29 results about "Particulate contamination" patented technology

This application provides a liquid-source gas-phase transport system and method, relating to the semiconductor field. The liquid-source gas-phase transport system includes a storage device, a reaction device, and a transport pipeline. The storage device includes a container and a container heating assembly, which heats the container to vaporize the liquid raw material within it. The transport pipeline connects the container and the reaction chamber of the reaction device. The transport pipeline includes an inner tube, an outer tube sleeved around the inner tube, and a pipeline heating assembly disposed outside the outer tube. A protective gas is filled between the outer and inner tubes, and the interior of the inner tube is used to transport the gaseous raw material. The liquid-source gas-phase transport system and method provided in this application can uniformly heat the raw material, reducing the likelihood of condensation and particulate contamination. Furthermore, the liquid-source gas-phase transport system and method offer superior safety.

The application discloses a high-pressure gas particle counter with a laser diode as a light source, which comprises an optical detection unit, a gas path system and a standard particle reference system, wherein the optical detection unit is used for generating laser and dividing the laser into two independent light paths, i.e., a main light path and an auxiliary light path, and is used for irradiating a main detection area and an auxiliary detection area respectively and receiving a particle scattering light signal and converting the particle scattering light signal into an electric signal; the gas path system is used for selectively conveying a high-pressure gas to be measured and a standard particle gas to the main detection area and the auxiliary detection area; the application belongs to the technical field of gas particulate pollution monitoring, and aims to solve the problem that the output light power of a laser diode in the prior art will drift with the increase of working time and the change of temperature, thereby causing the measurement reference to be inaccurate, and achieves the technical effect that a real-time online dynamic calibration mechanism is constructed by introducing an auxiliary reference light path and the standard particle reference system, and the problem of the measurement reference drift caused by factors such as light source aging and temperature drift is effectively overcome.

This disclosure provides a method, system, and epitaxial wafer for improving particulate contamination of silicon wafers during epitaxy. The method includes: selecting at least one test silicon wafer from a batch of silicon wafers to be processed, and determining a target power range to be applied to the epitaxial furnace based on the test results of the test silicon wafer; adjusting the effective power applied to the epitaxial furnace to the target power range before the silicon wafer to be processed is fed into the epitaxial chamber of the epitaxial furnace, so that the temperature inside the epitaxial chamber is within a target temperature range; maintaining the effective power of the epitaxial furnace within the target power range until the silicon wafer to be processed enters the epitaxial chamber, thereby using the target temperature range to suppress thermal deformation of the silicon wafer to be processed; and growing an epitaxial layer on the surface of the silicon wafer to be processed after it enters the epitaxial chamber. This disclosure can effectively reduce particulate contamination of the silicon wafer to be processed during epitaxy.

The invention provides a wafer suction cup structure and plasma etching equipment. The upper surface of the wafer suction cup structure is used for bearing a wafer, a gas channel used for conveying cooling gas to the position below the wafer is arranged in the wafer suction cup structure, and the wafer suction cup structure is characterized in that in the conveying direction of the cooling gas, the gas channel comprises a first section and a second section which are communicated, and the second section is formed on the upper surface of the wafer suction cup structure; the aperture of the first section is larger than that of the second section, a first porous plug of a porous structure is arranged in the first section, cooling gas can flow through the first porous plug to enter the second section, and a transition layer is arranged on the top of the first porous plug and located between the first porous plug and the top wall face of the first section. Therefore, the gas channel of the second section is prevented from being polluted by particulate matters formed by friction between the first porous plug and the top wall surface of the first section. The method is used for preventing particles formed by friction of the surface of the porous plug from entering the process cavity to pollute the wafer.

The invention discloses a surface particle pollution detection method, which comprises the following steps of: directly collecting particles on the surface of a target object, and transferring the particles attached to the surface of a collector to a filter membrane which is more convenient to analyze through extraction and filtration operations; and further determining the number and the size of the particulate matters in each size range through a microscopic analysis technology, and finally inputting the data for the particulate matters into a pre-trained target model to calculate the coverage rate of the surface particulate matters so as to obtain a final determination result for the surface particulate matters of the target object. According to the method, the coverage rate for evaluating the particulate matters on the surface of the target object is obtained through calculation of the pre-trained model, human factors are not doped, the target model is obtained after multiple times of training, the calculation accuracy and stability can be guaranteed, and the calculation efficiency is improved. In addition, complicated operation is not needed in the process of detecting the particles on the surface of the target object, so that the detection efficiency can be improved.

