Graphene-filled isotropic high-performance heat-conducting adhesive and preparation method

An isotropic, graphene technology, used in adhesives, non-polymer adhesive additives, adhesive types, etc., can solve the problems of low bonding strength, low thermal conductivity of thermally conductive adhesives, etc., to achieve low cost, thermal conductivity, etc. High rate and good transparency

Inactive Publication Date: 2012-05-02
常州碳润新材料科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to overcome the disadvantages of low thermal conductivity and low bonding strength of existing thermally conductive adhesives, and provide a high-performance thermally conductive adhesive composition with high mechanical strength, good heat resistance, high bonding strength, and high thermal conductivity. And provide the preparation method of thermally conductive adhesive composition

Method used

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  • Graphene-filled isotropic high-performance heat-conducting adhesive and preparation method
  • Graphene-filled isotropic high-performance heat-conducting adhesive and preparation method
  • Graphene-filled isotropic high-performance heat-conducting adhesive and preparation method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Embodiment 1: Weigh epoxy resin, thixotropic agent according to the mass given in table 2 and they are mixed, and the mode of mixing is mechanical stirring, and stirring speed is 1000 rev / mins, and the time is 10 minutes, then in stirring state Add the weighed graphene and diluent successively to the mixture, continue to stir for 10 minutes after the addition is complete, add curing agent and curing accelerator to the mixture after mixing evenly, and transfer the mixture to high-speed shear after 5 minutes of mechanical stirring Mix in a cutting mixer, the mixing speed is 2000 rpm, and the time is 30s. Repeat the mixing process in the high-speed shear mixer 3 times to obtain a uniformly mixed jelly, which is the thermally conductive adhesive.

[0034] The preparation of the test sample for the bonding strength of the thermal conductive adhesive is carried out according to the standard GB7124-86. First, the copper substrate used for the test is scrubbed with ethyl acetate...

Embodiment 2～11

[0041] According to the composition and consumption listed in table 2, weigh epoxy resin, thixotropic agent and mix them, the mode of mixing is mechanical stirring, and stirring rate is 1000 rev / mins, and the time is 10 minutes, then in stirring state to mixture Add the weighed graphene and diluent in turn, continue to stir for 10 minutes after the addition is complete, add curing agent and curing accelerator to the mixture after mixing evenly, and transfer the mixture to a high-speed shear mixer after mechanical stirring for 5 minutes Mixing in a high-speed shear mixer at a mixing rate of 2000 rpm for 30 s, repeating the mixing process in a high-speed shear mixer 3 times to obtain a uniformly mixed jelly, which is the thermally conductive adhesive.

[0042] table 3

[0043]

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Abstract

The invention especially relates to a graphene-filled isotropic high-performance heat-conducting adhesive, which belongs to the technical field of preparation of heat-conducting adhesives. The invention aims to overcome the defects of low heat conductivity, low bonding strength and the like of existing heat-conducting adhesives. Graphene prepared by using the method of ball milling is utilized as a heat-conducting filling material after surface treatment to prepare the high-performance heat-conducting adhesive. The invention also provides a preparation method for a composition of the heat-conducting adhesive. The heat-conducting adhesive prepared in the invention can be widely applied in the fields of liquid crystal display devices and the like and produces a very remarkable effect.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting adhesive preparation, in particular to a graphene-filled isotropic high-performance heat-conducting adhesive. Background technique [0002] With the development of industrial production and science and technology, people have also put forward new requirements for thermally conductive materials, hoping that they have new comprehensive properties. In the field of electrical and electronic fields, due to the rapid development of integration technology and assembly technology, the volume of electronic components and logic circuits To shrink by tens of thousands of times, high-performance thermal conductivity materials are required. [0003] Traditional heat dissipation materials such as metals have limited their application in specific fields due to their poor corrosion resistance, difficulty in processing, poor electrical insulation, difficulty in processing and molding, and inability to adap...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J9/00C09J11/04C09C1/46C09C3/12
Inventor 陶宇吴海平夏艳平
Owner 常州碳润新材料科技有限公司
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