190 results about "Bessel beam" patented technology

The invention discloses a laser-TIG (Tungsten Inert Gas) hybrid welding and method based on ultrasonic-assisted wire powder coaxial conveying, after entering, a laser beam forms a semicircular Bessel beam through a lens, a metal wire passes through an ultrasonic-assisted device and then introduces vibration into a welding pool, and six powder conveying guide pipes are uniformly distributed around the metal wire; according to the wire core six-way powder channel coaxial device, a semi-circular light beam passes through the wire core six-way powder channel coaxial device and enters a laser head, and finally the effect of coaxially melting a wire powder material through laser is achieved. A TIG welding auxiliary device is added to one side of a molten pool, metallurgical reaction is promoted, and compactness of a welding seam is improved. The device mainly comprises an annular laser beam wire core six-way powder channel simultaneous melting system, an automatic wire feeding system, a powder feeding system, an ultrasonic vibration system, a TIG auxiliary welding system and the like. The welding efficiency can be improved through the wire core six-way powder channel coaxial melting technology, the flowing stability of a molten pool can be promoted through the ultrasonic-assisted technology, and the welding seam forming quality can be improved through laser-TIG composite welding.

This system and method of for providing a tunable orbital angular momentum system for providing higher order Bessel beams comprising: an acousto-optical deflector configured to receive an input beam, deflect a first portion of the input beam a first deflection angle relative to an axis of propagation and along an optical axis and deflect a second portion of the input beam a second deflection angle relative to the optical axis; a line generator disposed along the optical angle for receiving the first portion and the second portion of the input beam and provide an elliptical Gaussian mean; a log-polar optics assembly disposed along the optical angle for receiving the elliptical Gaussian beam and wrapping the elliptical Gaussian beam with an asymmetric ring; and, a Fourier lens configured to receive the wrapped elliptical Gaussian beam.

The invention relates to the technical field of laser micromachining, in particular to a TGV drilling machining system and method based on a space-time modulation Bessel beam, an initial laser beam is output through a laser device, the initial laser beam is modulated into a dynamic pulse sequence through a pulse chirp regulation and control module, axial energy attenuation is compensated, a machining subsystem generates the Bessel beam, and the TGV drilling machining system and method based on the space-time modulation Bessel beam are obtained. The angle is finely adjusted in real time through piezoelectric driving, and a dynamic spatial light modulator loads an exponential decay type phase mask, so that light beam airspace shaping, non-diffraction light beam generation, pulse time sequence and phase parameter synchronous control and high-peak power pulse array are realized, and finally, integrated micro-perforation and channel modification of the glass substrate are realized; and the machining efficiency and precision are obviously improved.

The invention discloses a sapphire substrate through hole, a superconducting quantum chip manufacturing method and a superconducting quantum chip. The sapphire substrate through hole manufacturing method comprises the following steps: cleaning and drying a sapphire substrate; the cleaned and dried sapphire substrate is fixed to a three-dimensional positioning platform, and the three-dimensional positioning platform is used for moving the sapphire substrate according to a preset machining position so as to achieve relative machining Bessel beam nanoscale displacement; a femtosecond laser light source system emits a Bessel beam according to preset laser process parameters, the Bessel beam is focused to at least one position of a to-be-machined through hole of a sapphire substrate according to a preset laser scanning path, and through hole machining is conducted on the at least one position. According to the invention, the problem that the through hole is difficult to be formed in the sapphire substrate is solved, the high-quality requirement of the through hole in the sapphire substrate in the superconducting quantum chip is met, and a solution is provided for the realization of large-scale expansion of superconducting quantum bits in the future.

The invention provides a space target attitude optical detection device and method, and relates to the field of photoelectric detection and imaging, and the device comprises a Bessel polarization beam emission subsystem, a polarization characteristic and optical signal receiving subsystem, a polarization imaging subsystem, a timing subsystem and a control subsystem. The detection stability and accuracy are further improved through the self-healing property of the Bessel beam; through fusion of the visible light image and the polarization image, the target detection and identification capability can be enhanced, and the detection precision of the space target attitude is further improved.

