The invention discloses a
Bessel beam double-sided
integrated processing system and method, the
system is applied to a to-be-processed sample, the
system comprises an ultrafast
laser emitter, a
beam expander, a spectroscope, a plurality of reflectors and a plurality of focus lens devices, and the to-be-processed sample comprises a transparent material layer and a
metal material layer. Wherein the ultrafast
laser transmitter generates an ultrafast
laser beam, the ultrafast laser beam passes through the
beam expander and the spectroscope which are connected in sequence, a
Bessel beam and target laser are formed on the spectroscope, the
Bessel beam passes through the focus lens device to form a first target beam, and the first target beam is focused on one side of a transparent material layer and one side of a
metal material layer of a sample to be processed; one surface of the
metal material layer is the contact surface of the transparent material layer and the metal material layer, the target laser forms a second target
light beam after passing through the reflective mirror and the focusing mirror device, and the second target
light beam is focused on the other surface of the metal material layer of the sample to be processed, so that the functions of
hole making, metallization and circuit
etching can be simultaneously realized, and the
processing efficiency is remarkably improved.