Preparation method of Al2O3/BN composite powder heat-conductive filler for heat-conductive adhesive

A technology of composite powder and thermal conductive filler, applied in fibrous fillers, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of complex BN preparation process, influence on mechanical properties, low thermal conductivity, etc. The effect of good insulation performance, extended service life and high thermal conductivity

Inactive Publication Date: 2007-05-30
SHANGHAI UNIV
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Problems solved by technology

However, compared with other thermally conductive inorganic fillers, the thermal conductivity of alumina is still too low; increasing the thermal conductivity cannot solve the problem by increasing the filling rate of the filler. Increasing the filling rate will le

Method used

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Embodiment 1

[0017] The preparation process and steps of this embodiment are as follows:

[0018] First, weigh a certain amount of Al(NO 3 ) 3 ·9H 2 O was dissolved in ethanol, and then a certain amount of KOH was dissolved in the ethanol sol, and the ethanol solution of this KOH was slowly added dropwise to the above-mentioned aluminum nitrate solution as a precipitant. Then use centrifuge centrifuge for 20 minutes to obtain boehmite sol; Then add a certain amount of urea and the ethanol sol of boric acid, control and adjust the urea that forms BN and the consumption of boric acid mixed solution accounts for the volume percent of the whole solution to be 75Vol %; heating the reaction, stirring constantly, after the reaction is completed, use a rotary evaporator to volatilize the ethanol solvent, then dry it in an oven, and calcine the dried mixture at 600 to 900 ° C for 7 to 8 hours to obtain Al 2 O 3 / BN composite powder, that is, nano-alumina powder coated with BN. Next, under the ...

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Abstract

The invention discloses a making method of Al2O3/BN composite powder conductive fill of heat conductive adhesive, which comprises the following steps: (1) making BN clad nanometer alumina powder through gel-sol method; (2) grafting to modify the powder through multi-functional compound with isocyanic acid group. The invetnio is compatible with epoxide resin to bind and pack electronic device, which possesses excellent radiation effect.

Description

technical field [0001] The present invention relates to a kind of Al for thermally conductive adhesive 2 O 3 The preparation method of / BN composite powder thermally conductive filler belongs to the technical field of preparation technology of inorganic filler composite powder. Background technique [0002] Thermally conductive insulating adhesives for encapsulation and bonding require good heat dissipation and high thermal conductivity, and the use of inorganic fillers with high thermal conductivity is of great significance. In the past, many thermally conductive fillers were mainly thermally conductive inorganic powders such as alumina, aluminum nitride, boron nitride, and silicon carbide. The above-mentioned inorganic thermal conductive fillers of ordinary micropowder level often need high filling to improve the thermal conductivity of polymer adhesives. For example, AlN needs to be filled to more than 50Vol1% of the volume to have obvious effect. However, while improvi...

Claims

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Application Information

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IPC IPC(8): C09J11/04C09C3/08C09C3/12C09C1/40
Inventor 施利毅付继芳冯欣李立梁新林陈怡刘建飞
Owner SHANGHAI UNIV
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