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Electroplating method for double-side and multilayer flexible printed circuit board

A flexible printing and circuit board technology, applied in the directions of printed circuits, printed circuit manufacturing, electrical components, etc., can solve problems such as poor lines, and achieve the effect of improving yield, reducing costs, and improving poor lines

Active Publication Date: 2012-01-11
深圳市合力泰光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is the defect that more than 15% of defective circuits can be produced during the electroplating process of double-sided and multi-layer flexible printed circuit boards. Electroplating method with low defect rate in the process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A pattern electroplating method for double-sided flexible printed circuit boards, which has the following steps in sequence:

[0021] Copper foil cutting→mechanical drilling of the first through hole→black hole→first pressing of dry film→first exposure→first development→graphic plating→chemical polishing→second pressing of dry film→second exposure→second Secondary development → line etching → dry film removal.

[0022] The copper foil cutting is to cut the copper clad laminate raw material into a set size.

[0023] The mechanical drilling is to use a drill to drill the first through hole on the copper clad laminate.

[0024] The black hole is a conductive carbon powder layer adhered on the inner wall surface of the first through hole.

[0025] The first pressing of the dry film is to press the dry film on the surface of the copper-clad board. The dry film is a UV-sensitive polymer film with a thickness of 40 μm and is corrosion-resistant to the electroplating solution...

Embodiment 2

[0034] A pattern electroplating method for a four-layer flexible printed circuit board, the steps of which are the same as in Example 1.

[0035] The line width of the outermost layer of the four-layer flexible printed circuit board A2 is 0.1 mm, and the line pitch is 0.1 mm.

Embodiment 3

[0037] A pattern electroplating method for a double-sided flexible printed circuit board, the steps of which are the same as in Embodiment 1.

[0038] The difference is that: a second through hole is formed on the copper area attached to the ground. The diameter of the second through holes is 0.15 mm, and the center distance between the second through holes is 0.3 mm.

[0039] The obtained double-sided flexible printed circuit board A3 has a line width of 0.1 mm and a line pitch of 0.1 mm.

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Abstract

The invention provides an electroplating method for a double-side and multilayer flexible printed circuit board, which sequentially comprises the following steps of copper foil cutting, mechanical drilling of a first through hole, hole blackening, primary dry film pressing, primary exposure, primary development, pattern electroplating, chemical grinding, secondary dry film pressing, secondary exposure, secondary development, circuit etching and dry film removal. The pattern electroplating comprises the processes that a copper-clad plate is in contact with electroplating liquid, a copper layer is plated between positions without dry film coverage including the first through hole and circuit patterns, and the copper layer is not plated and covered on the surface of a circuit pattern without the dry film coverage. The circuit etching comprises the processes that the copper-clad plate is in contact with etching liquid, and the circuit patterns are etched onto the surface of the copper-clad plate. The electroplating method has the advantages that the circuit patterns are formed during the electroplating exposure, the copper plating is adopted between circuits so that products become hard, the products can be preferably protected, the folding crease is prevented, and the circuit defects can be obviously avoided. The method only adopts once dry film removal, the cost is reduced, the delivery speed is accelerated, simultaneously, the folding crease is also prevented, and the qualification rate of finished products is improved.

Description

technical field [0001] The invention relates to surface treatment of printed circuit boards, in particular to an electroplating method for double-sided and multilayer flexible printed circuit boards. Background technique [0002] Double-sided high-deflection flexible printed circuit boards (such as flexible printed circuit boards in the dynamic sliding part of slider mobile phones) usually have more than 100,000 times of deflection requirements, which determines that such circuit boards must use ultra-thin materials and hole copper plating process. The conventional process flow of this type of circuit board is: copper foil cutting → mechanical drilling → black hole → pressing dry film → exposure → development → hole copper plating → removing dry film → chemical research → re-pressing dry film → re-exposure → re-development →Line etching→remove the dry film. However, ultra-thin materials are prone to wrinkling during the above-mentioned process, resulting in as many as 15% ...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/18
Inventor 谢兵斌庞道成
Owner 深圳市合力泰光电有限公司
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