The invention belongs to the technical field of radiation effect and radiation hardening of semiconductor devices and integrated circuits, and particularly relates to a single event effect laser simulation system based on Bessel beam shaping. A Bessel beam shaping and focusing module based on an axon lens is introduced and composed of the axon lens and two lenses, namely a single lens and a focusing lens, a Gaussian beam of an incident beam is shaped into a quasi-Bessel beam, and the quasi-Bessel beam is utilized to irradiate a semiconductor device to be detected. The axial distribution of the light beam is kept unchanged in a range of hundreds of microns, and the focusing breaking through the diffraction limit is realized in the radial distribution, so that the effect closer to the heavy ion charge deposition track is generated. The technology can solve the problem that a multilayer structure device, a thick sensitive region device and a wide forbidden band device are difficult to test through traditional laser simulation, and has important practical value for promoting laser simulation of the single event effect.

The invention provides a design and manufacturing method of a medium-long wave infrared anti-reflection microstructure window, and relates to the technical field of infrared window processing and application. The method specifically comprises the following steps: performing simulation design on a medium-long wave infrared anti-reflection microstructure according to material characteristics and application requirements of a window substrate, and determining key dimension parameters to be processed; an outer surface anti-reflection microstructure and an inner surface anti-reflection microstructure are machined on the surfaces of the two sides of the window substrate respectively through multi-pulse femtosecond laser Bessel beams. The method has wide adaptability and flexibility, and efficient design and high-quality manufacturing of the anti-reflection microstructure on the surface of any window material can be achieved. The problem that an existing window material is low in medium-wave and long-wave infrared transmittance is solved, meanwhile, the window material has good structural durability and environmental adaptability, and the strict performance requirement of a common-caliber infrared dual-waveband imaging technology for an infrared window is met.

The invention discloses a non-diffraction laser communication terminal based on Bessel beams. The terminal comprises a beacon transmitting module, an optical antenna module, a beacon receiving module, a signal transmitting module, a signal receiving module and a light splitting module. The beacon transmitting module and the signal transmitting module respectively convert the Gaussian beam into a Bessel beam through an axicon, and the Bessel beam is output through a collimating lens; a primary mirror and a secondary mirror of the optical antenna module are mounted in an off-axis manner, so that light beams are shrunk and expanded; the light splitting module completes light path switching and light splitting through a fast reflecting mirror, a 1 / 4 wave plate, a dichroscope and a polarizing beam splitter; the beacon receiving module obtains beacon light position information through a CMOS detector, and the signal receiving module receives signal light through an APD detector. The non-diffraction characteristic of the Bessel beam is utilized, and the off-axis optical antenna and the polarization beam splitting design are combined, so that high-precision and low-loss laser communication is realized.

The invention relates to the field of electromagnetic calculation, in particular to a petal-shaped Bessel light-based distance measurement method in hypersonic plasma turbulence, which comprises the following steps of: simulating plasma sheath turbulence by establishing a multi-layer random phase screen, calculating diffraction transmission of petal-shaped Bessel light after the petal-shaped Bessel light passes through the turbulence, and capturing intensity distribution of reflected light beams; the rotation angle is determined based on the correlation with the ideal intensity distribution, and high-precision distance measurement is realized by using the linear relation between the rotation angle and the propagation distance. The petal-shaped Bessel light is formed by superposing two Bessel mode light beams with different orbital angular momentum orders, has a spatial structure strongly related to the propagation distance, and can keep higher stability and anti-interference capability in a turbulent environment. By combining the self-focusing and approximately non-diffraction characteristics of the Bessel beam, the target detection and distance measurement precision in hypersonic plasma turbulence is remarkably improved, and reliable technical support is provided for communication and target detection of hypersonic aircrafts.

The invention provides an efficient glass substrate through hole preparation device and a structure for generating multiple Bessel beams, which are applied to the technical field of laser processing, and the method comprises the following steps: splitting Gaussian beams generated by a laser through a beam splitting element to obtain multiple Gaussian beams; according to the method, the multiple Gaussian beams are obtained, then the multiple Gaussian beams are subjected to shaping treatment through the optical shaping element, the multiple Bessel beams are obtained, and compared with a mode that a single Bessel beam is used for preparing the glass substrate through hole, the multiple Bessel beams can be generated, so that the preparation efficiency can be improved; besides, any sub-beam of the multiple Bessel beams used for preparing the glass substrate through hole is directly converted from a Gaussian beam, and due to the fact that the Gaussian beam has the characteristic of symmetry, the formed Bessel beam used for preparing the glass substrate through hole is rounder in light spot formed by focusing, and therefore the high-roundness glass substrate through hole can be prepared.