The spray head proposed in this application includes: a shaft with a central through hole for introducing gas, the shaft passing through a window in the top wall of a processing chamber; a gas receiving chamber disposed below the shaft; a leveling mechanism mounted above the window and connected to the top end of the shaft; and a corrugated tube sleeved on the outside of the shaft, with its two ends connected to the leveling mechanism and the top wall, respectively. A groove is provided on the area of ​​the shaft covered by the corrugated tube, the groove surrounding the outside of the shaft. An air inlet is provided on the side wall of the corrugated tube for introducing purge gas into the space between the groove and the side wall of the corrugated tube. This application can purge the process gas inside the corrugated tube downwards, preventing the process gas from generating particulate contamination of the substrate on the corrugated tube.

This utility model discloses a multi-link linkage vacuum chamber switch baffle, which includes a base, a drive mechanism, a linkage assembly, and a baffle body. The linkage assembly achieves folding and storage of the baffle body through a multi-link hinge structure, reducing space occupation; the baffle body adopts a double-layer structure and a corrugated sealing gasket design to improve sealing performance and prevent particulate contamination; a lubrication device is provided in the base groove to reduce frictional resistance; a dust cover is provided at the hinge point to adsorb particles and protect the vacuum environment. This application can significantly save space, improve sealing performance and operational stability, while avoiding contamination of the vacuum environment, and is suitable for compact equipment.

The application provides a clogging control method and device of a water and fertilizer integrated system and the water and fertilizer integrated system, and belongs to the technical field of agricultural irrigation. The method comprises the following steps: determining the suspended particulate matter pollution risk, non-particulate matter pollution risk and chemical scaling risk of a water and fertilizer mixed solution based on real-time operation parameters of the water and fertilizer integrated system; performing sequential judgment logic on the suspended particulate matter pollution risk, non-particulate matter pollution risk and chemical scaling risk to determine whether a target enhanced clogging control mode is triggered; and when any trigger condition in the sequential judgment logic is reached, the water and fertilizer integrated system is controlled to enter the target enhanced clogging control mode. The application overcomes the defects of the prior art, such as the dependence on a single index and passive response, by means of the precise identification and hierarchical response to different levels of composite risks through the sequential judgment logic based on the collaborative evaluation of various clogging risk sources, so that the clogging control is more prospective, timely and targeted.

The purification of monoalkyl tin trialkoxides and monoalkyl tin triamides are described using fractional distillation and / or ultrafiltration. The purified compositions are useful as radiation sensitive patterning compositions or precursors thereof. The fractional distillation process has been found to be effective for the removal of metal impurities down to very low levels. The ultrafiltration processes have been found to be effective at removal of fine particulates. Commercially practical processing techniques are described.

A sampling system for obtaining a sample of particulate contamination on a surface of an object. The sampling system comprises a sampling device and an applicator. The sampling device comprises a sampling plate having a tacky sampling surface on a first side of the sampling plate, and at least one mechanical connector on an opposite, second side of the sampling plate. The applicator comprises a handle portion, and an engagement portion configured to releasably couple to the at least one mechanical connector. The sampling system is configured to allow the tacky sampling surface to be pressed against the surface of the object and then removed.

This invention discloses a method for preparing high-density, low-defect yttrium oxide ceramic materials and their applications, comprising the following steps: (1) preparing ceramic blanks by using high-purity yttrium oxide precursor powder through a molding process; (2) heating the ceramic blanks obtained in step (1) to 800-900 ℃ at 1-5 ℃ / min in an oxidizing atmosphere and holding them for 15-30 h; (3) continuing to heat the material obtained in step (2) to 1080-1150 ℃ at 1-5 ℃ / min in an oxidizing atmosphere and holding them for a shorter holding time than in step (2); (4) cooling the material obtained in step (3) with the furnace to avoid thermal stress-induced cracks, thereby obtaining the high-density, low-defect yttrium oxide ceramic material. This invention improves the density and microstructure uniformity of the material, enhances surface chemical stability and defect repair, strengthens bulk crystallinity and thermal shock resistance, reduces the risk of particulate contamination and extends component life, and the process is energy-saving, environmentally friendly and highly operable.

The invention provides a particulate matter pollution degree calculation method and device, electronic equipment and a storage medium, and the method comprises the steps: determining a first lobster eye microporous optical device and a placement position thereof, and determining a first accompanying piece corresponding to the first lobster eye microporous optical device; after a certain period of time, measuring the changed ppm value of the first accompanying wafer; selecting a corresponding relation curve according to the placement position; and determining the effective area attenuation proportion of the first lobster eye micropore optical device according to the ppm increment value of the first accompanying piece and the relation curve. Compared with the prior art, the method has higher particulate matter pollution degree calculation accuracy and calculation efficiency.

