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High-temperature-resistant and high thermal conductive adhesive and preparation method thereof

A technology with high thermal conductivity and high temperature resistance, which can be used in adhesives, epoxy resin adhesives, non-polymer adhesive additives, etc., and can solve the problem of high cost

Active Publication Date: 2011-04-20
JIANGSU NANOWELL ADVANCED MATERIALS SCI&TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Most of the thermally conductive adhesives currently used in the market are imported materials, which are very expensive, and few of them can achieve high temperature resistance and excellent thermal conductivity at the same time.

Method used

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  • High-temperature-resistant and high thermal conductive adhesive and preparation method thereof

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preparation example Construction

[0013] The present invention also provides a preparation method of the high-temperature-resistant and high-thermal-conductivity adhesive. The method comprises: uniformly dispersing the curing agent and the curing accelerator in the epoxy resin, mixing them with high-thermal-conductivity fillers, and grinding them evenly with a grinder.

[0014] Its components and contents are:

[0015] The epoxy resin is an alicyclic epoxy resin, its epoxy value is 7.0-7.9 (Eq / Kg), and its mass percentage is 15-30%.

[0016] The curing agent is hexahydrophthalic anhydride, and its mass percentage is 10-25%.

[0017] The curing accelerator is a modified amine accelerator, and its mass percentage is 0.15-0.5%.

[0018] The high thermal conductivity filler is nano-aluminum nitride (AlN) whisker, nano-boron nitride (BN) powder or nano-aluminum nitride powder, and its mass percentage is 40-70%.

[0019] The ratio of described epoxy resin and curing agent is: [0018] The ratio of the epoxy resin ...

Embodiment 1

[0024] Proportion of high temperature resistant and high thermal conductivity adhesive (percentage by weight):

[0025] Epoxy resin ERL4221: 30%;

[0026] Curing agent: 29.7% (hexahydrophthalic anhydride);

[0027] Curing accelerator: 0.3% (modified amine accelerator);

[0028] Thermally conductive filler: 40% (nano-aluminum nitride powder);

[0029] Mix and stir the above ingredients, grind them evenly with a three-roller mill, and cure at 150°C for 30 minutes. After testing, the glass transition temperature of the cured product of high temperature resistance and high thermal conductivity is higher than 150°C, and it can be used at 260°C for more than 10 minutes; its bond strength is 24.7MPa, and the bond strength will not decrease by more than 5% after baking at 260°C for 10 minutes ; The thermal conductivity is 1.2W / m·K.

[0030]

Embodiment 2

[0032] Proportion of high temperature resistant and high thermal conductivity adhesive (percentage by weight):

[0033] Epoxy resin ERL4221: 25%;

[0034] Curing agent: 23% (hexahydrophthalic anhydride);

[0035] Curing accelerator: 0.5% (modified amine accelerator);

[0036] Thermally conductive filler: 51.5% (nano-aluminum nitride powder);

[0037] Mix and stir the above ingredients, grind them evenly with a three-roller mill, and cure at 150°C for 30 minutes. After testing, the glass transition temperature of the cured product of high temperature resistance and high thermal conductivity is higher than 150°C, and it can be used at 260°C for more than 10 minutes; its bond strength is 21.6MPa, and the bond strength will not decrease by more than 5% after baking at 260°C for 10 minutes ; The thermal conductivity is 1.8W / m·K.

[0038]

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Abstract

The invention provides a high-temperature-resistant and high thermal conductive adhesive, which mainly comprises epoxy resins, curing agents, curing accelerators and high thermal conductive packing; the adhesive simultaneously has the performances of high temperature resistance and high thermal conductivity, and has an obvious cost advantage. The invention also provides a method for preparing thehigh-temperature-resistant and high thermal conductive adhesive, which comprises the following steps: uniformly dispersing the curing agents and the curing accelerators into the epoxy resins; then mixing the obtained mixture with the high thermal conductive packing; and uniformly grinding the obtained product by a grinding machine. Through the method provided by the invention, the high-temperature-resistant and high thermal conductive pasty adhesive can be obtained. Test results show that the glass transition temperature of the cured high-temperature-resistant and high thermal conductive adhesive is higher than 150 DEG C; the bond strength can be more than 16Mpa, and after the adhesive is roasted at a temperature of 260 DEG C, the bond strength is down by no less than 5 percent; and the coefficient of heat conductivity can reach 4.0 W / m.K.

Description

technical field [0001] The invention relates to the field of adhesive material preparation, in particular to an epoxy resin adhesive system with high temperature resistance and high thermal conductivity added with high thermal conductivity fillers. Background technique [0002] With the increasing emphasis on environmental protection and the development of electronic components in the direction of high density and miniaturization, the requirements for the performance of electronic packaging materials are also getting higher and higher. [0003] Due to environmental protection requirements, lead-free solders have been widely used in soldering materials in the electronic packaging industry. The melting point of the currently developed lead-free solder is 30~40°C higher than that of the traditional Sn-Pb solder. Therefore, the reflow peak value of lead-free solder is correspondingly increased, as high as 260°C. Epoxy resin materials widely used at present will cause problems...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J9/00
Inventor 王铮姜清奎汤砚蔚丁渐宝常振宇
Owner JIANGSU NANOWELL ADVANCED MATERIALS SCI&TECH
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