The invention discloses a
cut / ground
silicon wafer surface cleaning apparatus, which comprises a
silicon wafer, a
silicon wafer carrier and stations sequentially cleaning the silicon wafer and carrying out corresponding cleaning steps, the stations include a cleaning tank of a first
station with water and bubble ultrasonic overflow rinsing, a cleaning tank of a second
station with acid solution and bubble ultrasonic cleaning and the like. The
cut / ground silicon wafer
surface cleaning apparatus overcomes the problem of easy acid-alkali
neutralization reaction, so that the PH value and concentration of the alkaline cleaner of a third
station and a fourth station can be kept constant, and thereby the
dirt-removing capability of the alkaline cleaner can be persistently effective. The
cut / ground silicon wafers cleaned by the method have
high surface cleanliness, good
repeatability and a consistent color; the oxidation phenomena of mottling,
bluing and blacking are prevented, and the
acceptance rate of the cleaned silicon wafers is high; meanwhile, the cleaner does not need to be added in the effective period of cleaning capacity specified by the process, and the cut / ground silicon wafer
surface cleaning method is easy to operate.