18 results about "Microstructure fabrication" patented technology

The invention discloses a cooperative control method for manufacturing precision between complex thin-wall microsphere shell component forming processes, and relates to the technical field of microsphere shell component machining. The invention relates to a multi-process forming method for a micro-spherical crown structure on the surface of a complex thin-wall micro-spherical shell component in the prior art. According to an existing manufacturing precision keeping and reference transferring method, due to factors such as low soft and brittle hardness of a workpiece material, high precision requirement and multiple processes, the pose precision and the manufacturing precision of a micro-spherical shell are difficult to keep in multi-process circulation. The device is used for four workpiece circulation processes of material milling removal-laser etching marking-milling quality characterization-laser local modification-surface quality detection corresponding to three processes of milling removal of a micro spherical crown structure on the surface of a thin-wall micro spherical shell component, laser modification and measurement characterization. All the steps cooperate to achieve high-precision forming of the micro-spherical crown structure on the surface of the complex thin-wall micro-spherical shell component. The method is used for forming the complex thin-wall microsphere shell component.

The invention discloses a dodging sheet with a deflection angle and a preparation method of the dodging sheet, and belongs to the technical field of optical microstructure manufacturing. The dodging sheet comprises a transparent base material and a deflection free-form surface microstructure array which is arranged on the transparent base material in an out-of-order mode, the related length of a microstructure is 30-60 micrometers, the height is 5-20 micrometers, and the deflection angle is 0-45 degrees and can be continuously adjusted. According to the preparation method, an integrated process of SLM phase shaping, laser-induced modification and selective chemical etching is adopted, composite phase design is carried out through a spatial light modulator, an inclined free-form surface modification domain is formed in a base material in combination with femtosecond / picosecond laser, and then a target microstructure is obtained through chemical etching. According to the invention, the high optical performance of improved dodging uniformity and high transmittance is realized, and meanwhile, the method has the advantages of simplified process, flexible design and low cost, and is suitable for a high-end optical system.

This invention provides a method for preparing a piezoelectric thin film with functional microstructures based on PZT and PU, which saves significant costs, simplifies the process, and is easy to operate. The invention includes the following steps: Step 1: Particle modification; Step 2: Microstructure fabrication, including the following steps: adding PZT powder to a THF organic solvent, followed by ultrasonic dispersion to prevent particle agglomeration; adding PU after ultrasonication, stirring, evaporating, and allowing to stand; laying the above solution on a photolithographic silicon mold, drying it in an oven, and finally demolding with alcohol to obtain a piezoelectric thin film with a functional microstructure array.

The present application relates to the technical field of metal additive manufacturing, and discloses a laser powder bed fusion additive manufacturing process for GH3625 fine structure, aiming at the problem that the current fine structure metal additive manufacturing process is prone to adhesion between fine structures and surface quality decline, comprising the following steps: constructing a three-dimensional model of fine structure; performing additive manufacturing pretreatment on the three-dimensional model of fine structure; loading GH3625 raw material powder into an additive manufacturing equipment, inputting the three-dimensional model, and setting equipment parameters; using a one-way scanning strategy to perform laser powder bed fusion additive manufacturing of GH3625 fine structure, layer-by-layer powder laying and scanning, and controlling the interlayer waiting time to be 10-15s until the GH3625 fine structure is manufactured into a shape. For the fine structure such as porous structure or dot array in additive manufacturing, the manufacturing strategy of laser one-way scanning is adopted, and the interlayer waiting time in the additive manufacturing process is appropriately prolonged, so that the powder splashing and adhesion phenomenon are greatly alleviated, and the forming quality of the fine structure is improved.

This invention discloses a thin film with a multi-level microstructure surface, its preparation method, and its applications, belonging to the field of thin film microstructure construction technology. This invention is the first to apply the dynamic behavior of fluids during stretching motion to the construction of multi-level microstructures on a thin film surface. Compared to traditional microfabrication techniques, the stretch flow curing method's most significant advantage lies in its extremely simplified process flow and high flexibility. The entire preparation process includes only two key stages—stretch flow molding and curing—significantly reducing equipment complexity and operational difficulty. The stretch flow curing method not only provides a novel, efficient, and low-cost solution for surface microstructure fabrication but also demonstrates broad application potential in functional thin films, flexible electronics, optical coatings, biointerfaces, and microfluidic devices.

The invention relates to a high-fidelity digital photoetching method based on self-adaptive curvature segmentation and region fitting, which comprises the following steps: acquiring a to-be-processed exposure image, performing curvature analysis and self-adaptive segmentation on the to-be-processed exposure image, and acquiring a plurality of sub-images; fitting the sub-images according to the curvature features of the sub-images, wherein fitting comprises linear fitting, polynomial fitting and local fitting; and obtaining a displacement path of the three-dimensional nano mobile platform based on a fitting result, calculating a local expansion effect of the sub-image through the displacement path, performing preprocessing, and further performing exposure on the preprocessed sub-image to obtain an exposure image. According to the method, the problems of edge sawteeth and line width errors in DMD photoetching are effectively solved through self-adaptive curvature segmentation and a region specificity fitting strategy, the exposure quality and size precision of complex patterns are remarkably improved, and the method is suitable for the fields of high-resolution DMD photoetching, multi-layer patterning, free morphology microstructure manufacturing and the like.