The invention discloses a sidelobe-eliminating Bessel beam drilling device, and relates to the technical field of optical devices, the sidelobe-eliminating Bessel beam drilling device mainly comprises a light generation device, a beam shaping device and a regulation and control device, the light generation device is used for generating circularly polarized light; the light beam shaping device comprises a binary phase plate diffraction optical element and a Bessel light generating element, the binary phase plate diffraction optical element is used for modulating the phase of the circularly polarized light, the Bessel light generating element is used for converting the modulated circularly polarized light into Bessel light beams, the binary phase plate diffraction optical element can generate two different light beams, and the Bessel light generating element is used for generating the two different light beams. The beam shaping device comprises a first type of Bessel beams and a second type of Bessel beams, the first type of Bessel beams and the second type of Bessel beams can generate side lobe destructive interference and main lobe constructive interference, and the regulation and control device comprises a double telecentric optical system, is arranged at the tail end of the beam shaping device and can regulate and control the drilling depth and the drilling position of the beams. According to the invention, the side lobe ablation damage to the drill hole can be avoided to a great extent.

The invention discloses a rapid high-resolution laser differential confocal Raman-LIBS (laser-induced breakdown spectroscopy) spectral microscopic imaging method and device, which are used for solving the problems of low multispectral focus matching efficiency, limited spatial resolution and the like in the prior art. The method comprises the following steps: establishing a height-position mapping model through a linear sensing interval of a differential confocal axial strength curve, calculating focus offset in real time in a spectrum scanning stage, and driving a sample table to carry out closed-loop fixed-focus compensation; and a Bessel beam modulation technology is combined to compress an excitation light spot to a submicron transverse size and expand the focal depth, so that the spatial resolution and the signal intensity are synchronously improved. The device adopts a common-path structure to integrate a light beam modulation system, a differential confocal detection system, a Raman spectrum detection system, an LIBS spectrum detection system and the like, realizes rapid and high-spatial-resolution imaging of geometrical morphology, Raman molecular information and LIBS elemental components, and is widely applicable to the fields of chemical analysis, biomedical detection, material research, trace substance detection and the like.

The invention discloses a uniform Bessel beam drilling device, and relates to the technical field of optical devices, the uniform Bessel beam drilling device mainly comprises a light generation device, a liquid crystal optical element and a regulation and control device, the light generation device is used for generating circularly polarized light and transmitting the circularly polarized light to the liquid crystal optical element; the arrangement mode of liquid crystal molecules in the liquid crystal optical element can be changed through the light-operated orientation technology, the liquid crystal optical element modulated through the light-operated orientation technology can receive circularly polarized light and form uniform Bessel light, and the liquid crystal optical element can have the function of a lens after being modulated through the light-operated orientation technology. Uniform Bessel light can be converged; the regulation and control device comprises a focusing optical element, and the focusing optical element can converge the uniform Bessel light emitted by the liquid crystal optical element again. The invention further discloses a uniform Bessel light drilling method which is implemented by adopting the uniform Bessel light beam drilling device, the energy utilization rate can be improved, the drilling effect is good, and the light path is simple.

The invention discloses a gallium oxide substrate surface grinding morphology prediction method and system, and relates to the technical field of nondestructive testing, and the method comprises the steps: collecting a surface fluorescence distribution image, matching the surface fluorescence distribution image with a pre-constructed fluorescence-crack mapping database, and generating a two-dimensional crack depth distribution cloud picture; marking a risk area coordinate set in the two-dimensional crack depth distribution cloud picture based on a preset crack depth threshold value; inputting the risk area coordinate set into a Bessel beam chromatography scanner for multi-angle transmission type scanning, synchronously collecting scattering images generated by scanning, and fusing the scattering images to generate a subsurface damage three-dimensional model; and performing data registration and weight superposition on the two-dimensional crack depth distribution cloud picture and the subsurface damage three-dimensional model, and outputting a morphology prediction report and grinding process optimization parameters. The subsurface damage three-dimensional model is constructed through the Bessel beam tomography scanning and multi-angle scattering image fusion technology, and high-resolution visual reconstruction of microcracks and damage distribution in the gallium oxide substrate is achieved.

