139 results about "Particulate contamination" patented technology

A method is provided for forming an amorphous carbon layer, deposited on a dielectric material such as oxide, nitride, silicon carbide, carbon doped oxide, etc., or a metal layer such as tungsten, aluminum or poly-silicon. The method includes the use of chamber seasoning, variable thickness of seasoning film, wider spacing, variable process gas flows, post-deposition purge with inert gas, and post-deposition plasma purge, among others, to make the deposition of an amorphous carbon film at low deposition temperatures possible without any defects or particle contamination.

Improved long gas injectors for a vertical furnace used in semiconductor wafer processing are useful to minimize particulate contamination in the wafer processing area of the furnace, and minimize distortion of the long injectors during thermal excursions. The improved injectors are fabricated with a stabilizing quartz standoff positioned near the onset of the vertical portion of the injector tube which adds support to the long tube. Thickness of the standoff is calculated to define and enforce a specified separation distance between liner and injector, as well as to provide dual alignment points at the base of the liner and at the tip of the injector.

A drying agent enclosed in an organic EL element is sealed with a shape with which particulate contamination becomes less than that of a conventional shape, while still capable of showing a moisture absorption capacity similar to that of a fine powder. A light emitting device, and an electronic device, having long life and having less particulate contamination than in a device manufactured by conventional processes, are provided by using the organic EL element. The drying agent, made from a compound capable of chemically absorbing moisture, is formed as a bulk porous body or a porous film, and is formed along with the organic EL elements within a container cut off from the atmosphere. In addition, the light emitting device and the electronic device are manufactured using the organic EL elements.

This invention relates to a dense ceramics having ESD dissipative characteristics, tunable volume and surface resistivities in semi-insulative range (10.sup.3 -10.sup.11 Ohm-cm), substantially pore free, high flexural strength, light colors, for desired ESD dissipation characteristics, structural reliability, high vision recognition, low wear and particulate contamination to be used as ESD dissipating tools, fixtures, load bearing elements, work surfaces, containers in manufacturing and assembling electrostatically sensitive microelectronic, electromagnetic, electro-optic components, devices and systems.

Enclosures having adjustable clean gas flow environments and methods of enclosed pressure differential distribution technology. Specifically, clean gas flow enclosures, which provide for the isolation of materials from airborne micro-particulate contamination. An embodiment of the invention utilizes a small footprint, modular, selectable, clean-gas flow environment for handling and isolating materials. The environment can be a clean room class environment by providing filtered gas from a gas flow generator (12) through a gas filter (13) to a filtered gas flow space (20). An embodiment of the invention provides a first plenum (23) and a second plenum (26) so that both a horizontal filtered gas flow and vertical filtered gas flow may be used separately or in combination within the same filtered gas flow space (20).

Wafer carriers in an integrated circuit fab are tested for residual particle contamination by replacing the standard carrier door by a test cover having a gas inlet and outlet, counting the number of FM particles exiting the carrier during a flush cycle with a test gas having a known concentration of FM particles and either continuing processing if the number of FM particles is below a threshold, performing a purge with the test gas if the contamination is in a purge range, or sending the carrier out for cleaning if the number of FM particles is above the purge range.

A surface structure for contacting a workpiece includes a flexible layer adhered to a support element and a coating on the flexible layer. The coating has ripples on its surface. The flexible layer may be thermally conductive. The ripples on the surface enhance thermal transfer from the workpiece and are characterized by low particle generation and low particulate contamination of the workpiece. The ripples in the coating may be formed by expanding the flexible layer, applying the coating to the expanded flexible layer and then contracting the flexible layer. In one application, the surface structure is utilized in an electrostatic wafer clamp. The surface structure provides high efficiency thermal transfer in a vacuum processing system when utilized in conjunction with a low pressure cooling gas between the workpiece and the surface structure.

A valve apparatus especially well-suited for use in gaseous oxygen delivery systems. A valve apparatus is provided that substantially reduces the risk of fire in high-pressure oxygen systems. The apparatus is particularly well-suited for use as a plug valve on ordinary cylinder containers, but may be beneficially used in any pressurized gas system, particularly oxygen systems such as those encountered in many industrial facilities. The wetted portion of the valve is isolated from threaded portions to prevent particulate contamination of the gas stream. The valve seat is located to protect it from direct impact of high-velocity gas streams. The inventive valve, and its associated inventive check-filter and excess-flow prevention features, reduces the potential for hazardous combustion at valve points within oxygen delivery systems.