This invention discloses a target substrate for use in coating equipment and its preparation method. The target substrate includes a base and a cylinder made of pure copper material, and the outer surface of the target substrate is provided with a tungsten layer or a molybdenum layer. This invention targets the placement of N-type or P-type oxide targets, forming a continuous and dense tungsten or molybdenum coating on the outer surface of the pure copper target substrate. While maintaining the high thermal and electrical conductivity of the target substrate, it significantly improves its surface resistance to ablation and sputtering contamination, solving the engineering pain points of existing pure copper substrates such as short lifespan, high particulate contamination, and frequent maintenance, and has significant promotional value.

This invention relates to a cleaning solution and cleaning method for removing the SiO2 film layer on the surface of silicon carbide. The cleaning solution comprises the following components by volume: 15-20% HF, 5-10% HNO3, 8-12% NH4F, 0.01-0.05% nonionic surfactant, and the remainder is ultrapure water. The mass concentration of HF is 49%, the mass concentration of HNO3 is 68%, and the mass concentration of NH4F is 30%. The cleaning method includes the following steps: (1) pre-cleaning the silicon carbide with ultrapure water; (2) performing main cleaning on the pre-cleaned silicon carbide using the above cleaning solution; (3) placing the main-cleaned silicon carbide into a 15-20% NH4OH / H2O2 mixed solution for neutralization and cleaning, then cleaning with an ultrapure water solution containing disodium ethylenediaminetetraacetate, and finally cleaning with a four-stage countercurrent ultrapure water rinsing system; (4) performing post-treatment cleaning in ultrapure water with an ozone content of 4-6 ppb, then rinsing with ultrapure water, and finally drying with isopropanol vapor. This method ensures that the silicon carbide surface is free of residue, has low particulate contamination, and is of high purity after cleaning, meeting the stringent requirements of semiconductor etching processes for the cleanliness and integrity of the material surface.

A surgical treatment system for contaminated air streams having particulate contamination, polar contamination and / or nonpolar contamination in the gas or vapor stream. A surgical smoke plume treatment system and method provide or define a multi-stage treatment process that mechanically filters the air stream, followed by nonpolar decontamination and then polar decontamination or treatment. The system may be used stand alone or incorporated and used with other surgical instruments or incorporated into an air handler adapted to decontaminate an air stream. A desiccant may optionally be used to remove water from the air stream.

A filter device comprising at least two filter elements (10, 12), which are arranged in series when viewed in the direction of fluid flow, wherein one filter element (10) is used for removing particulate contamination and the other filter element (12) is used for separating gas, particularly air, wherein the filter element (12) for gas separation comprises at least two layers (24, 26), each having fluid passage holes of different sizes, and, when viewed in the direction of fluid flow, the layer (24) having larger fluid passage holes is positioned upstream of the layer (26) having smaller fluid passage holes.

This invention discloses a clean granulation process for medical-grade polyetheretherketone (PEEK), comprising the following steps: Step 1, pretreatment and supercritical extraction: the medical-grade PEEK raw material is crushed into coarse particles and extracted using supercritical carbon dioxide fluid extraction; Step 2, combined surface modification: the extracted particles are subjected to sulfonation modification and low-temperature plasma combined modification. This clean granulation process for medical-grade PEEK utilizes supercritical extraction to deeply remove organic residues, a three-stage titanium alloy filter for precise impurity removal, and ultrapure water mist purification and cooling to strictly control metal ion and particulate contamination. Combined with an annular air knife to prevent melt carbonization black spots, the product has low metal residue, is free of foreign matter and volatile impurities, fully meeting the high cleanliness and biosafety requirements of medical implant-grade materials.

This utility model belongs to the technical field of coking operation in tank furnaces, and discloses an air barrier device for coking operation in large-capacity tank furnaces. It includes a coking baffle, a coking baffle bracket installed on one side of the baffle, and a telescopic rod installed on the side of the bracket away from the baffle. This utility model allows the coking baffle to completely cover the area to be cleaned, forming a physical barrier and effectively preventing external air from entering the furnace. The telescopic rod, by adjusting its length, meets diverse coking needs. The coking baffle bracket, as a component connecting the baffle and the telescopic rod, can withstand mechanical and thermal stresses under high-temperature conditions. This device effectively blocks the entry of external air, preventing the molten glass in the large-capacity tank furnace from being contaminated by external air and airborne particles, ensuring the quality of the substrate glass and greatly reducing the possibility of producing defective substrate glass.