The invention belongs to the technical field of optical communication safety, and aims to solve the problem that the robustness of chaotic laser in a turbulent environment is poor and the chaotic laser is seriously limited in long-distance free space optical communication. The invention provides an anti-turbulence chaotic Bessel Gaussian beam generation device and method, and the method comprises the following steps: laser is collimated through a first plano-convex lens, passes through an adjustable continuous light attenuation mirror and a dielectric film reflector, then returns to the interior of a laser, and generates a chaotic Gaussian beam based on the disturbance of a light field; a chaotic Gaussian beam is emitted from a first non-polarization beam splitter, and the polarization state of the beam is adjusted through a half-wave plate and a linear polarizer, so that the working direction of the beam is the same as that of a reflective pure-phase spatial light modulator; and the beam is expanded by the second plano-convex lens and the third plano-convex lens and is transmitted to the reflective pure-phase spatial light modulator to obtain an l-order chaotic Bessel-Gaussian beam. According to the invention, the chaotic laser and the Bessel beam are combined to cope with a complex space optical communication environment.

The invention provides a glass substrate through hole processing method and device based on laser modification, which are applied to the technical field of laser processing, and the method comprises the following steps: superposing a target horizontal axis central plane of a determined Bessel beam non-diffraction propagation length target horizontal axis center with a thickness central plane of a to-be-processed glass substrate, then, the to-be-processed glass substrate is modified, so that the phenomenon that when the non-diffraction propagation length non-target transverse axis central plane coincides with the thickness central plane of the to-be-processed glass substrate, the non-diffraction propagation length non-target transverse axis central plane is not uniform due to different light beam diameters and energy intensities on the two sides of the non-diffraction propagation length non-target transverse axis central plane can be avoided; therefore, the upper part and the lower part, surrounding the thickness central surface, of the through hole of the obtained glass substrate can be uniformly modified, and the quality of subsequent through hole etching is further improved.

The present invention discloses a laser hole repair system for narrow cavity structural parts without back wall damage, including an ultrafast laser, a beam transmission system, a beam shaping system, a beam focusing system, a coaxial vision system, a three-dimensional motion platform and a computer controller; the ultrafast laser provides a femtosecond laser beam for the entire system, and after the laser beam is transmitted through the beam transmission system, the beam is transmitted to the beam shaping system to obtain a Bessel beam after shaping optimization, and the beam is then focused and contracted by the beam focusing system to the micropores on the surface of the target material of the narrow cavity structural part on the high-precision three-dimensional mobile platform for hole repair, and the whole hole repair process is observed through the coaxial vision system. The present invention obtains the required complete cylindrical micropores and the back wall of the narrow cavity structural part after processing is not damaged. Only the beam process control means are used to achieve the narrow cavity without back wall damage during hole repair, and the operation is simple and convenient.

Disclosed in the present invention is a method for forming a precise through-hole at high speed by using an infrared laser, wherein the method irradiates in turn single modulated Bessel beam onto a workpiece in a scanning fashion by means of a mirror structure with at least one driving unit coupled to form a laser scanning processing pattern that changes the characteristics of the workpiece by precisely micromachining the workpiece into various shapes or sizes at high speed, and then wet-etching the workpiece, such that the method not only enables laser-machining the workpiece at high speed by significantly reducing laser-machining time compared to conventional methods, but also improves productivity by reducing etching time.

The utility model discloses a cutting device utilizing a Bezier beam, which comprises at least two laser processing units, a control unit and a clamping and moving unit, the clamping and moving unit is used for clamping a material to be cut and providing translation in X-Y-Z directions and rotation of the material to be cut, and the cutting device is characterized in that at least two laser processing units are arranged; the laser processing units output non-diffraction Bessel beams, the spot diameter of filiform light spots formed by focusing the Bessel beams is 20-100 micrometers, the non-diffraction distance of the Bessel beams is 15-300 millimeters, and the Bessel beams output by the laser processing units are located in different circumferential directions of the cutting plane respectively. The Bessel beam is adopted, thick materials can be directly ablated and cut, meanwhile, at least two laser processing units are arranged, a plurality of cutting planes can be synchronously cut, or the position of one cutting plane can be simultaneously cut, and the cutting speed is greatly improved.