The invention relates to a high optical purity toughened copolymer film or coating. The copolymer is a graft or block copolymer, preferably acrylic, preferably produced by a controlled radical polymerization having an extremely low degree of particulate contamination and excellent optical properties. The film or coating is preferably formed by solvent-casting on a temporary substrate or solvent-coating on a permanent substrate.

A method of making a top-emitting LED device, including providing, over a substrate, a laterally spaced and optically opaque lower electrode and an upper electrode buss that is electrically insulated from the lower electrode; depositing material forming an EL medium structure over the lower electrode and the upper electrode buss; depositing, over the EL medium structure, a first light-transmissive upper electrode that protects the EL medium structure from particulate contamination; and selectively removing most of the EL medium structure over a selective portion of the upper electrode buss.

A method for calibrating a laser micro-machining system in three dimensions includes scanning a sample workpiece to determine the 3D surface, calculating the best fit surfaces to the scanned data in a series of steps, and storing the results so that subsequent workpieces can be calibrated to remove systematic errors introduced by variations in an associated material handling subsystem. The method optionally uses plate bending theory to model particulate contamination and splines to fit the 3D surface in a piecewise fashion to minimize the effect of local variations on the entire surface fit.

A cleaning composition for cleaning particulate contamination from small dimensions on semiconductor substrates. The cleaning composition contains supercritical CO2 (SCCO2), alcohol, fluoride source and, optionally, hydroxyl additive. Such cleaning composition overcomes the intrinsic deficiency of SCCO2 as a cleaning reagent, viz., the non-polar character of SCCO2 and its associated inability to solubilize species such as inorganic salts and polar organic compounds that are present in particulate contamination on wafer substrates and that must be removed from the semiconductor substrate for efficient cleaning. The cleaning composition enables damage-free, residue-free cleaning of substrates having particulate contamination on Si/SiO2 substrates.

There are provided an ultrasonic cleaning apparatus and an ultrasonic cleaning method capable of suppressing occurrence of damage on a substrate to be cleaned and capable of performing cleaning at a high cleaning level for highly precise substrates and the like used in an electronics industry. Occurrence of damage on the substrate to be cleaned is suppressed by holding an object to be cleaned so as to be positioned out of a region where perpendiculars extend from an oscillating surface of an ultrasonic transducer to a liquid surface (an ultrasonic-irradiated region) under and in the vicinity of the liquid surface of a cleaning solution, exciting a capillary wave on a surface of the cleaning solution by an ultrasonic wave, and separating particulate contamination of the object to be cleaned by an acoustic pressure generated by the capillary wave without irradiating the object to be cleaned directly with the ultrasonic wave.

An installation for manufacturing containers by moulding from a perform includes at least one moulding unit having a control device for controlling at least one nozzle associated with a mould, the nozzle being vertically movably mounted so as to move vertically between a top position and a bottom position in which the mould is closed. The nozzle covers at least one flow opening that includes an upper horizontal wall of the mould. The manufacture involves at least a first step including, the mould being closed, systematically controlling the vertical descent of the nozzle towards the bottom position independently of the presence or absence of a preform in the mould so that, both when the installation is operating and when it is at rest, the internal volume of the mould is isolated in order to avoid the risk of airborne particulate contamination.

A processing system utilizing a supercritical fluid for treating a substrate is described as having internal members having a coating. For example, the coating in internal members can reduce particulate contamination during processing. Additionally, a method for using the processing system is described.

An encapsulating bag for contamination control on gas cylinders employs a main body of fabric such as polyester or flouropolymer having a weave sufficiently tight to preclude contaminant transmission. A bottom boot engages a lower portion of the main body to cover the bottom of the cylinder. A separation closure means such as a non-metal zipper is incorporated into the main body for opening the main body for insertion of the cylinder. A cuff is attached to a top circumference of the bag main body for close engagement of a top boss of the cylinder to preclude contaminant escape. An ESD button is incorporated in the body of the bag for attachment of a conducting lead for grounding connection.

A hard disk drive inner part formed of a resin which exhibits well-balanced low outgassing properties, ultrasonic cleaning resistance, low ionic contamination properties, low particulate contamination properties, repeated removability, heat resistance, specific gravity, and water-absorbing properties. The hard disk drive inner part includes a resin composition which includes a polyphenylene ether resin (A).