Electronic packaging material

A technology of electronic packaging materials and substrates, applied in the field of material science, can solve problems such as large thermal expansion coefficient, poor plating performance, and low thermal conductivity, and achieve the effects of good stiffness and hardness, low cost, and high specific stiffness

Inactive Publication Date: 2013-05-15
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 3) Low density
[0011] Commonly used electronic packaging materials mainly include: Al 2 o 3 , BeO, AlN, Al, Cu, W, Kovar, W-Cu, etc. However, these traditional materials can no longer meet the performance requirements of electronic packaging materials, Al 2 o 3 The thermal expansion coefficient of Kovar is matched with Si and GaAs, but t

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] An electronic packaging material, consisting of a base and a reinforcement, the base is aluminum, the reinforcement is 10% graphene accounting for the total mass percentage, and the number of layers of graphene is 1-5, 50-200 μm 2 Tiny flakes, the mass percentage of Cr in the metal aluminum is 0.5%.

[0027] In this embodiment, an electronic packaging material in which graphene is uniformly distributed in an aluminum matrix is ​​obtained.

Embodiment 2

[0029] An electronic packaging material, consisting of a base and a reinforcement, the base is metallic copper, the reinforcement is 0.5% graphene accounting for the total mass percentage, and the number of layers of graphene is 3-7, 200-500 μm 2 Tiny flakes or with an area of ​​1mm 2 For the above flake shape, the mass percentage of Ti in the metallic copper is 0.2%.

[0030] In this embodiment, an electronic packaging material in which graphene is uniformly distributed in a copper matrix is ​​obtained.

Embodiment 3

[0032] An electronic packaging material, consisting of a base and a reinforcement, the base is an aluminum-silicon alloy, the mass percentage of silicon in the aluminum-silicon alloy is 8%, the reinforcement is 15% of the total mass percentage of graphene, and the number of layers of graphene is 1 ~5, 1~5μm 2 Tiny flakes or with an area of ​​1mm 2 For the above flaky shape, the mass percentage of Fe in the aluminum-silicon alloy is 0.3%.

[0033] In this embodiment, an electronic packaging material in which graphene is uniformly distributed in an aluminum-silicon matrix is ​​obtained. Embodiment Four

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PUM

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Abstract

The invention discloses an electronic packaging material. The electronic packaging material is characterized by comprising a matrix and a reinforcement, wherein the matrix is made of aluminum, copper, aluminum alloy or copper alloy, the reinforcement is of graphene accounting for 0.5-30% of total mass percentage, and the graphene has 1-20 layers of tiny plates the area of each which is 1-5000 mu m<2> or plates the area of each which is more than 1mm<2>; and the aluminum or copper metal comprises Cr, Fe, Ti, W, B or Mo element, the content of the Cr, Fe, Ti, W, B or Mo element is 0.05-1%. The electronic packaging material has the advantages of being high-heat conductivity, high-strength, low-density, environment-friendly and good in machineable property; and as the electronic packaging material, the composite has excellent property and good application prospects.

Description

technical field [0001] The invention relates to material science, in particular to an electronic packaging material with aluminum or copper as a matrix and graphene as an additive. technical background [0002] In microelectronic integrated circuits, highly dense tiny components generate a lot of heat during operation. The thermal expansion coefficient mismatch between the chip and the packaging material will cause thermal stress fatigue, and the poor heat dissipation performance of the packaging material will cause the chip to overheat. The latter has become the main failure mode of electronic circuit devices. According to the development requirements of integrated circuits and the working environment of electronic components, ideal electronic packaging materials must meet the following basic requirements: [0003] 1) Low coefficient of thermal expansion (CTE), can match with Si, GaAs and other semiconductor materials [0004] 2) Excellent thermal conductivity [0005] 3...

Claims

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Application Information

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IPC IPC(8): C22C21/00C22C9/00C22C1/10H01L23/06
Inventor 王青王亚平郭永利
Owner XI AN JIAOTONG UNIV
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