The invention provides a method for machining a straight micro through hole in glass through ultrafast laser and a machining system. The method comprises the following steps that three glass workpieces are bonded into a sandwich type workpiece through an optical cement technology; the Bessel beam is focused on the sandwich type workpiece by adjusting the length of the Bessel beam; ultrafast laser irradiates the sandwich type workpiece, so that the material structure of the inner area of the glass is converted into a silicon-oxygen three-membered ring or a silicon-oxygen four-membered ring from a silicon-oxygen six-membered ring, and the sandwich type workpiece with a vertically-through modified microarray area inside is obtained after processing; the sandwich type workpiece after laser processing is separated through the optical cement removing technology, and only the target workpiece in the middle is reserved; putting a target workpiece into an etching solution, introducing ultrasonic oscillation for etching, and corroding a silicon-oxygen three-membered ring or a silicon-oxygen four-membered ring in an internal modified microarray region by an etching agent to form a micro through hole; and cleaning the etched target workpiece. The appearance of a horn mouth can be avoided.

The invention provides a high-order Bessel beam generation method and a metasurface axicon device thereof, the metasurface axicon device comprises a reflecting layer, a dielectric layer and an antenna array layer, and the antenna array layer is formed by arranging a plurality of nano columns in a rectangular array. The azimuth angle of each nanorod is coded based on the phase distribution of the high-order Bessel beam to be generated; during use, a high-order Bessel beam is directly generated based on the reflective metasurface, and the scheme has the advantages of small size, integration, wide spectrum and the like; compared with a traditional method, the method has the advantages that the size of the device can be greatly reduced while the same function is realized, so that the application of the high-order Bessel beam in integrated optics is promoted.

The invention provides a long-focal-depth Bessel beam volume microscopic imaging system, and belongs to the technical field of optical microscopic imaging. The system comprises a non-diffraction light beam generation module, a scanning and focusing module, a sample control module, a fluorescence signal detection module and a microscopic imaging processing terminal. According to the invention, laser is used as an excitation light source, the non-diffraction beam generation module generates a long-focal-depth Bessel beam with a non-diffraction distance n times that of a traditional Bessel beam, the transmission distance is controllable, the limitation of an effective numerical aperture can be broken through, and under the condition of a certain transverse resolution, an ultra-large imaging depth of field is provided. Volume imaging is realized by using the characteristic of long focal depth and no diffraction, more axial information stacks are obtained, and the imaging speed and the imaging resolution are relatively high.

The modified Bessel beam generating device that achieves design flexibility is provided. The present invention provides a Bessel beam generating device that splits a laser beam emitted from a single light source and causes diverging light in a donut shape from optical fibers arranged on the same circle to be emitted toward the inside, thereby emitting a disk illumination beam that is focused in the vicinity of the center. This makes it possible to generate a disk illumination beam without blocking the high-intensity central portion and without reducing the light intensity.

The present invention discloses a transparent plastic welding method, device and computer-readable storage medium, the method comprising: placing the transparent plastic on a welding platform; detecting the bonding seam of the transparent material, and determining the area where the bonding seam is located as a target welding area; controlling the laser welding equipment to form a Bessel beam in the target welding area to complete the welding of the transparent material. The present invention improves the welding quality of the transparent material.

This invention relates to the field of semiconductor lasers, and more particularly to a multi-chip ring array vertical cavity surface-emitting laser (VCSEL), comprising: a gain chip array, a beam-splitting axial conical lens group, a beam-combining axial conical lens group, and an output coupling mirror arranged coaxially. The gain chip array includes N (N>1) VECSEL gain chips arranged in M ​​concentric rings (M>1). The beam-splitting axial conical lens group includes M beam-splitting axial conical lenses. The beam-combining axial conical lens group includes M beam-combining axial conical lenses. The N laser beams first pass through the beam-splitting axial conical lens group to generate M-order Bessel beams, and then pass through the beam-combining axial conical lens group to combine into a resonant beam. This resonant beam resonates within the coaxial resonant cavity formed by the output coupling mirror and the gain chip array, resulting in the output laser beam. This invention employs a modular cascaded structure of axial conical lenses, realizing the parallel superposition of multiple rings of chips, fully utilizing the radial spatial dimension, and improving chip integration density.

