeotrope-like compositions consisting essentially of or consisting of (Z)-1-chloro-2,3,3-trifluoroprop-1-ene (HCFO-1233yd(Z)), ethanol, and each of methanol, as well as azeotropic or azeotrope-like compositions consisting essentially of or consisting of (Z)-1-chloro-2,3,3-trifluoroprop-1-ene (HCFO-1233yd(Z)), ethanol, and 1,2-trans-dichloroethylene (trans-DCE), and azeotropic or azeotrope-like compositions consisting essentially of or consisting of (Z)-1-chloro-2,3,3-trifluoroprop-1-ene (HCFO-1233yd(Z)), methanol, and 1,2-trans-dichloroethylene (trans-DCE), and solvent uses of the aforementioned compositions.

This invention employs a washing solution containing solvents and metal removal agents. The washing solution contains two or more solvents, the distance between the Hansen solubility parameter of the washing solution and the Hansen solubility parameter of dimethylacetamide (HSP distance) is less than 1.0, and the content of metal impurities is 0.1 × 10⁻¹¹ parts by mass relative to the total of 100 parts by mass of the aforementioned solvents and metal removal agents. ‑9 10 or more by weight 2 ×10 ‑6 The amount is less than a certain percentage by weight. The washing solution described herein can improve the removal of impurities and dirt.

In one aspect, a method for manufacturing a semiconductor substrate is provided that can suppress the generation of shredded temporary fixing agent residue. In one aspect, the present disclosure relates to a method for manufacturing a semiconductor substrate, including the following steps 1 and 2: Step 1: Preparing a semiconductor substrate with a film-like temporary fixing agent adhered to it Step 2: A step of peeling off the film-like temporary fixing agent from the semiconductor substrate obtained in Step 1 using a cleaning agent containing glycol ether, hydrocarbon, and amine.

The present application provides a treatment liquid which is excellent in removal of organic residues and excellent in stability. A treatment method of a treated object related to the above treatment liquid is also provided. The treatment liquid contains water, hydroxylamine, and hydrazine species selected from one or more of hydrazine, hydrazine salts, and hydrazine derivatives, and the total content of the hydrazine species is 1 parts by mass or less relative to 100 parts by mass of the hydroxylamine.

The present application provides biodegradable microcapsules, based on specific poly ß-amino ester shells that can encapsulate and retain cargoes such as, lipophilic, or hydrophobic core materials comprising fragrances, butters, essential or other oils; or oil solubilized ingredients, process of making said biodegradable microcapsules and their applications in various industries. Present application further provides biodegradable shell materials that show evidence of biodegradation or non-persistence in aquatic based and / or soil or compost based environments, and which are stable on storage before use.

A composition comprising: (i) 1,1-difluoroethene (vinylidene fluoride, R-1132a); (ii) carbon dioxide (CO2, R-744); (iii) pentafluoroethane (R-125); and (iv) one or more of trifluoromethane (R-23) and hexafluoroethane (R-116).

To provide a detergent composition having excellent flux cleaning and handling properties and reduced metallic effects and volatile organic compounds (VOC), and a concentrate solution for the detergent composition.SOLUTION: A detergent composition comprises a hydrophilic glycol ether compound, an organic acid, a first compound, and water. The first compound is a hydrophilic nitrogen-containing organic compound and / or a hydrophilic quaternary ammonium salt, the content of the water is 20 mass% or more, and the molar ratio of the first compound to the organic acid is 1 or greater and 35 or smaller.SELECTED DRAWING: None

A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof and a hydroxyl group (excluding the compound represented by the following general formula (1), a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA / MB is 1.0×102 to 1.0×104.R2N(OH)  (1)R2NH  (2)(In the formula (1) and the formula (2), R's each independently represent an alkyl group having 1 to 4 carbon atoms).

The present invention relates to a composition for removing post-etch residues from a substrate, the substrate comprising a surface of a molybdenum layer, the composition comprising: (a) 10 to 60% by mass of a water-miscible organic solvent; (b) 4 to 15 mass% C1 to C 12 amine (c) 0.5 to 4 mass% C4 to C 16 Quaternary ammonium hydroxide; (d) 0.1 to 5 mass% of C2 to C 10 Polyols; (e) 0.01 to 3% by mass of polyethyleneimine; and (f) water Includes.

