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MBS bridge type rectifier welding process

A welding process and bridge rectification technology, used in welding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of pre-soldered chips not easy to split, low efficiency, high cost, etc., and improve the welding deviation. The effect of reducing chip time and investment cost

Active Publication Date: 2012-10-10
CHONGQING PINGWEI ENTERPRISE
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, semiconductor rectifier devices used in the energy-saving lamp industry are mainly welded in the way of "chip pre-soldering, and then assembled". The shape is similar to a cube or a sphere, which leads to difficulty in separating the pre-soldered chips during assembly and soldering, difficult positioning of the flux used for pre-soldered chips, chip deviation in soldered products, and low efficiency, etc.
[0003] With the development of production technology, people began to study the feasibility of using manipulators for welding production of this product. Tests by most manufacturers have proved that this method can improve the situation of product chip deviation, but this method mainly introduces imported equipment, which is expensive and costly. Large; and it is not easy to control the amount of solder paste on the P side of the chip, resulting in the failure of the reliability of the product

Method used

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  • MBS bridge type rectifier welding process
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Embodiment Construction

[0016] In order to make the present invention easier to understand, the present invention will be described in more detail below in conjunction with specific embodiments.

[0017] First of all, design the chip directional suction cup, blank positioning cover, solder paste box and solder paste pen tooling. The specific design is as follows:

[0018] .Chip directional sucker design: design the hole depth of the current sucker from 0.5mm to 0.35mm, and increase the chamfer of 0.1mm around, so as to facilitate the 100% reverse (flip) function of the chip;

[0019] Blank positioning cover design: designed as a thin aluminum alloy frame, the purpose is to position the blank on the blank tray, so that the blank will not be lifted up during the solder paste dipping operation, resulting in uneven solder paste;

[0020] Solder paste box design: It is designed as a small aluminum alloy groove, and the solder paste dip pen is just placed in the groove; the purpose is to make each point of...

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Abstract

The invention discloses an MBS bridge type rectifier welding procedure, including the following steps: a, chip P face prewelding is carried out, namely a soldering flake with uniform soldering tin amount is used for carrying out chip P face prewelding, so as to ensure N face of chip to be even; b, a solder paste wetting pen is used for wetting solder paste, namely the solder paste wetting pen is used for wetting quantitative solder paste on a tablet; c, a prewelding chip is positioned, namely the even N face of chip is positioned on the tablet by virtue of solder paste with higher viscosity after the step b; d, the tablets are combined; e, tunnel furnace welding is carried out. The invention has the beneficial effects that: soldering flake with uniform soldering tin amount is used for carrying out P face prewelding, so that solder paste amount of P face of chip can be fully ensured to certain extent; solder paste with higher viscosity is used for positioning the chip, thus overcoming the defect of welding deviation as viscosity of soldering flux is not high enough; the method has extremely less investment and operation convenience; time for manually adjusting deviated chip is greatly reduced, and efficiency is improved by more than 2.5 times; and the original welding deviation reject ratio is reduced to 0% from 15%.

Description

technical field [0001] The invention relates to the technical field of electronic product processing, in particular to a welding process for an MBS bridge rectifier device. Background technique [0002] At present, semiconductor rectifier devices used in the energy-saving lamp industry are mainly welded in the way of "chip pre-soldering, and then assembled". The shape is similar to a cube or a sphere, which leads to difficulty in separating the pre-soldered chips during assembly and soldering, difficult positioning of the flux used for the pre-soldered chips, chip deviation in soldered products, and low efficiency. [0003] With the development of production technology, people began to study the feasibility of using manipulators for welding production of this product. Tests by most manufacturers have proved that this method can improve the situation of product chip deviation, but this method mainly introduces imported equipment, which is expensive and costly. Large; and it ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/008B23K3/08
Inventor 安国星
Owner CHONGQING PINGWEI ENTERPRISE
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