The application discloses a three-piece Bessel beam shaping system with a diffraction ring, and belongs to the technical field of laser processing, comprising: a beam shaping mirror, a first collimating mirror and a focusing mirror; the incident surface and the exit surface of the beam shaping mirror are annular planes and annular aspheric surfaces respectively, and are used for shaping a collimated Gaussian beam into a point annular beam with energy gradually decreasing from inside to outside; the incident surface and the exit surface of the first collimating mirror are annular aspheric surfaces and annular planes respectively, and are used for collimating the point annular beam; the incident surface of the focusing mirror is a combination of an axicon surface and a spherical surface, and the exit surface is a plane; the focusing mirror is used for focusing the collimated point annular beam into a Bessel beam with a diffraction ring. The application can significantly improve the focal depth of the Bessel beam in laser processing, and can also effectively remove processing materials such as ink. In addition, the focal depth of the Bessel beam in the application is adjustable, and the adjustment mode is more, the flexibility is higher, and is suitable for different laser processing scenes.

The application relates to a large-diameter high-power pseudo-Bessel beam generation method and a generation device, and belongs to the technical field of communication. The method comprises the following steps: S100, an electromagnetic beam output by a feed horn is propagated to a first reflecting surface, and a target pseudo-Bessel beam is reversely propagated to a second reflecting surface; S200, the electromagnetic beam is propagated to the second reflecting surface through the first reflecting surface, a phase difference on the second reflecting surface is obtained, and a deformation variable of the second reflecting surface is updated; S300, the target pseudo-Bessel beam is propagated to the first reflecting surface through the second reflecting surface, a phase difference on the first reflecting surface is obtained, and a deformation variable of the first reflecting surface is updated; and S400, steps S100 to S300 are repeated until the relative field distribution of the output electromagnetic beam and the target pseudo-Bessel beam reaches a stable state, and a large-diameter high-power pseudo-Bessel beam is obtained. The application can solve the technical problems of existing media loss and limited power capacity.

This application relates to the field of electromagnetic waves, specifically providing a polarization state detection method and apparatus. The method utilizes a polarization state detection device for detection and includes: inputting the beam to be detected into the polarization state detection device to obtain orthogonal first and second Bessel beams; using a polarizer to obtain the azimuth angles corresponding to the interference weakening or enhancement regions in the interference patterns of the first and second Bessel beams, and determining the phase difference between the first and second Bessel beams based on the azimuth angles; using the polarizer to obtain the first amplitude of the first Bessel beam and the second amplitude of the second Bessel beam, respectively, and obtaining the amplitude ratio based on the first and second amplitudes; and calculating the polarization state of the wave to be detected based on the phase difference and amplitude ratio. This polarization state detection method simplifies the polarization state detection process for terahertz and millimeter waves, promoting the miniaturization and integration of detection equipment.

The utility model discloses a laser ablation detection device based on Bessel beams. The laser ablation detection device comprises a laser ablation module, a sample pool module and a mass spectrum detection module, the laser ablation module comprises a laser emitter, a Bessel beam generation module, a galvanometer module and a sample lens which are connected in sequence; the laser ablation module is in light path connection with the sample pool module; and the sample pool module is connected with the mass spectrum detection module through a gas circuit. According to the utility model, denudation laser forms a Bessel beam with transverse light intensity distribution consisting of a central light spot and a plurality of concentric circular ring side lobes through the Bessel beam generator, and the Bessel beam is focused on a sample after passing through the galvanometer module, so that a diameter smaller than that of a conventional light spot and a focal depth longer than that of the conventional light spot can be obtained; the denudation laser can obtain denudation with smaller and deeper taper on a very small scale, the number of samples obtained by the denudation system and the denudation consistency are improved, and the resolution ratio and the sensitivity are greatly improved.

The application discloses a method for generating an ultralong focal depth array beam, and belongs to the technical field of grating manufacturing. The method comprises the following steps: constructing a Bessel beam excitation phase and a circular Airy beam excitation phase, constructing a composite phase distribution according to the array Bessel beam excitation phase and the array circular Airy beam excitation phase, and encoding the composite phase distribution to a metasurface; irradiating the metasurface with a linear polarization state plane wave, so that a left-handed circular polarization component excites an array Bessel beam, and a right-handed circular polarization component excites an array circular Airy beam; the array circular Airy beam is converted into a Bessel propagation mode after self-focusing, is spliced with the array Bessel beam in an axial direction to form a continuous light field distribution, and an ultralong focal depth array beam is obtained. The method can be applied to the fields of parallel laser processing, three-dimensional microscopic imaging and microparticle manipulation, and can extend the focal depth of the array Bessel beam while keeping the transverse resolution close to the diffraction limit.