This invention relates to the field of contamination control technology for space optical payloads, specifically providing an in-situ molecular cleaning and particulate dust removal system for space optical payloads. The system includes an electrode array and a multi-mode power controller. The electrode array comprises at least two electrode groups with electrodes in different groups interleaved. The multi-mode power controller is configured to: in a first mode, provide direct current to the electrode array to remove organic molecular contaminants from the surface of the optical payload through high-energy ion bombardment; and in a second mode, provide multiphase alternating current with a phase difference to different electrode groups in the electrode array to push particulate contaminants away from the optical payload surface through a traveling wave electric field. This invention fundamentally solves the problem of combined oil film and particulate contamination that traditional technologies cannot handle.

This application provides a wafer storage device, comprising: a main housing with an internal storage space for storing wafers, the storage space having an opening; a baffle structure disposed at the opening and rotatably openable and closable; the baffle structure comprising a plurality of rotating baffles arranged in pairs, the plurality of rotating baffles being sequentially arranged adjacent to each other along the height direction of the main housing at the opening; each pair of rotating baffles being synchronously openable or closed; a first driving device movable along the height direction of the main housing and the axial direction of a first rotating shaft; the first driving device comprising a first driving body and two synchronously rotatable first driving parts, the two first driving parts being disposed on one side of the first driving body, each first driving part having a second coupling part at its end facing the first rotating shaft; when the two second coupling parts are inserted into the corresponding first coupling parts, the two first driving parts can drive the corresponding rotating baffles to swing. It has the advantages of low particulate contamination and long lifespan.

The invention discloses a substrate inverted growth HVPE device, and belongs to the technical field of HVPE devices, the substrate inverted growth HVPE device comprises an upper flange, lifting units are arranged on the two sides of the top of the upper flange, and a metal shaft is rotatably connected to the center of the interior of the upper flange through a sealing bearing. According to the device, a driving motor drives a circular shaft, a driving wheel, a synchronous belt, a driven wheel, a metal shaft, a temperature detection unit, a non-metal shaft, a mounting seat, an annular seat, a substrate seat and a seed crystal or a substrate to rotate, so that the growth surface of the seed crystal or the substrate is in uniform contact with reaction gas rising from the lower part in a reaction seat, and the reaction gas rising from the lower part is in uniform contact with the growth surface of the seed crystal or the substrate; compared with the prior art, convection is more natural, obtaining of more uniform film thickness and component distribution is facilitated, crystal defects caused by particulate matter pollution during crystal growth are effectively overcome through the substrate inversion mode, the risks of fragmentation, scrapping or grade decline caused by the defects are reduced, and the crystal quality is greatly improved.

Method for detecting particle contamination inside (2) a building (1) by means of a detection device (3, 4), wherein a first detection device (3) is located at a first location (5) inside (2) the building (1), wherein first detection information (101) describing particle contamination in the building (1) is generated via the first detection device (3), and a further detection device (4) is arranged at at least one further location (6) inside (2) the building (1), wherein further detection information (102) describing particle contamination in the building (1) is generated via the further detection device (4), and the detection information (101, 102) is transmitted to a central computing unit (7) in order to derive particle contamination information (103) from the combined detection information (101, 102), characterized in thatthat the particle contamination information (103) describes information about at least a quantity of particles at at least one variable reference location inside (2) the building (1), wherein the variable reference location is assigned to a reference object (9) located inside (2) the building (1) at defined times and at defined locations, wherein particle contamination information (103) of the reference object (9) is generated by taking into account detection information (101, 102) of defined locations at defined times.

This invention provides a wafer handling tool, comprising an adjustable-angle robotic arm mechanism, an adsorption mechanism disposed within the robotic arm mechanism, a vacuum generating mechanism connected to the adsorption mechanism, a power supply mechanism, and a control mechanism. The control mechanism controls the operating state of the vacuum generating mechanism to enable the adsorption mechanism to adsorb or release the wafer. This invention utilizes an adjustable-angle robotic arm mechanism to extend into confined spaces such as lithography machines, employing vacuum negative pressure to adsorb the wafer, achieving non-contact wafer removal. This avoids wafer contamination and scratches caused by manual handling, significantly reducing wafer scrap rates. Simultaneously, the exhaust channeling and filtration design effectively reduces the risk of particulate contamination within the machine.

