The invention relates to a method for carrying out surface processing on an electronic circuit board (PCB) by a developing machine after welding prevention processing, which comprises the following procedures of processing by a first developing trough, primary wind pressure tube water prevention, processing by a second developing trough, secondary wind pressure tube water prevention, processing by a third developing trough, tertiary wind pressure tube water prevention, medium pressure washing, processing by a punching water jet scalpel, composite washing, processing by a sponge roller, cold air drying, hot air drying, inspection and the like. In the invention, after spray disks of the developing troughs are structurally regulated and the punching water jet scalpel is added, no residual ink is generated at the bottom of a blink hole and no phenomenon of poor hole blockage of a through hole is generated; by a wind pressure water prevention mode, the defect that after the ink is rolled by the roller, the copper surface of the PCB is stained with the ink can be improved and the amount of printing ink on pad can be reduced; the water using amount can be saved; the speed of the developing machine can be improved, the production efficiency is promoted, the scrappage is reduced and the yield rate of the PCB can be promoted.