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Chemical etching liquid for metals and etching method

A technology of chemical etching and etching solution, which is applied in the field of metal chemical etching solution and etching, which can solve the problems of severe edge burrs, edge burrs, and blackening of the bottom of the product, and achieve the effect of saving equipment

Active Publication Date: 2011-06-29
南通麦特隆新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This etchant is only suitable for etching the surface of stainless steel. If it is used as the etching of the copper surface, the shading will be too rough, the edge burrs will be serious, and the etching efficiency will be low; if it is used as the etching of the aluminum alloy surface, it will make After etching, the bottom of the product turns black, the shading is rough, and the edges are severely burred

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] 1. Preparation of etching solution

[0044] Prepare 200L of etching solution: dissolve 120kg of ferric chloride, 24L of hydrochloric acid, 20L of phosphoric acid, 20L of nitric acid, 40g of hexamethylenetetramine, and 16g of sodium dodecylbenzenesulfonate in water to obtain a total amount of 200L of etching solution.

[0045] 2. Etching

[0046] Add the above etching solution into the etching machine, the temperature of the etching solution is 40°C, and the spray pressure is 30kg / cm 2 .

[0047] Spray anti-etching ink (light-curing ink) on the surface of the copper product to hide the part that does not need to be etched. After the exposure process, the pattern that needs to be etched is exposed on the surface of the product. After development, the ink that needs to be etched will be removed. It will be faded, and then the product will be put into the etching machine, and the pattern will be revealed after the etching is completed.

[0048] The pattern area of ​​the ...

Embodiment 2

[0050] 1. Preparation of etching solution

[0051] Prepare 200L of etching solution: 110kg of ferric chloride, 32L of hydrochloric acid, 24L of phosphoric acid, 26L of nitric acid, 20g of ethylenediamine, 24g of dodecyl alcohol amide, and a total of 200L of etching solution dissolved in water.

[0052] 2. Etching

[0053] Add the above etching solution into the etching machine, the temperature of the etching solution is 40°C, and the spray pressure is 30kg / cm 2 .

[0054] Spray anti-etching ink (light-curing ink) on the surface of the copper product to hide the part that does not need to be etched. After the exposure process, the pattern that needs to be etched is exposed on the surface of the product. After development, the ink that needs to be etched will be removed. It will be faded, and then the product will be put into the etching machine, and the pattern will be revealed after the etching is completed.

[0055] The pattern area of ​​the etched product has finer shadin...

Embodiment 3

[0057] 1. Preparation of etching solution

[0058] Prepare 200L of etching solution: 152kg of ferric chloride, 16L of hydrochloric acid, 28L of phosphoric acid, 15L of nitric acid, 40g of triethanolamine, 40g of heptadecanamide, and 40g of sodium dodecylbenzenesulfonate, dissolved in water to obtain a total of 200L of etching solution.

[0059] 2. Etching

[0060] Add the above etching solution into the etching machine, the temperature of the etching solution is 40°C, and the spray pressure is 30kg / cm 2 .

[0061] Spray anti-etching ink (light-curing ink) on the surface of the copper product to hide the part that does not need to be etched. After the exposure process, the pattern that needs to be etched is exposed on the surface of the product. After development, the ink that needs to be etched will be removed. It will be faded, and then the product will be put into the etching machine, and the pattern will be revealed after the etching is completed.

[0062] The pattern ar...

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PUM

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Abstract

The invention provides a chemical etching liquid for metals. The chemical etching liquid comprises ferric chloride, hydrochloric acid, phosphoric acid, hydrogen nitrate, a corrosion inhibitor and a surface active agent. The corrosion inhibitor is at least one of hexamethylene tetramine, ethidene diamine, triethanolamine and heptadecane amide; and the surface active agent is one or two of sodium lauryl benzenesulfate and dodecyl alcohol amine. The invention further discloses a chemical etching method for metals; with the method, the metals are etched through spraying the etching liquid; and the etching liquid is provided by the invention. The etching liquid provided by the invention can be applied to surface etching of various metals, particularly stainless steel, copper and aluminum alloy; and since the metals can be etched with the same etching liquid, the consumption of equipment is reduced.

Description

technical field [0001] The invention relates to metal chemical etching solution and etching method. Background technique [0002] Chemical etching is a process in which unwanted metals are quickly dissolved and removed by chemical reactions using the corrosive action of chemical solutions. The basic process of chemical etching is as follows: the initial metal parts are routinely cleaned and degreased to make the surface clean, and then the surface is coated with light-curable ink, and the light-curable ink is exposed according to the processing pattern, and then developed and secondary cured After the corrosion process is completed, the ink on the surface is removed with a strong alkaline solution, and finally cleaned with water to obtain the etched product. [0003] The existing chemical etching solution is mainly aimed at specific stainless steel, copper or aluminum alloy, etc., and there is no etching solution that can be used for stainless steel, copper and aluminum all...

Claims

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Application Information

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IPC IPC(8): C23F1/16
Inventor 方锋丁维清
Owner 南通麦特隆新材料科技有限公司
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