The invention discloses a
laser double-beam interference micropore
machining phase modulation method which comprises the following steps: respectively emitting two
Gaussian beams, and respectively modulating and compounding phases to obtain vortex Bessel beams; respectively adjusting the pulse sequences of the two
Gaussian beams into a pre-pulse and a main pulse which are connected into a whole and have different energy; respectively carrying out polarization treatment on the two
Gaussian beams to obtain two energy brushes which reversely rotate around the outer surface of the circumference of the vortex
Bessel beam to clean chips; s2, monitoring the difference between the micropore depth and the target hole depth in real time, and continuously adding additional
phase offset to the composite phase in S1; the long focal depth characteristic of the
Bessel beam and the annular
energy distribution of the vortex beam are combined, the focal depth range is expanded, meanwhile,
laser energy is dispersed to the circumferential area from the center point, the peak
power density is reduced, the heat dissipation condition is improved, the problem of insufficient focal depth is effectively solved, and feature offset caused by heat accumulation is synchronously restrained.