A cleaning composition includes a cyclic amide-based compound represented by Chemical Formula 1, a polar aprotic solvent, and a fluorine-based compound. The cleaning composition can rapidly remove a silicon-based polymer without generating residue and etching a metal layer. The cleaning composition can be used for a cleaning process of a wafer in a fabrication of a semiconductor device.

The invention belongs to the technical field of organic fluorine polymer synthesis, and discloses perfluoropolyether with narrow molecular weight distribution and a preparation method and application thereof.The method comprises the steps that in an aprotic polar solvent, phosphazene organic super base and anhydrous hydrogen fluoride or perfluoroalcohol are mixed according to the molar ratio of 1: 0.5-1: 1.5, and a mixture is obtained; forming in situ a non-metallic active initiation complex containing large-volume counter cations; at the temperature of-50 DEG C to 10 DEG C, introducing a hexafluoropropylene oxide monomer into the initiation system, and carrying out anionic ring-opening polymerization until a preset number-average molecular weight is reached; after polymerization, maintaining a liquid phase, directly adding a perfluoroalkyl sulfonate end-capping reagent, and reacting at 20-80 DEG C to convert an active end group into an inert perfluoroalkyl ether end group; and performing post-treatment to obtain the perfluoropolyether product. The invention solves the problems of wide molecular weight distribution, low safety and high equipment cost in the traditional process, and the product is suitable for semiconductor vacuum pump oil and precise electronic cleaning agent, and has obvious industrial application value.

The present invention relates to a solvent composition comprising: 1-chloro-2,3,3-trifluoro-1-propene; and a stabilizer, wherein the solvent composition includes, as the stabilizer, a phenol stabilizer and a stabilizer whose boiling point is 30 to 120°C. Further, the present invention relates to a cleaning method and a method of forming a coating film each using the solvent composition. Moreover, the present invention relates to a heat transfer fluid comprising the solvent composition and to a heat cycle system using the heat transfer fluid.

To provide a treatment liquid that is effective in removing photoresist, with minimized damage to polysilicon, and demonstrates superior storage stability, particularly at low temperatures, thus rendering it highly functional.SOLUTION: A treatment liquid includes (A) a compound with a lactone skeleton, and (B) an amine compound with two or more hydroxy groups in one molecule. Preferably, (A) is γ-butyrolactone and (B) is N-alkyldiethanolamine. More preferably, the treatment liquid consists essentially of (A) and (B).SELECTED DRAWING: None

The sublimable film formation composition of the present invention includes a sublimable substance and a solvent in which a saturation solubility of the sublimable substance is more than 10% by mass.

The present invention provides a chemical liquid having excellent defect inhibition properties, a chemical liquid storage body, a kit, and a method for manufacturing a semiconductor chip.SOLUTION: The chemical solution according to the embodiment of the present invention is a chemical solution containing an organic solvent, in which the chemical solution contains at least one kind of first organic compound selected from the group consisting of compounds represented by Formulae (I) to (V), and a total content of the first organic compound is 0.01 to 100000 mass ppt with respect to a total mass of the chemical solution.SELECTED DRAWING: None

Methods of removing abrasive particles from a polymer surface, such as from a cleaning brush used in a post-chemical mechanical treatment cleaning step; and related cleaning solutions.

The invention provides the cleaning composition, the corrosion composition, the kit, the corrosion process and the device, the problem that the corrosion selectivity of AlN relative to AlOx is relatively low is solved, and metal materials such as copper and high-quality cobalt in a metal interconnection circuit are not damaged when a hard mask is removed; the cleaning composition comprises a metal protective agent and a nitrogen-containing heterocyclic compound, the nitrogen-containing heterocyclic compound is selected from at least one of nitrogen-containing heterocyclic compounds and nitrogen-containing heterocyclic compounds; the definition of each group is described in the specification.