This invention discloses a method for fabricating a stimulus-responsive deformable structure, comprising an actuator layer and a passive layer, specifically including the following steps: S1, preparation of the stimulus-responsive deformable structure; S2, microstructure fabrication pattern design; S3, microstructure laser fabrication; S4, application of a stimulus to cause deformation of the structure; its application is a deformable flexible electronic system. This invention, employing the above steps, provides a method for fabricating a stimulus-responsive deformable structure and its application. It uses a laser to directly fabricate micro-damaged structures on a thin film, and quantitatively controls the deformation parameters of the stimulus-responsive deformable structure by adjusting the pattern, depth, width, arrangement direction, and spacing of the micro-damaged structures. This control is precise and rapid, not limited by material fabrication processes, and has a wide range of applications.

The application belongs to the field of micro-nano optical manufacturing, and discloses a lens microstructure manufacturing error real-time compensation closed loop method, system, computer equipment and storage medium. The method comprises the following steps: after a single lens completes a current process and before entering a next process, three-dimensional topographic data of the single lens is acquired online, and an actual phase is calculated; a manufacturing phase error is obtained by comparing the actual phase with a design phase; a cross-process error transmission model is established to describe the transmission evolution characteristics of the error between different physical mechanism processes; a process parameter compensation amount of the next process is generated according to the error and the model, and equipment parameters are adjusted in real time, so that the phase change generated in the next process offsets the predicted error evolution result. The application realizes single lens level real-time closed loop compensation of cross-process manufacturing errors, effectively suppresses error transmission accumulation, and improves manufacturing precision and consistency.

This invention discloses an efficient magnetic domain refinement method for ultra-low loss oriented silicon steel, relating to the field of steel material technology. The method includes: raw material preparation; hot rolling and final rolling; multi-stage thermomechanical processing; controlled suppression phase formation; secondary re-junction and magnetic field-induced selective growth; surface microstructure fabrication; low-temperature domain refinement annealing and alternating magnetic field coupling; segmented cooling and quality inspection. This invention, through controlled nanoscale suppression phase engineering, forms a high-density and uniform nanoscale suppression phase within the matrix, serving as pinning sites for grain boundaries and subgrain boundaries. This controls grain boundary migration dynamics during high-temperature secondary re-junction, overcoming the problems of abnormal grain growth and microstructure instability caused by uneven distribution and large size dispersion of traditional suppression phases. This avoids the root cause of large magnetic domains, improves the controllability and repeatability of the secondary re-junction process, obtains a more uniform orientation grain size distribution, and reduces localized magnetic domain enlargement and iron loss fluctuations caused by uneven grain size.

The invention discloses a pulse electrochemical etching method for a nickel-based high-temperature alloy core plate micro-channel, and belongs to the technical field of metal microstructure manufacturing and surface processing. According to the method, the pattern windowing of the anti-corrosion layer is adopted to limit the forming area, pulse electrochemical selective dissolution is implemented under the conditions of flat plate opposite arrangement and slit flowing liquid supply, the electrolyte is compounded through a sulfuric acid system to improve the conductivity and wetting bubble removal capacity, and the lateral dissolution tendency is weakened in cooperation with the lateral corrosion inhibiting additive; meanwhile, efficient removal and morphology correction are taken into consideration through segmented excitation of rough etching and fine etching of asymmetric bipolar pulses, so that the micro-channel machining efficiency, stability and section rectangularity are synchronously improved under the condition that electrolyte is not replaced; and stable amplification of the process of the core boards with different sizes can be realized through parameterized control of the current density and the flow per unit area, so that the problems that the lateral erosion tendency is large, the section rectangularity is difficult to guarantee, the dissolution stability is insufficient, the efficiency and the morphology are difficult to consider and the like in the existing processing method are effectively solved.