This invention provides a method for controlling gas flow parameters in a wafer cassette, a wafer storage device, and a process chamber. The method includes: a wafer cassette body comprising a casing and a cover, the cover being detachably connected to the casing; a process chamber located inside the casing; and an air inlet and an exhaust outlet at the bottom of the casing; and a sensor array positioned at key monitoring points within the process chamber to collect real-time environmental data from different dimensions within the wafer cassette. This invention employs flow-morphology coupling control, sequentially executing high-flow pulse impact, variable-flow eddy current control, and low-flow laminar flow maintenance to drive the airflow into an "impact-swirl-push" trajectory, and continuously corrects parameters in real time. This solution solves the problems of dead zones at the top and airflow short-circuiting caused by bottom-inlet / outlet airflow. While balancing efficient replacement with low particulate contamination, it reduces machine downtime, improves production efficiency, and eliminates the need for complex physical modifications to the existing wafer cassette's internal hardware structure, thus reducing modification costs.

The invention discloses a body surface particulate matter pollution protection material and a preparation method thereof, and belongs to the technical field of novel composite fiber materials. Specifically, the invention provides a functional composite nanofiber membrane which adopts a layer-by-layer electrostatic spinning technology and has a special sandwich structure of a PVDF outer layer, a TPU middle layer and a PLA inner layer, the fiber diameter of the material can reach the nanoscale, and the functional composite nanofiber membrane has the advantages of large aperture, high porosity, large specific surface area and the like and is suitable for being used as a high-performance protective base material.

This invention discloses a vacuum coating method and system. The system includes a first sputtering chamber, a first vacuum transport channel, a CVD chamber, a second vacuum transport channel, and a second sputtering chamber connected in sequence. This invention utilizes the flow resistance throttling effect created when the substrate moves within the first vacuum transport channel to establish a pressure gradient between the first sputtering chamber and the CVD chamber. This drives the active plasma within the CVD chamber to form a reverse jet pointing towards the first sputtering chamber, performing an in-situ hybridization reaction on the first metal layer on the substrate surface, thereby constructing a gradient transition layer. This invention eliminates physical gate valves, removes particulate contamination, and significantly improves the adhesion and weather resistance of the HUD reflector coating.

The invention provides an air uniformizing device and semiconductor gluing and developing equipment, and relates to the technical field of semiconductor manufacturing. Comprising an air box with an air inlet formed in one side face and a plurality of air outlets formed in the bottom face; the first air uniformizing plate is installed in the air box, one end of the first air uniformizing plate is connected with the bottom of the air inlet, a first inclination angle is formed between the first air uniformizing plate and the bottom face of the air box, a plurality of first air uniformizing through holes are formed in the first air uniformizing plate, and the distribution density of the first air uniformizing through holes is gradually increased from the end close to the air inlet to the end away from the air inlet; the second air uniformizing plate is installed in the air box, one end of the second air uniformizing plate is connected with the bottom of the inner side wall, away from the air inlet, of the air box, the other end of the second air uniformizing plate is connected with the inner side wall of the top of the air box, and a second dip angle is formed between the second air uniformizing plate and the bottom face of the air box. Uniform air outlet of the bottom face of the air box can be achieved, local high-speed whistling and plate resonance are avoided, and abnormal sound and particle pollution are prevented.

This invention discloses a sputtering coating machine, relating to the field of coating equipment technology, comprising: a frame, on which a coating chamber is fixedly mounted, and a coating mechanism is disposed inside the coating chamber; and a powder cleaning assembly, disposed inside the coating chamber, comprising a cleaning component and a protective component, the cleaning component comprising a strip-shaped electrostatic dust suction head. This invention achieves coordinated automation of target protection and cleaning through the powder cleaning assembly. During target lifting, the protective plate automatically closes to cover the target when coating stops, while the strip-shaped electrostatic dust suction head cleans the surface of the target. This design integrates target shielding and surface cleaning functions into the same action sequence, eliminating the need for additional drive mechanisms or manual intervention. This effectively reduces particulate contamination of the target during non-working periods, thereby improving batch stability and product yield of coating quality, reducing manual intervention, lowering the risk of secondary contamination, and eliminating the need for operators to open the chamber.

A surgical treatment system for contaminated air streams having particulate contamination, polar contamination and / or nonpolar contamination in the gas or vapor stream. A surgical smoke plume treatment system and method provide or define a multi-stage treatment process that mechanically filters the air stream, followed by nonpolar decontamination and then polar decontamination or treatment. The system may be used stand alone or incorporated and used with other surgical instruments or incorporated into an air handler adapted to decontaminate an air stream. A desiccant may optionally be used to remove water from the air stream.