MBS bridge type rectifier welding procedure

Abstract

The invention discloses an MBS bridge type rectifier welding procedure, including the following steps: a, chip P face prewelding is carried out, namely a soldering flake with uniform soldering tin amount is used for carrying out chip P face prewelding, so as to ensure N face of chip to be even; b, a solder paste wetting pen is used for wetting solder paste, namely the solder paste wetting pen is used for wetting quantitative solder paste on a tablet; c, a prewelding chip is positioned, namely the even N face of chip is positioned on the tablet by virtue of solder paste with higher viscosity after the step b; d, the tablets are combined; e, tunnel furnace welding is carried out. The invention has the beneficial effects that: soldering flake with uniform soldering tin amount is used for carrying out P face prewelding, so that solder paste amount of P face of chip can be fully ensured to certain extent; solder paste with higher viscosity is used for positioning the chip, thus overcoming the defect of welding deviation as viscosity of soldering flux is not high enough; the method has extremely less investment and operation convenience; time for manually adjusting deviated chip is greatly reduced, and efficiency is improved by more than 2.5 times; and the original welding deviation reject ratio is reduced to 0% from 15%.

Description

technical field [0001] The invention relates to the technical field of electronic product processing, in particular to a welding process for an MBS bridge rectifier device. Background technique [0002] At present, semiconductor rectifier devices used in the energy-saving lamp industry are mainly welded in the way of "chip pre-soldering, and then assembled". The shape is similar to a cube or a sphere, which leads to difficulty in separating the pre-soldered chips during assembly and soldering, difficult positioning of the flux used for the pre-soldered chips, chip deviation in soldered products, and low efficiency. [0003] With the development of production technology, people began to study the feasibility of using manipulators for welding production of this product. Tests by most manufacturers have proved that this method can improve the situation of product chip deviation, but this method mainly introduces imported equipment, which is expensive and costly. Large; and it ...

AI Technical Summary

Problems solved by technology

[0002] At present, semiconductor rectifier devices used in the energy-saving lamp industry are mainly welded in the way of "chip pre-soldering, and then assembled". The shape is similar to a cube or a sphere, which leads to difficulty in separating the pre-soldered chips during assembly and soldering, difficult positioning of the flux used for pre-soldered chips, chip deviation in soldered products, and low efficiency, etc.

[0003] With the development of production technology, people began to study the feasibility of using manipulators for welding production of this product. Tests by most manufacturers have proved that this method can improve the situation of product chip deviation, but this method mainly introduces imported equipment, which is expensive and costly. Large; and it is not easy to control the amount of solder paste on the P side of the chip, resulting in the failure of the reliability of the product

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