The invention discloses a laser and micro-pen direct writing combined three-dimensional machining system, and belongs to the technical field of flexible electronic manufacturing and multi-process combined machining. In order to solve the problems of process separation and positioning error accumulation in manufacturing of a micro curved surface circuit and a three-dimensional microstructure, the system integrates an ultraviolet laser, a micro-pen direct writing head and a mechanical arm, and a platform integrating laser surface treatment, micro-pen direct writing and curing is constructed. The ultraviolet laser is provided with a CCD camera and a field lens, moves along the Z axis to realize micron-scale positioning and control and is used for surface modification; the micro-pen direct writing head is mounted on the side of the laser and is driven by an independent motor to extrude conductive slurry to realize pattern direct writing; the mechanical arm serves as a workpiece clamping platform, supports posture adjustment of a complex workpiece, and cooperatively completes seamless switching between the laser processing procedure and the direct writing procedure. In the working process, the CCD camera completes positioning of the surface of a workpiece and then is switched to micro-pen direct-writing forming, and finally the laser is reused for curing, so that whole-process closed-loop machining is formed. The device is suitable for metal, plastic, ceramic and other base materials, the manufacturing requirements of micro-curved-surface circuits and surface microstructures are met, and the machining precision and efficiency of complex curved-surface microstructures are improved through multi-axis linkage and multi-process fusion.

The invention relates to the technical field of micro-structure process equipment, in particular to micro-structure groove color filling equipment and a process thereof, and aims to solve the problems of non-uniform color filling, ink overflow, more surface residues and poor process continuity in micro-structure manufacturing. According to the technical scheme, the device is characterized in that the device comprises a segmented ink filling device, the segmented ink filling device is sequentially arranged in the feeding direction of a base material, microstructure segments and non-microstructure segments are arranged on the surface of the base material at intervals, and the segmented ink filling device selectively makes contact with the surfaces of the microstructure segments and conveys ink with the target width to the microstructure segments; the scraper assembly is used for scraping redundant ink on the surface of the base material; the printing ink in the microstructure groove is cured and shaped by the curing device to form a microstructure layer; according to the residual ink cleaning assembly, a micro-structure groove wall on the surface of a base material is cleaned through a cleaning material, full-automatic continuous production from base material treatment to finished product rolling is achieved through integrated and modularized structural arrangement, and the ink conveying component is rapidly switched between an ink supply station and an ink filling station.

The invention discloses a laser direct writing system for nanoscale spectral depth coding and an implementation method of the laser direct writing system, and belongs to the field of laser processing. A series of problems caused by processing and characterization separation in a traditional process are solved, optical axis layered scanning data are collected in real time through a spectrograph, an objective lens light path is shared with laser direct writing, color information of light is coded into sample depth information, nanoscale detection imaging is achieved, and axial sensitivity is remarkably improved; a suppression light source is adopted to realize super-resolution direct writing; phase distribution is calculated by adopting a feedback aberration-free axial scanning algorithm, so that the focus of the objective lens moves along the optical axis; a multi-stage linkage dynamic adjustment mechanism is established, and the static calibration limitation of a traditional direct writing process is broken through; the method is applied to preparation and morphology characterization in the fields of high-precision nano processing and real-time nondestructive testing, microstructure manufacturing of integrated optical chips and the like, and an advanced solution integrating super-resolution processing and in-situ monitoring is provided for leading-edge scientific research and high-end manufacturing.

This invention discloses a laser-ultrasonic composite machining method for microstructure arrays, belonging to the field of laser precision machining technology. Addressing the problems of poor surface quality, low machining accuracy, and low efficiency in microstructure arrays of rotating parts, this invention proposes an integrated laser-ultrasonic composite machining method for microstructure array positioning, machining, and inspection. After determining the configuration of each component, a probe is used to directly contact and measure the surface of the rotating part, acquiring high-precision three-dimensional contour information of the workpiece and generating a point cloud model. By matching the microstructure array pattern with the point cloud model, the position of the microstructure array is accurately located, and the microstructure array machining process is planned. Focusing lens laser-ultrasonic composite machining improves the internal and external surface quality and machining accuracy of the microstructure; multi-beam parallel processing improves the microstructure fabrication efficiency; and a CCD camera is used for online detection and adjustment of the microstructure array position information. The method disclosed in this patent achieves laser-ultrasonic composite machining of microstructure arrays with high surface quality, high machining accuracy, and high efficiency.

The invention relates to the technical field of semiconductor microstructure preparation, in particular to a Sn-doped CdS superlattice micron cone and a growth method, a Sn micron cone structure is formed due to the non-uniformity of airflow in a quartz tube, the gas flow is slowly reduced to 15 sccm / h from 30 sccm / h, and the Sn micron cone is formed due to the non-uniformity of the airflow in the quartz tube. Reducing the precursor at high temperature to generate Sn, Cd, H2S and H2O; cd and sublimated CdS migrate to a low-temperature area and are deposited on the surface of the Sn cone to form a CdS shell layer. As the high-temperature liquid state is unstable, Sn further reacts to generate SnS2; under the action of interface stress, the SnS2 layer grows and the Sn in the cone is broken into fragments, so that the periodic SnS2 point embedded CdS micron cone is formed. SnS2 is a layered semiconductor, layers of the SnS2 can be arranged approximately perpendicular to the long axis of the micron cone, and finally the CdS / CdS: SnS2 superlattice micron cone is obtained.