Probe arrays and method for making

Abstract

Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

Description

RELATED APPLICATIONS [0001] This application is a CIP of U.S. patent application Ser. No. 11 / 028,958, filed Jan. 3, 2005; Ser. No. 10 / 434,943, filed May 7, 2003; Ser. No. 11 / 029,217, filed Jan. 3, 2005; Ser. No. 11 / 028,945, filed Jan. 3, 2005; Ser. No. 11 / 029,221, filed Jan. 3, 2005; and Ser. No. 11 / 028,960, filed Jan. 3, 2005. The '958 application in turn claims benefit of U.S. App. Nos. 60 / 533,947, filed Dec. 31, 2003; 60 / 533,933, filed Dec. 31, 2003; 60 / 536,865, filed Jan. 15, 2004; and 60 / 540,511, filed Jan. 29, 2004 and is a continuation in part of U.S. application Ser. Nos. 10 / 772,943, filed Feb. 4, 2004; Ser. No. 10 / 949,738, filed Sep. 24, 2004; and Ser. No. 10 / 434,493, filed May 7, 2003. The '738 application claims benefit of U.S. App. Nos. 60 / 506,015, filed Sep. 24, 2003; 60 / 533,933, filed Dec. 31, 2003; and 60 / 536,865, filed Jan. 15, 2004. Furthermore the '738 application is a CIP of U.S. application Ser. No. 10 / 772,943, filed Feb. 4, 2004, which in turn claims benefit to ...

AI Technical Summary

Benefits of technology

[0043] It is an object of some embodiments of the invention to provide solder bumps of enhanced height via the use of rings or collars of retention material.

Problems solved by technology

The CC mask plating process is distinct from a “through-mask” plating process in that in a through-mask plating process the separation of the masking material from the substrate would occur destructively.

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